Patents by Inventor Suguru Warashina
Suguru Warashina has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8258891Abstract: An acoustic wave device includes a piezoelectric substrate, interdigital electrodes arranged on the piezoelectric substrate, a first dielectric element arranged between the interdigital electrodes, a second dielectric element that covers the interdigital electrodes and the first dielectric element, and an adjustment element that has been formed on the first dielectric element. The adjustment element has been formed from a material whose specific gravity is greater than that of the first dielectric element and that of the second dielectric element.Type: GrantFiled: October 29, 2009Date of Patent: September 4, 2012Assignee: Taiyo Yuden Co., Ltd.Inventors: Michio Miura, Suguru Warashina, Takashi Matsuda, Shogo Inoue, Kazunori Inoue, Satoru Matsuda
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Patent number: 8222972Abstract: An acoustic wave element includes: resonators 2 each including an electrode to excite acoustic waves; a power supply wiring portion 3 that is disposed so as to connect the resonators 2 electrically; a piezoelectric substrate 4 on which the resonators 2 and the power supply wiring portion 3 are formed; a second medium 5 that is formed on the piezoelectric substrate 4 so as to cover the resonators 2; and a third medium 6 that is formed on the piezoelectric substrate 4 so as to cover at least the second medium 5 and the power supply wiring portion 3. A side surface 34 of the power supply wiring portion 3 that is in contact with a surface of the piezoelectric substrate 4 forms an obtuse first angle ? with respect to the surface 4a of the piezoelectric substrate 4.Type: GrantFiled: February 24, 2010Date of Patent: July 17, 2012Assignee: Taiyo Yuden Co., Ltd.Inventors: Kazunori Inoue, Takashi Matsuda, Michio Miura, Suguru Warashina
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Patent number: 8085116Abstract: An elastic wave device is described which includes a piezoelectric substrate, comb-shaped electrodes having teeth electrodes that are disposed so as to face each other on the piezoelectric substrate, a non-overlapping area in which the teeth electrodes of the comb-shaped electrodes do not overlap each other, and a overlapping area in which the teeth electrodes overlap each other and the velocity of sound is higher than that in the non-overlapping area.Type: GrantFiled: March 20, 2009Date of Patent: December 27, 2011Assignee: Taiyo Yuden Co., Ltd.Inventors: Michio Miura, Suguru Warashina, Takashi Matsuda, Shogo Inoue, Kazunori Inoue, Satoru Matsuda
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Patent number: 7977848Abstract: An acoustic wave device of the present application includes a piezoelectric substrate (14), interdigital transducer electrodes (13) formed on the piezoelectric substrate (14), and an SiO2 film (12) formed so as to cover the electrodes (13). The acoustic wave device also includes a displacement adjustment film (11) formed on the SiO2 film (12), and the displacement adjustment film (11) is formed from a substance whose acoustic velocity is slower than that of the substance forming the SiO2 film (12). According to this configuration, it is possible to suppress unnecessary waves as well as improve temperature characteristics. Also, by mounting such an acoustic wave device in a communication module or communication apparatus, it is possible to achieve an improvement in reliability.Type: GrantFiled: February 24, 2010Date of Patent: July 12, 2011Assignee: Taiyo Yuden Co., Ltd.Inventors: Suguru Warashina, Takashi Matsuda, Shogo Inoue, Yoshio Satoh
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Publication number: 20100219906Abstract: An acoustic wave device includes a piezoelectric substrate, interdigital electrodes arranged on the piezoelectric substrate, a first dielectric element arranged between the interdigital electrodes, a second dielectric element that covers the interdigital electrodes and the first dielectric element, and an adjustment element that has been formed on the first dielectric element. The adjustment element has been formed from a material whose specific gravity is greater than that of the first dielectric element and that of the second dielectric element.Type: ApplicationFiled: October 29, 2009Publication date: September 2, 2010Applicant: FUJITSU LIMITEDInventors: Michio MIURA, Suguru Warashina, Takashi Matsuda, Shogo Inoue, Kazunori Inoue, Satoru Matsuda
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Publication number: 20100148626Abstract: An acoustic wave device of the present application includes a piezoelectric substrate (14), interdigital transducer electrodes (13) formed on the piezoelectric substrate (14), and an SiO2 film (12) formed so as to cover the electrodes (13). The acoustic wave device also includes a displacement adjustment film (11) formed on the SiO2 film (12), and the displacement adjustment film (11) is formed from a substance whose acoustic velocity is slower than that of the substance forming the SiO2 film (12). According to this configuration, it is possible to suppress unnecessary waves as well as improve temperature characteristics. Also, by mounting such an acoustic wave device in a communication module or communication apparatus, it is possible to achieve an improvement in reliability.Type: ApplicationFiled: February 24, 2010Publication date: June 17, 2010Applicant: FUJITSU LIMITEDInventors: Suguru Warashina, Takashi Matsuda, Shogo Inoue, Yoshio Satoh
