Patents by Inventor Sueji Chabata

Sueji Chabata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5106701
    Abstract: A copper alloy wire has a composition composed of no less than 0.01% by weight of Ag and balance Cu and unavoidable impurities. The copper alloy wire has been prepared by drawing a wire stock having the composition at a reduction ratio of no lower than 40% and subjecting the wire stock to heat treatment for half annealing to have a tensile strength of no lower than 27 kg.multidot.f/mm.sup.2 and an elongateion of 5%. An insulated elecric wire includes the copper alloy wire as a conductor and an insulation layer covering the wire. Also, a multiple core parallel bonded wire includes two or more such insulated electric wires bonded parallel to each other.
    Type: Grant
    Filed: January 25, 1991
    Date of Patent: April 21, 1992
    Assignee: Fujikura Ltd.
    Inventors: Akihito Kurosaka, Sueji Chabata, Haruo Tominaga, Kenichi Miyauchi, Michio Koike, Takashi Nishida, Hirohito Takemura, Toshihito Watanabe, Kazumichi Kasai, Takao Tsuboi
  • Patent number: 4960641
    Abstract: A stranded insulated wire and a method of producing the same. The stranded insulated wire is produced by applying a coating material containing polyvinyl butyral and a stabilized polyisocyanate to an enameled strands assembly and then by baking the assembly. The coating material contains about 1 to about 1000 parts by weight of the stabilized polyisocyanate per 100 parts by weight of the polyvinyl butyral.
    Type: Grant
    Filed: March 9, 1988
    Date of Patent: October 2, 1990
    Assignee: Fujikura Ltd.
    Inventors: Kazuo Hanaoka, Sueji Chabata, Michio Koike, Takao Tsuboi
  • Patent number: 4542064
    Abstract: The self-bonding enameled wire has an electric insulation layer coated thereon and a bonding layer coated over the insulation layer. The bonding layer is prepared with a mixture including: (a) 100 parts by weight of a phenoxy resin and/or an epoxy resin, both the resins containing not larger than 5 ppm of sodium chloride and having a limiting viscosity of not less than 0.440 as measured in tetrahydrofuran solvent at 25.degree. C.; and (b) 20 to 100 weight parts of a n-butylated melamine resin. In place of this n-butylated melamine resin, there is, according to another aspect of the present invention, used 20 to 50 parts by weight of a mixture of a stabilized polyisocyanate and one of a n-butylated melamine resin and a benzoguanamine resin is used. These self-bonding enameled wire are excellent in refrigerant resistance and may be suitably used for windings of a stator coil in hermetic compressor motors.
    Type: Grant
    Filed: February 23, 1984
    Date of Patent: September 17, 1985
    Assignees: Fujikura Ltd., Tokyo Shibaura Denki Kabushiki Kaisha
    Inventors: Sueji Chabata, Keiji Nakano, Kichizo Ito, Katsuhiko Ueda, Hirokazu Iizuka, Hisao Miyako, Katsumi Fukagawa