Patents by Inventor Suk-Chae Kang
Suk-Chae Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7534656Abstract: An image sensor device including a protective plate may be manufactured from an image sensor chip having an active surface and a back surface opposite to the active surface. The image sensor chip may include chip pads formed in a peripheral region of the active surface, a microlens formed in a central region of the active surface and an intermediate region between the peripheral and central regions. A protective plate may be attached to the intermediate region of the active surface of the image sensor chip using an adhesive pattern that is sized and configured to maintain a separation distance between the protective plate and the microlens formed on the image sensor chip. Conductive plugs, formed before, during or after the manufacture of the image sensor chip circuitry may provide electrical connection between the chip pads and external connectors.Type: GrantFiled: July 23, 2007Date of Patent: May 19, 2009Assignee: Samsung Electronics Co., LtdInventors: Yong-Chai Kwon, Kang-Wook Lee, Gu-Sung Kim, Seong-Il Han, Keum-Hee Ma, Suk-Chae Kang, Dong-Hyeon Jang
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Patent number: 7375426Abstract: A semiconductor package includes a semiconductor chip, a circuit board at which a wire pattern is formed, and a metal structure including a portion inserted through an opening of the circuit board and upon which the semiconductor chip rests. With the semiconductor chip in direct contact with the metal structure, thermal characteristics improve. With the circuit board supported by the metal structure, mechanical stability improves.Type: GrantFiled: June 30, 2005Date of Patent: May 20, 2008Assignee: Samsung Electronics Co., Ltd.Inventors: Suk-Chae Kang, Si-Hoon Lee, Sa-Yoon Kang, Dong-Han Kim, Yun-Hyeok Im, Gu-Sung Kim
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Patent number: 7371614Abstract: An image sensor device and methods thereof. In an example method, a protective layer may be formed over at least one microlens. An adhesive layer may be formed over the protective layer. The adhesive layer may be removed so as to expose the protective layer. The protective layer may be removed so as to expose the at least one microlens, the exposed at least one microlens not including residue from the adhesive layer. The at least one microlens may have an improved functionality due at least in part to the lack of residue from the adhesive layer. In an example, the at least one microlens may be included in an image sensor module.Type: GrantFiled: January 31, 2006Date of Patent: May 13, 2008Assignee: Samsung Electronics Co., Ltd.Inventors: Yong-Chai Kwon, Suk-Chae Kang, Kang-Wook Lee, Gu-Sung Kim, Jong-Woo Kim, Seong-Il Han, Sun-Wook Heo, Jung-Hang Yi, Keum-Hee Ma
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Patent number: 7309916Abstract: A semiconductor package includes a metal plate in which one or more openings are formed, the metal plate mounting a semiconductor chip and a printed wire pattern substrate, e.g. a PCB, mounting one or more decoupling capacitors. The semiconductor chip is in direct contact with the metal plate to improve thermal characteristics, and the substrate is supported by the metal plate to increase mechanical stability of the package. The one or more openings in the metal plate accommodate the passing therethrough of plural pins electrically connected via the printed wire pattern substrate to the semiconductor chip. The semiconductor package can be usefully applied to a digital micro-mirror device (DMD) semiconductor package for use in a projection display device.Type: GrantFiled: June 30, 2005Date of Patent: December 18, 2007Assignee: Samsung Electronics Co., Ltd.Inventors: Suk-Chae Kang, Sa-Yoon Kang, Dong-Han Kim, Si-Hoon Lee
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Publication number: 20070264745Abstract: An image sensor device including a protective plate may be manufactured from an image sensor chip having an active surface and a back surface opposite to the active surface. The image sensor chip may include chip pads formed in a peripheral region of the active surface, a microlens formed in a central region of the active surface and an intermediate region between the peripheral and central regions. A protective plate may be attached to the intermediate region of the active surface of the image sensor chip using an adhesive pattern that is sized and configured to maintain a separation distance between the protective plate and the microlens formed on the image sensor chip. Conductive plugs, formed before, during or after the manufacture of the image sensor chip circuitry may provide electrical connection between the chip pads and external connectors.Type: ApplicationFiled: July 23, 2007Publication date: November 15, 2007Inventors: Yong-Chai Kwon, Kang-Wook Lee, Gu-Sung Kim, Seong-Il Han, Keum-Hee Ma, Suk-Chae Kang, Dong-Hyeon Jang
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Patent number: 7262475Abstract: An image sensor device including a protective plate may be manufactured from an image sensor chip having an active surface and a back surface opposite to the active surface. The image sensor chip may include chip pads formed in a peripheral region of the active surface, a microlens formed in a central region of the active surface and an intermediate region between the peripheral and central regions. A protective plate may be attached to the intermediate region of the active surface of the image sensor chip using an adhesive pattern that is sized and configured to maintain a separation distance between the protective plate and the microlens formed on the image sensor chip. Conductive plugs, formed before, during or after the manufacture of the image sensor chip circuitry may provide electrical connection between the chip pads and external connectors.Type: GrantFiled: July 11, 2005Date of Patent: August 28, 2007Assignee: Samsung Electronics Co., Ltd.Inventors: Yong-Chai Kwon, Kang-Wook Lee, Gu-Sung Kim, Seong-Il Han, Keum-Hee Ma, Suk-Chae Kang, Dong-Hyeon Jang
