Patents by Inventor Suhn-Ji Suh

Suhn-Ji Suh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5568175
    Abstract: A thermal print head, including a resistance substrate having a front and rear surface, a plurality of heating elements formed on the front surface of the resistance substrate for converting electrical energy into heat energy, a cooling board for dissipating heat generated from the heating elements and the resistance substrate, wherein the cooling board is divided into separable first and second parts, the first part being disposed opposite the rear surface of the resistance substrate and below the heating elements; and a cooling compound with high thermal conductivity inserted between the first part of the cooling board and the rear surface of the resistance substrate.
    Type: Grant
    Filed: November 6, 1995
    Date of Patent: October 22, 1996
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Suhn-Ji Suh, Hong-Geun Yang