Abstract: There is disclosed a bonded element manufactured from a bonding material composition being capable of contributing to the lowering of thermal expansion of a bonding material layer sufficiently to relax any thermal stress generated in a honeycomb structure and largely inhibiting the cracking of the resultant honeycomb structure as well. In a bonded element in which two or more objects to be bonded are integrated via a bonding material layer, the bonding material layer having a Young's modulus of 20% or less of that of the objects to be bonded and having an average linear thermal expansion coefficient of 70% or less of that of the objects to be bonded, the bonding material layer being prepared from a bonding material composition composed mainly of fillers and a matrix in which fillers having an average linear thermal expansion coefficient of 2.0×10?6·K?1 or less are contained.

Abstract: A bonding material for a honeycomb structure comprises inorganic particles in which D90/D10 is from 10 to 500, D10 is 100 ?m or less and D90 is 4 ?m or more, and the D10 and D90 are the values of 10% diameter and 90% diameter from a smaller particle diameter side, respectively, in volume-based integrated fractions of a particle diameter distribution measurement by a laser diffraction/scattering method.

Abstract: There is provided a method for producing a honeycomb segment bonded article, the method inhibiting decrease in strength properties due to a variance in a texture of the bonding material layer between a plurality of honeycomb segments unitarily bonded together by means of the bonding material layer formed of the bonding material. After producing a preliminary block by unitarily bonding a plurality of honeycomb segments having a plurality of cells being partitioned by partition walls and passing through in the axial direction with a bonding material at a bonding face of each of the honeycomb segments and drying the honeycomb segments, the preliminary blocks are integrally bonded together, or honeycomb segments of one layer are bonded on an outer peripheral face of the preliminary block.

Abstract: There is disclosed a bonded element manufactured from a bonding material composition being capable of contributing to the lowering of thermal expansion of a bonding material layer sufficiently to relax any thermal stress generated in a honeycomb structure and largely inhibiting the cracking of the resultant honeycomb structure as well. In a bonded element in which two or more objects to be bonded are integrated via a bonding material layer, the bonding material layer having a Young's modulus of 20% or less of that of the objects to be bonded and having an average linear thermal expansion coefficient of 70% or less of that of the objects to be bonded, the bonding material layer being prepared from a bonding material composition composed mainly of fillers and a matrix in which fillers having an average linear thermal expansion coefficient of 2.0×10?6·K?1 or less are contained.

Abstract: There is provided a bonding material composition for obtaining a joined body by unitarily joining two or more members to be joined by means of a bonding material layer, wherein the bonding material composition contains flat particles, non-flat particles, smectite-based clay, and an inorganic adhesive as main components. The bonding material composition costs little, can relax thermal stress generated in the joined body without using fibers which may do harm to a human body, and can reduce defects such as a crack and a void upon drying or a thermal treatment.