Patents by Inventor Suei-Shih Syu

Suei-Shih Syu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8780081
    Abstract: A touch panel includes a substrate, plural first coils, plural second coils, plural sensing pads, plural connection lines, and a control circuit. The first coils, the second coils, the sensing pads and the connection lines are configured on the substrate. Each first coil has a first connection portion and a first coil portion connected to the first connection portion and extending along a first direction. Each second coil has a second connection portion and a second coil portion connected to the second connection portion and extending along a second direction. Plural overlapping regions are defined by areas occupied by the first coil portions and the second coil portions on the substrate, and the sensing pads are located in the overlapping regions. The connection lines are respectively connected to the sending pads. The connection lines, the first connection portions and the second connection portions are connected to the control circuit.
    Type: Grant
    Filed: August 13, 2012
    Date of Patent: July 15, 2014
    Assignee: E Ink Holdings Inc.
    Inventors: Pei-Sheng Li, Suei-Shih Syu
  • Publication number: 20130155006
    Abstract: A touch panel includes a substrate, plural first coils, plural second coils, plural sensing pads, plural connection lines, and a control circuit. The first coils, the second coils, the sensing pads and the connection lines are configured on the substrate. Each first coil has a first connection portion and a first coil portion connected to the first connection portion and extending along a first direction. Each second coil has a second connection portion and a second coil portion connected to the second connection portion and extending along a second direction. Plural overlapping regions are defined by areas occupied by the first coil portions and the second coil portions on the substrate, and the sensing pads are located in the overlapping regions. The connection lines are respectively connected to the sending pads. The connection lines, the first connection portions and the second connection portions are connected to the control circuit.
    Type: Application
    Filed: August 13, 2012
    Publication date: June 20, 2013
    Applicant: E INK HOLDINGS INC.
    Inventors: Pei-Sheng Li, Suei-Shih Syu
  • Patent number: D676049
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: February 12, 2013
    Assignee: E Ink Holdings Inc.
    Inventors: Cheng-Hao Lee, Feng-Chuan Yeh, Yu-Ta Kang, Chin-Hao Meng, Yi-Ling Hou, Pei-Sheng Lee, Suei-Shih Syu