Patents by Inventor Suhail Rashid Jeremy

Suhail Rashid Jeremy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7821013
    Abstract: A silicon carbide semiconductor device includes: a semiconductor substrate including first and second gate layers, a channel layer, a source layer, and a trench; a gate wiring having a first portion and a plurality of second portions; and a source wiring having a third portion and a plurality of fourth portions. The trench extends in a predetermined extending direction. The first portion connects to the first gate layer in the trench, and extends to the extending direction. The second portions protrude perpendicularly to be a comb shape. The third portion extends to the extending direction. The fourth portions protrude perpendicularly to be a comb shape, and electrically connect to the source layer. Each of the second portions connects to the second gate layer through a contact hole.
    Type: Grant
    Filed: August 10, 2006
    Date of Patent: October 26, 2010
    Assignee: DENSO CORPORATION
    Inventors: Rajesh Kumar, Yuichi Takeuchi, Mitsuhiro Kataoka, Suhail Rashid Jeremy, Andrei Mihaila, Florin Udrea
  • Patent number: 7164154
    Abstract: A silicon carbide semiconductor device includes: a semiconductor substrate including first and second gate layers, a channel layer, a source layer, and a trench; a gate wiring having a first portion and a plurality of second portions; and a source wiring having a third portion and a plurality of fourth portions. The trench extends in a predetermined extending direction. The first portion connects to the first gate layer in the trench, and extends to the extending direction. The second portions protrude perpendicularly to be a comb shape. The third portion extends to the extending direction. The fourth portions protrude perpendicularly to be a comb shape, and electrically connect to the source layer. Each of the second portions connects to the second gate layer through a contact hole.
    Type: Grant
    Filed: November 24, 2004
    Date of Patent: January 16, 2007
    Assignee: Denso Corporation
    Inventors: Rajesh Kumar, Yuichi Takeuchi, Mitsuhiro Kataoka, Suhail Rashid Jeremy, Andrei Mihaila, Florin Udrea