Patents by Inventor Suining HU

Suining HU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrical connector, mobile terminal, and electrical connector manufacturing method
    Patent number: 11626702
    Abstract: Embodiments of this application disclose an electrical connector, including at least one first conductive terminal and at least one second conductive terminal, where a first electroplated layer is disposed on an outer surface of the first conductive terminal, a second electroplated layer is disposed on an outer surface of the second conductive terminal, and a material of the second electroplated layer is different from a material of the first electroplated layer. Electroplating costs of the electrical connector are reduced while corrosion resistance of the electrical connector is ensured. The embodiments of this application further disclose a mobile terminal and an electrical connector manufacturing method.
    Type: Grant
    Filed: July 21, 2021
    Date of Patent: April 11, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Suining Hu, Tien Chieh Su, Shihao Zhang, Gaobing Lei
  • ELECTRICAL CONNECTOR, MOBILE TERMINAL, AND ELECTRICAL CONNECTOR MANUFACTURING METHOD
    Publication number: 20220013972
    Abstract: Embodiments of this application disclose an electrical connector, including at least one first conductive terminal and at least one second conductive terminal, where a first electroplated layer is disposed on an outer surface of the first conductive terminal, a second electroplated layer is disposed on an outer surface of the second conductive terminal, and a material of the second electroplated layer is different from a material of the first electroplated layer. Electroplating costs of the electrical connector are reduced while corrosion resistance of the electrical connector is ensured. The embodiments of this application further disclose a mobile terminal and an electrical connector manufacturing method.
    Type: Application
    Filed: July 21, 2021
    Publication date: January 13, 2022
    Inventors: Suining HU, Tien Chieh SU, Shihao ZHANG, Gaobing LEI
  • Electrical connector, mobile terminal, and electrical connector manufacturing method
    Patent number: 11128074
    Abstract: An electrical connector, a mobile terminal, and an electrical connector manufacturing method therefor, the electrical connector including at least one first conductive terminal and at least one second conductive terminal, where a first electroplated layer is disposed on an outer surface of the first conductive terminal, a second electroplated layer is disposed on an outer surface of the second conductive terminal, and a material of the second electroplated layer is different from a material of the first electroplated layer. Electroplating costs of the electrical connector are reduced while corrosion resistance of the electrical connector is ensured.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: September 21, 2021
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Suining Hu, Tien Chieh Su, Shihao Zhang, Gaobing Lei
  • ELECTRICAL CONNECTOR, MOBILE TERMINAL, AND ELECTRICAL CONNECTOR MANUFACTURING METHOD
    Publication number: 20200235509
    Abstract: An electrical connector, a mobile terminal, and an electrical connector manufacturing method therefor, the electrical connector including at least one first conductive terminal and at least one second conductive terminal, where a first electroplated layer is disposed on an outer surface of the first conductive terminal, a second electroplated layer is disposed on an outer surface of the second conductive terminal, and a material of the second electroplated layer is different from a material of the first electroplated layer. Electroplating costs of the electrical connector are reduced while corrosion resistance of the electrical connector is ensured.
    Type: Application
    Filed: September 20, 2017
    Publication date: July 23, 2020
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Suining HU, Tien Chieh SU, Shihao ZHANG, Gaobing LEI