Abstract: A method of a photolithography processing system includes illuminating a surface of a wafer supported by a table with first illumination tools and a second illumination tool by positioning the first illumination tools at varying lateral heights relative to the table to illuminate the surface of the wafer at various predetermined angles of incidence and positioning the second illumination tool to illuminate the surface of the wafer vertically from above the wafer on the table, taking pictures of the surface of the wafer with a camera while the surface of the wafer is being illuminated, receiving a signal from the camera in a controller, detecting a presence of particles on the surface of the wafer with the controller, and transporting the wafer to the process-performing or cleaning position according to whether particles are detected on the surface of the wafer.

Abstract: A photolithography processing system includes a table for supporting a wafer, a plurality of illumination tools for illuminating a surface of the wafer positioned on the table, including a plurality of first illumination tools positioned laterally at different heights to illuminate the surface of the wafer at various predetermined angles of incidence and a second illumination tool to illuminate the surface of the wafer vertically from above the wafer on the table, a camera for taking pictures of the surface of the wafer, and a controller for controlling operations of the robot, the plurality of illumination tools and the camera and for detecting the presence of impure matters on the surface of the wafer, the controller including an elevating unit to slide up or down the first illumination tools and a luminous intensity unit to control luminous intensity.

Abstract: The present invention relates to a photolithography processing system and a method thereof that is able to detect the presence of impure matters remaining on the surface of a wafer in the process of forming a pattern mask and then determine a subsequent processing step of the wafer with reference to the result of the detection. The photolithography processing system includes: a table positioned near a loader where a carrier is positioned for supporting a wafer that is being transported by a robot; a plurality of illumination tools positioned for illuminating the surface of the wafer positioned on the table; a camera for taking pictures of the surface of the wafer; and a controller for controlling operations of the robot, the illumination tools and for detecting the presence of impure matters on the surface of the wafer.

Abstract: The present invention relates to a photolithography processing system and a method thereof that is able to detect the presence of impure matters remaining on the surface of a wafer in the process of forming a pattern mask and then determine a subsequent processing step of the wafer with reference to the result of the detection. The photolithography processing system includes: a table positioned near a loader where a carrier is positioned for supporting a wafer that is being transported by a robot; a plurality of illumination tools positioned for illuminating the surface of the wafer positioned on the table; a camera for taking pictures of the surface of the wafer; and a controller for controlling operations of the robot, the illumination tools and for detecting the presence of impure matters on the surface of the wafer.