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Publication number: 20100148890Abstract: An acoustic wave element includes: resonators 2 each including an electrode to excite acoustic waves; a power supply wiring portion 3 that is disposed so as to connect the resonators 2 electrically; a piezoelectric substrate 4 on which the resonators 2 and the power supply wiring portion 3 are formed; a second medium 5 that is formed on the piezoelectric substrate 4 so as to cover the resonators 2; and a third medium 6 that is formed on the piezoelectric substrate 4 so as to cover at least the second medium 5 and the power supply wiring portion 3. A side surface 34 of the power supply wiring portion 3 that is in contact with a surface of the piezoelectric substrate 4 forms an obtuse first angle ? with respect to the surface 4a of the piezoelectric substrate 4.Type: ApplicationFiled: February 24, 2010Publication date: June 17, 2010Applicant: FUJITSU LIMITEDInventors: Kazunori Inoue, Takashi Matsuda, Michio Miura, Suguru Warashina
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Publication number: 20090267707Abstract: An elastic wave device is described which includes a piezoelectric substrate, comb-shaped electrodes having teeth electrodes that are disposed so as to face each other on the piezoelectric substrate, a non-overlapping area in which the teeth electrodes of the comb-shaped electrodes do not overlap each other, and a overlapping area in which the teeth electrodes overlap each other and the velocity of sound is higher than that in the non-overlapping area.Type: ApplicationFiled: March 20, 2009Publication date: October 29, 2009Applicant: FUJITSU LIMITEDInventors: Michio Miura, Suguru Warashina, Takashi Matsuda, Shogo Inoue, Kazunori Inoue, Satoru Matsuda
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Publication number: 20090152982Abstract: An elastic wave device including a piezoelectric substrate, comb-like electrodes formed on the piezoelectric substrate, and a dielectric layer formed on the piezoelectric substrate. The dielectric layer formed on the piezoelectric substrate covers the comb-like electrodes and the thickness of the dielectric layer formed on the piezoelectric substrate is larger than the sum of the thickness of the comb-like electrodes and the thickness of the dielectric layer formed on the comb-like electrodes.Type: ApplicationFiled: December 16, 2008Publication date: June 18, 2009Applicant: FUJITSU LIMITEDInventors: Michio MIURA, Suguru Warashina, Takashi Matsuda
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Patent number: 7291904Abstract: A package substrate includes signal pads provided on a main surface of the package substrate, footpads provided on a backside of the package substrate, and a sealing electrode provided on the main surface to surround the signal pads, the signal pads being electrically coupled to the footpads, the sealing electrode being insulated from the footpads.Type: GrantFiled: April 27, 2005Date of Patent: November 6, 2007Assignees: Fujitsu Media Devices Limited, Fujitsu LimitedInventors: Takashi Matsuda, Suguru Warashina, Masanori Ueda, Osamu Kawachi, Yasufumi Kaneda
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Patent number: 7274129Abstract: A surface acoustic wave device includes, a first substrate, a surface acoustic wave chip attached to the first substrate, and a second substrate that hermetically seals the surface acoustic wave chip. At least one of the first and second substrates includes. The first and second substrates have respective joining surfaces. An electric circuit is formed on a surface area of the first substrate other than the joining surfaces.Type: GrantFiled: March 30, 2004Date of Patent: September 25, 2007Assignees: Fujitsu Media Devices Limited, Fujitsu LimitedInventors: Masanori Ueda, Osamu Kawachi, Michio Miura, Suguru Warashina
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Patent number: 7227429Abstract: A surface acoustic wave device includes a piezoelectric substrate having a first surface on which comb-like electrodes, first pads connected thereto, and a first film are provided. The first film is located so as to surround the comb-like electrodes. A base substrate has a second surface on which second pads joined to the first pads and a second film joined to the first film are provided. The first and second films joined by a surface activation process define a cavity in which the comb-like electrodes and the first and second pads are hermetically sealed.Type: GrantFiled: March 26, 2004Date of Patent: June 5, 2007Assignees: Fujitsu Media Devices Limited, Fujitsu LimitedInventors: Osamu Kawachi, Osamu Ikata, Masanori Ueda, Suguru Warashina
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Patent number: 7188525Abstract: An angular velocity sensor is provided that includes a frame, an oscillator and torsion bars that connect the oscillator to the frame. The frame, the oscillator and the torsion bar are formed integral with each other by etching a material substrate in the thickness direction of the substrate. The oscillator, configured in the form of an H, includes a support, two first arms and two second arms. These arms extend from the support in an arm-extending direction perpendicular to the thickness direction of the substrate. The oscillator includes a mounting surface that is provided with a piezoelectric driver for generating in-plane oscillation of the oscillator, and with a piezoelectric detector for detecting out-of-plane oscillation of the oscillator.Type: GrantFiled: April 22, 2002Date of Patent: March 13, 2007Assignees: Fujitsu Limited, Fujitsu Media Devices LimitedInventors: Atsushi Machida, Suguru Warashina, Hiroshi Ishikawa, Tsutomu Miyashita, Yoshio Satoh
