Patents by Inventor Suguru Akagawa

Suguru Akagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing a semiconductor substrate and method for manufacturing an electro-optical device with electroless plating
    Patent number: 7326639
    Abstract: A method is provided including, after joining a wiring substrate and an element substrate, separating a second substrate of the element substrate from a semiconductor element, and electrically coupling an element-side terminal that has been exposed by the separation to a wiring-side terminal disposed outside the semiconductor element by electroless plating.
    Type: Grant
    Filed: April 8, 2005
    Date of Patent: February 5, 2008
    Assignee: Seiko Epson Corporation
    Inventors: Suguru Akagawa, Tsuyoshi Yoda
  • Line head and image-forming apparatus
    Publication number: 20070025765
    Abstract: A line head includes: a first substrate having a plurality of organic electroluminescent devices; a bonding layer disposed on the first substrate and having optical transparency; a second substrate bonded to the first substrate with the bonding layer therebetween and having a reflective film that covers at least a part of the bonding layer; and a plurality of exit portions respectively from which light that has passed through the bonding layer is exited, the light emitted from the organic electroluminescent devices.
    Type: Application
    Filed: July 24, 2006
    Publication date: February 1, 2007
    Inventors: Suguru Akagawa, Shinichi Yotsuya
  • Film forming method, electronic device and electronic apparatus
    Publication number: 20060062978
    Abstract: A film forming method for forming a thin film pattern on a substrate, comprising a) forming the pattern of a metal base layer on the substrate by vapor-phase deposition with a mask; and b) forming a second metal film on the pattern of the metal base layer by plating the substrate.
    Type: Application
    Filed: August 11, 2005
    Publication date: March 23, 2006
    Inventors: Shinichi Yotsuya, Tsuyoshi Yoda, Suguru Akagawa
  • Method for manufacturing a semiconductor substrate and method for manufacturing an electro-optical device
    Publication number: 20050250306
    Abstract: A method is provided including, after joining a wiring substrate and an element substrate, separating a second substrate of the element substrate from a semiconductor element, and electrically coupling an element-side terminal that has been exposed by the separation to a wiring-side terminal disposed outside the semiconductor element by electroless plating.
    Type: Application
    Filed: April 8, 2005
    Publication date: November 10, 2005
    Inventors: Suguru Akagawa, Tsuyoshi Yoda
  • Method of manufacturing substrate joint body, substrate joint body and electrooptical device
    Publication number: 20050205992
    Abstract: A method of manufacturing a substrate joint body by mounting a TFT on a wiring substrate includes a step of arranging an electrode pad of the wiring substrate and an electrode pad of the TFT at a predetermined interval and mechanically coupling the wiring substrate and the TFT with a adhesive and a step of electrically coupling the wiring substrate and the TFT by growing a bump from the electrode pad of the wiring substrate and/or the electrode pad of the TFT.
    Type: Application
    Filed: March 7, 2005
    Publication date: September 22, 2005
    Inventors: Tsuyoshi Yoda, Suguru Akagawa