Abstract: A thermoelectric element according to one embodiment of the present disclosure includes a first metal substrate including a first through-hole formed therein, a first insulating layer disposed on the first metal substrate and including a second through-hole formed at a position corresponding to the first through-hole, a first electrode part disposed on the first insulating layer and including a plurality of first electrodes, a semiconductor structure disposed on the first electrode part, a second electrode part disposed on the semiconductor structure and including a plurality of second electrodes, a second insulating layer disposed on the second electrode part, and a second metal substrate disposed on the second insulating layer, wherein the first metal substrate includes a first outer periphery, a second outer periphery, a third outer periphery, and a fourth outer periphery which define a shape of the first metal substrate, the first outer periphery and the fourth outer periphery are opposite to each other,

Abstract: Disclosed according to an embodiment is a thermoelectric module comprising: a first heat-conducting member including a first recess; a second heat-conducting member spaced apart from the first heat-conducting member; a thermoelectric element disposed between the first heat-conducting member and the second heat-conducting member; and a circuit unit electrically connected to the thermoelectric element to control resistance, wherein the circuit unit is disposed in the first recess.

Abstract: A thermoelectric module may comprise: a first metal support; a first heat conductive layer; a second heat conductive layer and formed from a resin composition; a plurality of first electrodes arranged on the second heat conductive layer; a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs alternately arranged on the plurality of first electrodes; a plurality of second electrodes arranged on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; a third heat conductive layer arranged on the plurality of second electrodes, and made from the same resin composition as the resin composition that forms the first heat conductive layer; and a second metal support arranged on the third heat conductive layer, wherein the second heat conductive layer is arranged to encompass an upper surface of the first heat conductive layer and a side surface of the first heat conductive layer.

Abstract: A thermoelectric module according to one embodiment of the present invention comprises: a first metal support; a first heat conductive layer arranged on the first metal support and formed from a resin composition including an epoxy resin and an inorganic filler; a second heat conductive layer arranged on the first heat conductive layer and formed from a resin composition including a silicon resin and an inorganic filler a plurality of first electrodes arranged on the second heat conductive layer a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs alternately arranged on the plurality of first electrodes; a plurality of second electrodes arranged on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; a third heat conductive layer arranged on the plurality of second electrodes, and made from the same resin composition as the resin composition that forms the first heat conductive layer; and a second metal support arranged on the third h

Abstract: Disclosed is a magnetic component. The magnetic component of the disclosure includes a core unit including an upper core and a lower core, a bobbin unit having at least a portion disposed inside the core unit, and a coil unit including primary coils and secondary coils wound around the bobbin unit in a second direction, which is perpendicular to a first direction oriented from the upper core toward the lower core. The bobbin unit includes a first terminal accommodation portion and a second terminal accommodation portion. The first terminal accommodation portion accommodates first terminal pins, connected to at least some of the secondary coils in the second direction and having end portions bent in the first direction. The second terminal accommodation portion accommodates second terminal pins, connected to the remaining ones of the secondary coils in the second direction and having end portions bent in the first direction.

Abstract: A thermoelectric element according to one embodiment of the present disclosure includes a first metal substrate including a first through-hole formed therein, a first insulating layer disposed on the first metal substrate and including a second through-hole formed at a position corresponding to the first through-hole, a first electrode part disposed on the first insulating layer and including a plurality of first electrodes, a semiconductor structure disposed on the first electrode part, a second electrode part disposed on the semiconductor structure and including a plurality of second electrodes, a second insulating layer disposed on the second electrode part, and a second metal substrate disposed on the second insulating layer, wherein the first metal substrate includes a first outer periphery, a second outer periphery, a third outer periphery, and a fourth outer periphery which define a shape of the first metal substrate, the first outer periphery and the fourth outer periphery are opposite to each other,

Abstract: A thermoelectric module according to one embodiment of the present invention comprises: a first metal support; a first heat conductive layer arranged on the first metal support and formed from a resin composition including an epoxy resin and an inorganic filler; a second heat conductive layer arranged on the first heat conductive layer and formed from a resin composition including a silicon resin and an inorganic filler a plurality of first electrodes arranged on the second heat conductive layer a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs alternately arranged on the plurality of first electrodes; a plurality of second electrodes arranged on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; a third heat conductive layer arranged on the plurality of second electrodes, and made from the same resin composition as the resin composition that forms the first heat conductive layer; and a second metal support arranged on the third h

Abstract: Disclosed is a thermoelectric material including a Sn-chalcogen-based compound, wherein the Sn is doped with a first dopant element comprising a transition metal element or a p-type metalloid element. Further, disclosed are thermoelectric module and thermoelectric apparatus, comprising the thermoelectric material.

Abstract: Disclosed is a thermoelectric material including a Sn-chalcogen-based compound, wherein the Sn is doped with a first dopant element comprising a transition metal element or a p-type metalloid element. Further, disclosed are thermoelectric module and thermoelectric apparatus, comprising the thermoelectric material.