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Publication number: 20050242420Abstract: A package substrate includes signal pads provided on a main surface of the package substrate, footpads provided on a backside of the package substrate, and a sealing electrode provided on the main surface to surround the signal pads, the signal pads being electrically coupled to the footpads, the sealing electrode being insulated from the footpads.Type: ApplicationFiled: April 27, 2005Publication date: November 3, 2005Inventors: Takashi Matsuda, Suguru Warashina, Masanori Ueda, Osamu Kawachi, Yasufumi Kaneda
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Publication number: 20050116352Abstract: An acoustic wave device includes a device substrate on which electrodes, first terminals, and a first metal seal layer located along an outer periphery are formed, a supporting substrate on which second terminals to be connected to the first terminals, and a second metal seal layer to be joined to the first metal seal layer are formed, and a conductive seal film provided on an outer surface of the device substrate, an outer surface of the first metal seal layer, and an outer surface of the second metal seal layer. The electrodes and the first and second terminals are hermetically sealed with the first and second metal seal layers and the seal film.Type: ApplicationFiled: November 12, 2004Publication date: June 2, 2005Inventors: Suguru Warashina, Takashi Matsuda, Masanori Ueda, Osamu Kawachi, Yasufumi Kaneda
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Publication number: 20040217670Abstract: A surface acoustic wave device includes, a first substrate, a surface acoustic wave chip attached to the first substrate, and a second substrate that hermetically seals the surface acoustic wave chip. At least one of the first and second substrates includes. The first and second substrates have respective joining surfaces. An electric circuit is formed on a surface area of the first substrate other than the joining surfaces.Type: ApplicationFiled: March 30, 2004Publication date: November 4, 2004Inventors: Masanori Ueda, Osamu Kawachi, Michio Miura, Suguru Warashina
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Publication number: 20040207485Abstract: A surface acoustic wave device includes a piezoelectric substrate having a first surface on which comb-like electrodes, first pads connected thereto, and a first film are provided. The first film is located so as to surround the comb-like electrodes. A base substrate has a second surface on which second pads joined to the first pads and a second film joined to the first film are provided. The first and second films joined by a surface activation process define a cavity in which the comb-like electrodes and the first and second pads are hermetically sealed.Type: ApplicationFiled: March 26, 2004Publication date: October 21, 2004Inventors: Osamu Kawachi, Osamu Ikata, Masanori Ueda, Suguru Warashina
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Publication number: 20040189146Abstract: A method of fabricating a surface acoustic wave device includes the steps of: joining a supporting substrate to a second surface of a piezoelectric substrate opposite to a first surface thereof; grinding and polishing the first surface of the piezoelectric substrate; grinding and polishing a third surface of the supporting substrate opposite to another surface thereof to which the second surface of the piezoelectric substrate is joined; and forming, on the first surface of the piezoelectric substrate, an on-chip pattern including comb-like electrodes and electrode pads.Type: ApplicationFiled: March 26, 2004Publication date: September 30, 2004Applicants: FUJITSU MEDIA DEVICES LIMITED, FUJITSU LIMITEDInventors: Masanori Ueda, Osamu Kawachi, Michio Miura, Suguru Warashina
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Publication number: 20030066350Abstract: An angular velocity sensor is provided that includes a frame, an oscillator and torsion bars that connect the oscillator to the frame. The frame, the oscillator and the torsion bar are formed integral with each other by etching a material substrate in the thickness direction of the substrate. The oscillator, configured in the form of an H, includes a support, two first arms and two second arms. These arms extend from the support in an arm-extending direction perpendicular to the thickness direction of the substrate. The oscillator includes a mounting surface that is provided with a piezoelectric driver for generating in-plane oscillation of the oscillator, and with a piezoelectric detector for detecting out-of-plane oscillation of the oscillator.Type: ApplicationFiled: April 22, 2002Publication date: April 10, 2003Applicant: Fujitsu LimitedInventors: Atsushi Machida, Suguru Warashina, Hiroshi Ishikawa, Tsutomu Miyashita, Yoshio Satoh
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Patent number: RE45419Abstract: A surface acoustic wave device includes a piezoelectric substrate having a first surface on which comb-like electrodes, first pads connected thereto, and a first film are provided. The first film is located so as to surround the comb-like electrodes. A base substrate has a second surface on which second pads joined to the first pads and a second film joined to the first film are provided. The first and second films joined by a surface activation process define a cavity in which the comb-like electrodes and the first and second pads are hermetically sealed.Type: GrantFiled: November 22, 2008Date of Patent: March 17, 2015Assignee: Taiyo Yuden Co., Ltd.Inventors: Osamu Kawachi, Osamu Ikata, Masanori Ueda, Suguru Warashina