Patents by Inventor Suet Woon

Suet Woon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ball grid array package with external leads
    Publication number: 20050077610
    Abstract: In some embodiments, a package suitable to contain one or more semiconductor dies includes one or more solder-balls at an underside of said package and one or more external leads at a side edge of said package. Any or all of the solder-balls and external leads may serve as external electrical terminations of the package. The external leads may be surface mount leads and/or through-hole leads. In some embodiments, a printed circuit board may include pads designed to be soldered to solder-balls of a package and pads designed to be soldered to external leads of the package.
    Type: Application
    Filed: October 8, 2003
    Publication date: April 14, 2005
    Inventors: Tzyy Tan, Suet Woon, Say Tan