Patents by Inventor Sudhir Kumar Reddy KAMANI

Sudhir Kumar Reddy KAMANI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LOSS-DISSIPATION FLEXIBLE COPPER CLAD LAMINATE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE
    Publication number: 20220056213
    Abstract: The present disclosure provides a low-dissipation flexible copper clad laminate, which includes a copper foil and a polyimide film. The polyimide film is attached to the copper foil. The polyimide film includes a polyimide, and the polyimide has a structure represented by formula (I). Formula (I) is defined as in the specification.
    Type: Application
    Filed: August 17, 2021
    Publication date: February 24, 2022
    Inventors: Ching-Hsuan LIN, Wen-Chang CHEN, Wan-Ling HSIAO, Sudhir Kumar Reddy KAMANI