Patents by Inventor Sue May Jessup

Sue May Jessup has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and design of an RF thru-via interconnect
    Patent number: 9024326
    Abstract: In summary, a vertical metalized transition in the form of a via goes from the back side of a high thermal conductivity substrate and through any semiconductor layers thereon to a patterned metalized strip, with the substrate having a patterned metalized layer on the back side that is provided with a keep away zone dimensioned to provide impedance matching for RF energy coupled through the substrate to the semiconductor device while at the same time permitting the heat generated by the semiconductor device to flow through the high thermal conductivity substrate, through the back side of the substrate and to a beat sink.
    Type: Grant
    Filed: July 18, 2012
    Date of Patent: May 5, 2015
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Robert Actis, Pane-chane Chao, Robert J. Lender, Jr., Kanin Chu, Bernard J. Schmanski, Sue May Jessup
  • METHOD AND DESIGN OF AN RF THRU-VIA INTERCONNECT
    Publication number: 20130341644
    Abstract: In summary, a vertical metalized transition in the form of a via goes from the back side of a high thermal conductivity substrate and through any semiconductor layers thereon to a patterned metalized strip, with the substrate having a patterned metalized layer on the back side that is provided with a keep away zone dimensioned to provide impedance matching for RF energy coupled through the substrate to the semiconductor device while at the same time permitting the heat generated by the semiconductor device to flow through the high thermal conductivity substrate, through the back side of the substrate and to a beat sink.
    Type: Application
    Filed: July 18, 2012
    Publication date: December 26, 2013
    Applicant: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Robert Actis, Pane-chane Chao, Bernard J. Schmanski, Anthony A. Immorlica, Kanin Chu, Robert J. Lender, JR., Dong Xu, Sue May Jessup