Patents by Inventor Sueng-Rok Lee

Sueng-Rok Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6313537
    Abstract: Provided is a semiconductor device having a multi-layered pad, including a first interlevel insulating layer formed on a semiconductor substrate; a first conductive pad formed on the first interlevel insulating layer, the first conductive pad extending lengthwise along a first edge on a first side of a pad window region; a second interlevel insulating layer formed on the first interlevel insulating layer having a first via hole exposing a defined region of the first conductive pad; a first conductive plug formed in the first via hole; a second conductive pad formed on the second interlevel insulating layer, the second conductive pad extending lengthwise along the first edge on the first side of the pad window region and being electrically coupled to the first conductive plug; a third interlevel insulating layer formed on the second interlevel insulating layer having a second via hole exposing a defined region of the second conductive pad; a second conductive plug formed in the second via hole; and a third con
    Type: Grant
    Filed: November 9, 1998
    Date of Patent: November 6, 2001
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sueng-Rok Lee, Myung-Sung Kim, Yunhee Lee, Manjun Kim