Abstract: A plastic molding method for semiconductor devices, the method including placing semiconductor devices mounted on lead-frames between lower die cavities in a lower die chase block and upper die cavities in an upper die chase block and clamping the upper and lower die chase blocks together; evacuating an ejector chamber in the lower die chase block through a lower die common surface table, evacuating an ejector chamber in the upper die chase block through an upper die common surface table, and evacuating a parting chamber at a parting surface between the lower die chase block and the upper die chase block through one of the lower die common surface table and the upper die common surface table; and injecting a sealing resin into the upper die cavities and the lower die cavities to plastically package the semiconductor devices.

Abstract: A plastic molding apparatus for semiconductor devices includes a first evacuation passage via which an ejector chamber in a lower die chase block is evacuated through a lower die common surface table, a second evacuation passage via which an ejector chamber in the upper die chase block is evacuated through the upper die common surface table, and a third evacuation passage via which a parting chamber on a parting surface between the lower die chase block and the upper die chase block is evacuated through one of the lower die common surface table and the upper die common surface table. Since the evacuation passages are separate and the volume of the evacuation chamber is reduced, evacuation performance is improved and the size of the apparatus is reduced. The plastic packaging performance is also improved.

Abstract: A method and apparatus for sealing a semiconductor wherein an upper seal block of a cope and a lower seal block of a drag are provided with sealants for nipping a portion of a long size lead frame, so that the airtightness of a cavity enclosed with the cope and drag can be completely kept. The long size lead frame may have a continuing part extending from one of two side members to the other, provided between adjacent lead patterns to be pressed by the sealants, so that the airtightness of the cavity can be further completely kept.

Abstract: A resin sealing apparatus includes upper and lower dies each having a chase block with a plurality of cavities into which molten resin is injected and a supporting member for supporting the chase block, the chase blocks of the upper and lower dies being fitted to each other, and a position determining member attached to each of the chase blocks so that the positions of the chase blocks are determined when they are assembled, wherein each of the chase blocks is attached to each of the supporting members so as to be movable in the vertical and lateral directions within given ranges.

Abstract: An upper seal block of a cope and a lower seal block of a drag are provided with sealants for nipping a portion of a long size lead frame, so that of a cavity enclosed with the cope and drag can be completely kept airtight. The long size lead frame may have a continuing part extending from one of two side members to the other, provided between adjacent lead patterns to be pressed by the sealants, so that the cavity can be further completely kept airtight.

Abstract: A resin sealing apparatus includes upper and lower dies each having a chase block with a plurality of cavities into which molten resin is injected and a supporting member for supporting the chase block, the chase blocks of the upper and lower dies being fitted to each other, and a position determining member attached to a center block so that the positions of the chase blocks are determined when they are assembled, wherein each of the chase blocks is attached to each of the supporting members so as to be movable in the vertical and lateral directions within given ranges. The center block is provided on the supporting member and is disposed between two of the chase block with center plates interposed therebetween to form an integral unit.

Abstract: A mold for resin-sealing of a semiconductor device includes a molding board, a cavity retainer which is secured to the molding board forming a void facing the molding board, a plurality of cavity inserts, each of which is embedded in the cavity retainer so that the face thereof is exposed, each cavity insert having a cavity formed in the face, a plurality of ejecting pins arranged to travel freely and penetrating each cavity insert and the cavity retainer, one end of the ejecting pin protruding into the inside of the void of the cavity retainer, the other end of each ejecting pin protruding into the inside of the cavity of the cavity insert, an ejector plate to which one end of each ejecting pin is secured, the ejector plate being positioned in the void of the cavity retainer, and elastic pins which penetrate through the ejector plate to elastically support the cavity inserts on the molding board.

Abstract: A method of resin sealing semiconductor devices wherein semiconductor devices, such as semiconductor chips, are placed in cavities provided in a pair of chase blocks which are clamped by a press machine through support members capable of elastic compressive deformation. Plastic is then injected into the cavities of the chase blocks to resin seal the semiconductor devices.

Abstract: Apparatus for resin sealing semiconductor devices is disclosed, wherein semiconductor devices such as semiconductor chips are placed in cavities provided in a pair of chase blocks, which are clamped by a press machine through support members capable of elastic compressive deformation. Plastic is then injected into the cavities of the chase blocks such as to resin seal the semiconductor devices.Also disclosed is a device for resin sealing semiconductor devices, which device comprises: a pair of chase blocks equipped with cavities for holding semiconductor devices, a press machine for pressing the chase blocks against each other through a pair of press surfaces, a plurality of support members adapted to hold the chase blocks over the respective press surfaces of the press machine and to undergo elastic compressive deformation during the press operation of the press machine, and a plastic injector for injecting plastic into the cavities provided in the chase blocks.

Abstract: A device for resin sealing semiconductor devices includes a pair of chase blocks having cavities for holding semiconductor devices, a press machine for pressing the chase blocks against each other through a pair of press surfaces, a plurality of support members for holding the chase blocks over the respective press surfaces of the press machine and undergoing elastic compressive deformation during the press operation of the press machine, and a plastic injector for injecting plastic into the cavities in the chase blocks.