Patents by Inventor Suigen KANDA

Suigen KANDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Imprinting system, method of manufacturing semiconductor device, and recording medium
    Patent number: 10915018
    Abstract: An imprinting system according to an embodiment includes a first measuring device measuring an intensity of light reflected from an end of a shot area of a monitor substrate being an area on which imprinting has been performed, a dripping condition generating device generating a dripping condition of a resin-based mask material on the basis of the measured intensity of light, and an imprinting apparatus performing imprinting using the dripping condition. The imprinting apparatus includes a second measuring device measuring an intensity of light reflected from an end of a first shot area of a production substrate being an area on which imprinting has been performed, and a control unit adjusting arrangement of droplets of a resin-based mask material ejected on a second shot area of the production substrate being an area on which imprinting is to be performed on the basis of an intensity of light reflected from an end of the first shot area.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: February 9, 2021
    Assignee: Toshiba Memory Corporation
    Inventors: Takahito Nishimura, Yoshihisa Kawamura, Hironobu Tamura, Kiminori Yoshino, Suigen Kanda
  • Template, template component, and semiconductor device manufacturing method
    Patent number: 10879137
    Abstract: According to an embodiment, a template includes a flat plate-shaped first member, a flat plate-shaped second member including a pattern arrangement face, and a flat plate-shaped third member provided with an opening at a position corresponding to an arrangement position of the second member. The template is dividable at a position of at least one of a first boundary between the first member and the second member and a second boundary between the first member and the third member.
    Type: Grant
    Filed: February 21, 2018
    Date of Patent: December 29, 2020
    Assignee: Toshiba Memory Corporation
    Inventors: Takahito Nishimura, Suigen Kanda, Takamasa Usui, Masayoshi Tagami, Jun Iljima
  • IMPRINTING SYSTEM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM
    Publication number: 20190243236
    Abstract: An imprinting system according to an embodiment includes a first measuring device measuring an intensity of light reflected from an end of a shot area of a monitor substrate being an area on which imprinting has been performed, a dripping condition generating device generating a dripping condition of a resin-based mask material on the basis of the measured intensity of light, and an imprinting apparatus performing imprinting using the dripping condition. The imprinting apparatus includes a second measuring device measuring an intensity of light reflected from an end of a first shot area of a production substrate being an area on which imprinting has been performed, and a control unit adjusting arrangement of droplets of a resin-based mask material ejected on a second shot area of the production substrate being an area on which imprinting is to be performed on the basis of an intensity of light reflected from an end of the first shot area.
    Type: Application
    Filed: August 22, 2018
    Publication date: August 8, 2019
    Applicant: Toshiba Memory Corporation
    Inventors: Takahito NISHIMURA, Yoshihisa KAWAMURA, Hironobu TAMURA, Kiminori YOSHINO, Suigen KANDA
  • TEMPLATE, TEMPLATE COMPONENT, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
    Publication number: 20190074230
    Abstract: According to an embodiment, a template includes a flat plate-shaped first member, a flat plate-shaped second member including a pattern arrangement face, and a flat plate-shaped third member provided with an opening at a position corresponding to an arrangement position of the second member. The template is dividable at a position of at least one of a first boundary between the first member and the second member and a second boundary between the first member and the third member.
    Type: Application
    Filed: February 21, 2018
    Publication date: March 7, 2019
    Applicant: Toshiba Memory Corporation
    Inventors: Takahito NISHIMURA, Suigen KANDA, Takamasa USUI, Masayoshi TAGAMI, Jun llJIMA
  • Photomask and manufacturing method of semiconductor device
    Patent number: 10222692
    Abstract: A photomask according to the embodiment includes a glass substrate which has a first face and a second face located on a side opposite from the first face. The second face includes a transmission area and a light shielding area corresponding to an exposure pattern of a resist film exposed via the glass substrate. The transmission area is oblique to the first face.
    Type: Grant
    Filed: February 2, 2017
    Date of Patent: March 5, 2019
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Masaki Mae, Suigen Kanda
  • PHOTOMASK AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
    Publication number: 20180157159
    Abstract: A photomask according to the embodiment includes a glass substrate which has a first face and a second face located on a side opposite from the first face. The second face includes a transmission area and a light shielding area corresponding to an exposure pattern of a resist film exposed via the glass substrate. The transmission area is oblique to the first face.
    Type: Application
    Filed: February 2, 2017
    Publication date: June 7, 2018
    Applicant: Toshiba Memory Corporation
    Inventors: Masaki MAE, Suigen KANDA