Patents by Inventor Sueji Sawada

Sueji Sawada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Binding machine using a tape and a binding tape
    Patent number: 5697747
    Abstract: A boring mechanism bores an aperture through a stack of papers and a binding mechanism inserts a bonding tape having adhesive on one side through the aperture and partially about the stack of papers.
    Type: Grant
    Filed: September 23, 1994
    Date of Patent: December 16, 1997
    Assignee: Picard Co.
    Inventors: Sueji Sawada, Masayuki Kasuya
  • Binding machine using a tape and a binding tape
    Patent number: 5679428
    Abstract: The binding machine (1) using the tape employs the binding tape (6) having the bonding tape (7) coated on its rear surface with the adhesive and consists of the boring mechanism (2) for boring the aperture (h) through the papers (P) to be bound and the binding mechanism (3) which winds the bonding tape (7) around or halfway around the portion between the bored aperture (h) and the end surface (p.sub.1) of the papers (P) and so on to be bound and bonds the bonding tape (7) thereto.
    Type: Grant
    Filed: September 8, 1995
    Date of Patent: October 21, 1997
    Assignee: Picard Co.
    Inventors: Sueji Sawada, Masayuki Kasuya