Patents by Inventor Suguru Munakata

Suguru Munakata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230120427
    Abstract: A head chip, a liquid jet head, a liquid jet recording device, and a method of manufacturing a head chip each capable of ensuring the tolerance of the displacement between nozzle holes and communication holes while ensuring the bonding area between an actuator plate and an intermediate plate are provided. The head chip according to an aspect of the present disclosure includes an actuator plate, a nozzle plate disposed so as to be opposed to the actuator plate, and an intermediate plate disposed between the actuator plate and the nozzle plate. The communication holes each include a groove part having a lower-side opening part opening toward the nozzle hole, and a penetrating part having an upper-side opening part opening toward an ejection channel.
    Type: Application
    Filed: October 13, 2022
    Publication date: April 20, 2023
    Inventors: Tooru MINE, Suguru MUNAKATA
  • Patent number: 11548283
    Abstract: There are provided a method of manufacturing a head chip capable of suppressing the occurrence of the failure in the process of forming the actuator plate to thereby increase the yield ratio, and a method of manufacturing a liquid jet head using the above method of manufacturing a head chip. The method of manufacturing a head chip according to an embodiment of the present disclosure is a method of manufacturing a head chip having an actuator plate adapted to apply pressure to liquid so as to jet the liquid.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: January 10, 2023
    Assignee: SII PRINTEK INC.
    Inventors: Suguru Munakata, Yuji Nakamura, Yuzuru Kubota, Daiki Irokawa
  • Patent number: 11548284
    Abstract: Isolation between electrodes is ensured to enhance resistance to a liquid. A conductive film is provided to a surface of a piezoelectric substrate, and laser processing is performed in a groove extending direction on the conductive film between a first groove and a second groove provided to the piezoelectric substrate to thereby form a laser processing area where the conductive film is removed to the surface of the piezoelectric substrate between the first groove and the second groove. In forming the laser processing area, an irradiation operation with a laser is performed along a plurality of laser processing lines extending in the groove extending direction.
    Type: Grant
    Filed: December 16, 2020
    Date of Patent: January 10, 2023
    Assignee: SII PRINTEK INC.
    Inventors: Suguru Munakata, Daichi Nishikawa, Yuzuru Kubota, Yuki Yamamura, Yuji Nakamura
  • Publication number: 20210187950
    Abstract: Isolation between electrodes is ensured to enhance resistance to a liquid. A conductive film is provided to a surface of a piezoelectric substrate, and laser processing is performed in a groove extending direction on the conductive film between a first groove and a second groove provided to the piezoelectric substrate to thereby form a laser processing area where the conductive film is removed to the surface of the piezoelectric substrate between the first groove and the second groove. In forming the laser processing area, an irradiation operation with a laser is performed along a plurality of laser processing lines extending in the groove extending direction.
    Type: Application
    Filed: December 16, 2020
    Publication date: June 24, 2021
    Inventors: Suguru Munakata, Daichi Nishikawa, Yuzuru Kubota, Yuki Yamamura, Yuji Nakamura
  • Publication number: 20200147969
    Abstract: There are provided a method of manufacturing a head chip capable of suppressing the occurrence of the failure in the process of forming the actuator plate to thereby increase the yield ratio, and a method of manufacturing a liquid jet head using the above method of manufacturing a head chip. The method of manufacturing a head chip according to an embodiment of the present disclosure is a method of manufacturing a head chip having an actuator plate adapted to apply pressure to liquid so as to jet the liquid.
    Type: Application
    Filed: October 31, 2019
    Publication date: May 14, 2020
    Inventors: Suguru Munakata, Yuji Nakamura, Yuzuru Kubota, Daiki Irokawa