Abstract: A method and apparatus for testing integrated circuits by connecting a plurality of leads (25) of a device (10) to a test board (50). The test fixture (32) includes a test plate (70) having a plurality of test points (74) corresponding to the leads (25) of the device (10) and an alignment plate (60). The test points (74) are electrically connected to the test board (50) by a series of runners (76) extending from the test points (74) on the test plate (70) to a series of bumped finger pads (72) on the test plate (70). The bumped finger pads (72) of the test plate (70) are electrically connected to a series of bumped finger pads (54) on an active side (52) of the test board (50). The test plate (70) is fabricated of flex material. The alignment plate (60) is fabricated of flex material and is mounted on top of the test plate (70), so that the alignment plate (60) covers the runners (76), electrically insulating the runners (76).