Abstract: A lead frame and a semiconductor device wherein a through hole is formed in the center of a semiconductor chip-mounting surface of a chip pad at the center of the lead frame, the through hole being tapered or being one which corresponds to a surface area that is greater on the surface of the chip-mounting surface of the chip pad than on the surface of the side opposite to the chip-mounting surface thereof. This prevents the occurrence of cracks in the sealing plastic portion in the step of reflow soldering of the lead frame to the substrate.

Abstract: An underframe construction for rolling stock vehicles comprising side sills disposed in parallel in the longitudinal direction of the underframe at the opposite outermost locations thereof, end sills connecting the side sills at the both ends in the longitudinal direction of the side sills, body bolsters arranged at positions at which a vertical load applied on the underframe is supported, center sills connecting each one of the end sills and each one of the body bolsters adjoining to one of the end sills, and a plurality of support members, each said support member being composed of upper horizontal flange, bottom plate and vertical web. The support members are disposed sequentially in the longitudinal direction of the underframe in such a fashion that the adjoining vertical webs of the support members are in contact to be bonded together and the both ends of the support members are secured to the side sills.

Abstract: A commutator apparatus for rotary electric machines comprises a plurality of commutator segments mounted side by side on a rotary shaft through an insulating ring along the periphery thereof, an armature winding wound on a rotor core and including a plurality of coil ends projected axially from the rotor core, and a plurality of risers made of a conductor, one end of each thereof being connected to one axial end of the corresponding commutator segments, the other end of the riser being securely connected to one end of the corresponding armature coil. Each pair of adjacent risers are bound by an insulating binder to reduce the space therebetween, thus forming a substantially delta-shaped space defined by the adjacent risers on each side of said binder. The vibrations of the risers are thus absorbed and the vibratory stress of the risers is reduced, thus improving the mechanical strength and reliability of the commutator apparatus.