Abstract: The present disclosure relates to a process gas supplying unit configured to uniformly supply a process gas to each region of a substrate when a substrate is treated using plasma, and a substrate treating apparatus including the same. According to the present disclosure, the effect of improving the treating efficiency of the substrate may be obtained by uniformly supplying the process gas.

Abstract: Disclosed is a microwave application unit for applying a microwave to generate plasma. The microwave application unit includes an antenna plate disposed on the support unit and having a plurality of slots; a power supply configured to apply a microwave to the antenna plate; a dielectric plate disposed above the antenna plate to face the antenna plate; an upper plate disposed above the dielectric plate; and a transmissive plate provided below the antenna plate and configured to transmit the microwave to the processing space, wherein an adjustment groove configured to adjust an electric field is formed on an lower surface of the upper plate.

Abstract: In one embodiment, a reservation control node monitors messages transferred between a client and a server to determine if the client is establishing a session with the server to stream data on a data stream between the server and the client. If the reservation control node detects that such a session is being established, the control node reserves resources for the data stream. The reservation control node continues to monitor messages between the client and the server that relate to the session. If the monitored messages indicate the session is being torn down, the reservation control node automatically tears down the reservation between the client and the server to free the reserved resources for other use.