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Publication number: 20070019089Abstract: An image sensor device and methods thereof. In an example method, a protective layer may be formed over at least one microlens. An adhesive layer may be formed over the protective layer. The adhesive layer may be removed so as to expose the protective layer. The protective layer may be removed so as to expose the at least one microlens, the exposed at least one microlens not including residue from the adhesive layer. The at least one microlens may have an improved functionality due at least in part to the lack of residue from the adhesive layer. In an example, the at least one microlens may be included in an image sensor module.Type: ApplicationFiled: January 31, 2006Publication date: January 25, 2007Inventors: Yong-Chai Kwon, Suk-Chae Kang, Kang-Wook Lee, Gu-Sung Kim, Jong-Woo Kim, Seong-II Han, Sun-Wook Heo, Jung-Hang Yi, Keum-Hee Ma
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Publication number: 20070010041Abstract: Example embodiments of the present invention relate to a method of manufacturing an optical device having a transparent cover and a method of manufacturing an optical device module using the optical device. According to an example method of manufacturing the optical device, a semiconductor substrate having a plurality of dies including an effective pixel and a plurality of bonding pads arranged around the effective pixel is prepared. A protective layer may be formed on the semiconductor substrate to selectively cover the effective pixel. An adhesive pattern may be formed to enclose an edge of the effective pixel, and a transparent cover may be attached to correspond to the effective pixel using the adhesive pattern.Type: ApplicationFiled: July 10, 2006Publication date: January 11, 2007Inventors: Suk-Chae Kang, Yong Kwon, Yong-Hwan Kwon, Gu-Sung Kim, Sun-Wook Heo
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Publication number: 20060151847Abstract: An image sensor device including a protective plate may be manufactured from an image sensor chip having an active surface and a back surface opposite to the active surface. The image sensor chip may include chip pads formed in a peripheral region of the active surface, a microlens formed in a central region of the active surface and an intermediate region between the peripheral and central regions. A protective plate may be attached to the intermediate region of the active surface of the image sensor chip using an adhesive pattern that is sized and configured to maintain a separation distance between the protective plate and the microlens formed on the image sensor chip. Conductive plugs, formed before, during or after the manufacture of the image sensor chip circuitry may provide electrical connection between the chip pads and external connectors.Type: ApplicationFiled: July 11, 2005Publication date: July 13, 2006Inventors: Yong-Chai Kwon, Kang-Wook Lee, Gu-Sung Kim, Seong-Il Han, Keum-Hee Ma, Suk-Chae Kang, Dong-Hyeon Jang
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Publication number: 20060075760Abstract: An embodiment relates to a temperature measuring device using a matrix switch, and a semiconductor package. In another embodiment a cooling system may be included. A plurality of temperature sensors may be arranged on a surface of a semiconductor device. The matrix switch may select the temperature sensors by an address method to form a circuit that includes the selected temperature sensor. A measuring unit may receive an output signal of the selected temperature sensor to calculate the temperature at the selected temperature sensor.Type: ApplicationFiled: August 31, 2005Publication date: April 13, 2006Inventors: Yun-Hyeok Im, Suk-Chae Kang, Hee-Seok Lee
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Publication number: 20060012019Abstract: A semiconductor package includes a semiconductor chip, a circuit board at which a wire pattern is formed, and a metal structure including a portion inserted through an opening of the circuit board and upon which the semiconductor chip rests. With the semiconductor chip in direct contact with the metal structure, thermal characteristics improve. With the circuit board supported by the metal structure, mechanical stability improves.Type: ApplicationFiled: June 30, 2005Publication date: January 19, 2006Applicant: Samsung Electronics Co., Ltd.Inventors: Suk-Chae Kang, Si-Hoon Lee, Sa-Yoon Kang, Dong-Han Kim, Yun-Hyeok Im, Gu-Sung Kim
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Publication number: 20060012026Abstract: A semiconductor package includes a metal plate in which one or more openings are formed, the metal plate mounting a semiconductor chip and a printed wire pattern substrate, e.g. a PCB, mounting one or more decoupling capacitors. The semiconductor chip is in direct contact with the metal plate to improve thermal characteristics, and the substrate is supported by the metal plate to increase mechanical stability of the package. The one or more openings in the metal plate accommodate the passing therethrough of plural pins electrically connected via the printed wire pattern substrate to the semiconductor chip. The semiconductor package can be usefully applied to a digital micro-mirror device (DMD) semiconductor package for use in a projection display device.Type: ApplicationFiled: June 30, 2005Publication date: January 19, 2006Inventors: Suk-Chae Kang, Sa-Yoon Kang, Dong-Han Kim, Si-Hoon Lee