Abstract: A new method is provided for the polishing of semiconductor surfaces such as the surface of a substrate, the surface of deposited copper and the surface of low-k layers of dielectric. The polishing method and apparatus of the invention comprise a new slurry delivery design whereby at least two different slurries can be independently controlled and mixed for delivery to a slurry container. The slurry container is in direct physical contact with a polishing pad, providing for the mixed slurry to be distributed over the surface of the polishing pad.

Abstract: An new horizontal reactor hardware contains a reactor tube with an insulation block and a flange with exhaust outlets. The insulation block provides high temperature control which reduces condensation and process by-product buildup within the reactor tube. A cylindrical flange, which is connected to the end of the reactor tube, provides exhaust outlets integral with and extending from the flange. The exhaust outlets isolate metal components from the process environment. The flange is held in place at the end of the reactor tube by a clamp. The clamp presses the flange against the end of the reactor tube to form a seal at the junction between the reactor tube and the flange.