Patents by Inventor Sudip M. Thomas

Sudip M. Thomas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and processes for measuring thickness values of semiconductor substrates
    Patent number: 10269758
    Abstract: A system for determining thickness variation values of a semiconductor substrate comprises a substrate vacuumed to a pedestal that defines a reference plane for measuring the substrate. A measurement probe assembly determines substrate CTV and BTV values, and defines a substrate slope angle. A thermal bonding assembly attaches a die to the substrate at a bonding angle congruent with the substrate slope angle. A plurality of substrates are measured using the same reference plane on the pedestal. Associated methods and processes are disclosed.
    Type: Grant
    Filed: December 27, 2016
    Date of Patent: April 23, 2019
    Assignee: Intel Corporation
    Inventors: Zhihua Zou, Sudip M. Thomas
  • SYSTEMS AND PROCESSES FOR MEASURING THICKNESS VALUES OF SEMICONDUCTOR SUBSTRATES
    Publication number: 20170186722
    Abstract: A system for determining thickness variation values of a semiconductor substrate comprises a substrate vacuumed to a pedestal that defines a reference plane for measuring the substrate. A measurement probe assembly determines substrate CTV and BTV values, and defines a substrate slope angle. A thermal bonding assembly attaches a die to the substrate at a bonding angle congruent with the substrate slope angle. A plurality of substrates are measured using the same reference plane on the pedestal. Associated methods and processes are disclosed.
    Type: Application
    Filed: December 27, 2016
    Publication date: June 29, 2017
    Applicant: Intel Corporation
    Inventors: Zhihua Zou, Sudip M. Thomas