Patents by Inventor Sudhir Naik

Sudhir Naik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110097548
    Abstract: A multilayered formable packaging film and a method of manufacturing the film are disclosed. The film is suitable for making blisters either by thermoforming or cold forming. The visible surface of the film has unique features preventing counterfeiting, which features are retained on the film even after blister formation. The film has a thickness not exceeding 1050 microns. The film substrate has a 10-500 micron thickness, is devoid of plasticizer and comprises at least one polymeric resin. A coat of an ester acrylic based primer having a 0.1-1 micron thickness is on a first surface of the substrate. A metallized layer with non-uniform thickness between 0.001 to 0.3 micron is deposited on the coat and embossed. A base having a thickness of 50-1000 microns is on the second surface, the base comprising at least one polymeric resin.
    Type: Application
    Filed: December 19, 2008
    Publication date: April 28, 2011
    Inventors: Mohan Harakchand Bhandari, Praful Ramchandra Naik, Ajith Shashidharan, Sanjeev Kulkarni, Shrikant Bhagwat, Sudhir Naik, Anirudha Sant, Ganesh Gudsoorkar