Patents by Inventor Su-Hong Lin

Su-Hong Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor devices with composite etch stop layers and methods of fabrication thereof
    Patent number: 7250364
    Abstract: Semiconductor devices with composite etch stop layers and methods of fabrication thereof. An semiconductor device with a composite etch stop layer includes a substrate having a conductive member, a first etch stop layer on the substrate and the conductive member, a second etch stop layer and a dielectric layer sequentially over the second etch stop layer, having a conductive layer therein down through the dielectric layer, the second etch stop layer and the first etch stop layer to the conductive member.
    Type: Grant
    Filed: November 22, 2004
    Date of Patent: July 31, 2007
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yung-Cheng Lu, Tien-I Bao, Su-Hong Lin, Syun-Ming Jang
  • Semiconductor devices with composite etch stop layers and methods of fabrication thereof
    Publication number: 20060110912
    Abstract: Semiconductor devices with composite etch stop layers and methods of fabrication thereof. An semiconductor device with a composite etch stop layer includes a substrate having a conductive member, a first etch stop layer on the substrate and the conductive member, a second etch stop layer and a dielectric layer sequentially over the second etch stop layer, having a conductive layer therein down through the dielectric layer, the second etch stop layer and the first etch stop layer to the conductive member.
    Type: Application
    Filed: November 22, 2004
    Publication date: May 25, 2006
    Inventors: Yung-Cheng Lu, Tien-I Bao, Su-Hong Lin, Syun-Ming Jang