Abstract: A semiconductor package includes a semiconductor chip; a connection member having a first surface on which the semiconductor chip is disposed and a second surface opposing the first surface, an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip, a passivation layer on the second surface of the connection member; and an UBM layer partially embedded in the passivation layer, wherein the UBM layer includes an UBM via embedded in the passivation layer and connected to the redistribution layer of the connection member and an UBM pad connected to the UBM via and protruding from a surface of the passivation layer, and a width of a portion of the UBM via in contact with the UBM pad is narrower than a width of a portion of the UBM via in contact with the redistribution layer.

Abstract: Provided is a display device including a display panel, a power delivery network (PDN), an image controller, and a PDN controller. The display panel may include a plurality of sub-panels. The PDN may be controlled by a control signal, respectively deliver voltages determined by the control signal to the plurality of sub-panels, and generate state information for determining the control signal. The image controller may receive to store frame image data, determine a number of frames to be integrated according to a window size, and integrate the frame image data of frames in the determined number into one image to generate integrated image data. The PDN controller may generate the control signal and a size adjusting signal based on the state information and the integrated image data, provide the generated control signal to the PDN, and may provide the generated size adjusting signal to the image controller. The size adjusting signal may adjust the window size.

Abstract: A semiconductor package includes a frame having a first through-hole, a semiconductor chip disposed on the first through-hole an having an active surface on which a connection pad is disposed and an inactive surface, a first encapsulant covering at least a portion of the inactive surface and a side surface of the semiconductor chip, a connection structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad of the semiconductor chip and a ground pattern layer, a side surface cover layer covering at least an outer side surface of the frame, and a metal layer disposed on the upper surface of the first encapsulant and extending downwardly along the side surface cover layer to cover the side surface cover layer and a portion of the side surface of the connection structure.

Abstract: A semiconductor package includes a semiconductor chip; a connection member having a first surface on which the semiconductor chip is disposed and a second surface opposing the first surface, an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip, a passivation layer on the second surface of the connection member; and an UBM layer partially embedded in the passivation layer, wherein the UBM layer includes an UBM via embedded in the passivation layer and connected to the redistribution layer of the connection member and an UBM pad connected to the UBM via and protruding from a surface of the passivation layer, and a width of a portion of the UBM via in contact with the UBM pad is narrower than a width of a portion of the UBM via in contact with the redistribution layer.

Abstract: Provided is a display device including a display panel, a power delivery network (PDN), an image controller, and a PDN controller. The display panel may include a plurality of sub-panels. The PDN may be controlled by a control signal, respectively deliver voltages determined by the control signal to the plurality of sub-panels, and generate state information for determining the control signal. The image controller may receive to store frame image data, determine a number of frames to be integrated according to a window size, and integrate the frame image data of frames in the determined number into one image to generate integrated image data. The PDN controller may generate the control signal and a size adjusting signal based on the state information and the integrated image data, provide the generated control signal to the PDN, and may provide the generated size adjusting signal to the image controller. The size adjusting signal may adjust the window size.

Abstract: A semiconductor package includes a frame having a first through-hole, a semiconductor chip disposed on the first through-hole an having an active surface on which a connection pad is disposed and an inactive surface, a first encapsulant covering at least a portion of the inactive surface and a side surface of the semiconductor chip, a connection structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad of the semiconductor chip and a ground pattern layer, a side surface cover layer covering at least an outer side surface of the frame, and a metal layer disposed on the upper surface of the first encapsulant and extending downwardly along the side surface cover layer to cover the side surface cover layer and a portion of the side surface of the connection structure.

Abstract: A semiconductor package includes a frame having a first through-hole, a semiconductor chip disposed on the first through-hole an having an active surface on which a connection pad is disposed and an inactive surface, a first encapsulant covering at least a portion of the inactive surface and a side surface of the semiconductor chip, a connection structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad of the semiconductor chip and a ground pattern layer, a side surface cover layer covering at least an outer side surface of the frame, and a metal layer disposed on the upper surface of the first encapsulant and extending downwardly along the side surface cover layer to cover the side surface cover layer and a portion of the side surface of the connection structure.

Abstract: Disclosed herein is an air conditioner and control method of determining duration to be maintained at a reference temperature of a mode change based on an outdoor temperature. The air conditioner includes a compressor, an outdoor heat exchanger, an indoor heat exchanger, a four-way valve configured to guide refrigerant compressed in the compressor to either the outdoor heat exchanger or the indoor heat exchanger according to a cooling mode or a heating mode, and a controller configured to determine duration corresponding to a measured outdoor temperature, change the heating mode to the cooling mode when the measured indoor temperature is maintained at a first reference indoor temperature or greater for the determined duration, and change the cooling mode to the heating mode when a measured indoor temperature is maintained at a second reference indoor temperature or less for the determined duration.

Abstract: A heat pump performs a simultaneous air-conditioning and heating operation through the addition of a flow path switching apparatus. The heat pump may include a plurality of outdoor units, a plurality of indoor units, and a plurality of flow path switching apparatuses that switch a flow path between an outdoor unit and an indoor unit. A refrigerant flow path may be formed from the outdoor unit to the indoor unit via a high-pressure gas pipe. The flow path switching apparatuses may switch a flow path so that a refrigerant flow path is formed from the indoor unit to the outdoor unit via a low-pressure gas pipe. The heat pump may further include an indoor unit mode controller that is connected to the plurality of outdoor units through a liquid pipe, and which is connected to each of the plurality of flow path switching apparatuses.

Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers, and connection via layers, and having a recess portion and a stopper layer disposed on a bottom surface of the recess portion; a semiconductor chip having connection pads and disposed in the recess portion so that an inactive surface is connected to the stopper layer; an encapsulant covering at least portions of the semiconductor chip and filling at least portions of the recess portion; and a connection member disposed on the frame and an active surface of the semiconductor chip and including a redistribution layer electrically connecting the wiring layers and the connection pads to each other. The connection pads of the semiconductor chip are electrically connected to the redistribution layer of the connection member through wire posts disposed on the connection pads of the semiconductor chip.

Abstract: A semiconductor package includes a semiconductor chip; a connection member having a first surface on which the semiconductor chip is disposed and a second surface opposing the first surface, an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip, a passivation layer on the second surface of the connection member; and an UBM layer partially embedded in the passivation layer, wherein the UBM layer includes an UBM via embedded in the passivation layer and connected to the redistribution layer of the connection member and an UBM pad connected to the UBM via and protruding from a surface of the passivation layer, and a width of a portion of the UBM via in contact with the UBM pad is narrower than a width of a portion of the UBM via in contact with the redistribution layer.

Abstract: A method of manufacture comprises a mask process correction (MPC) and verifying MPC accuracy. MPC may be performed on mask tape-out (MTO) data describing a mask pattern to obtain mask process corrected data. MPC may be performed to address a deviation between the MTO data and a mask to be manufactured. Verification of the MPC may be performed by generating a two-dimensional (2D) contour of mask pattern elements based on the mask process corrected data. When MPC has been verified, the mask process corrected data may be used to manufacture a mask and a semiconductor device.

Abstract: Provided is a display device including a display panel, a power delivery network (PDN), an image controller, and a PDN controller. The display panel may include a plurality of sub-panels. The PDN may be controlled by a control signal, respectively deliver voltages determined by the control signal to the plurality of sub-panels, and generate state information for determining the control signal. The image controller may receive to store frame image data, determine a number of frames to be integrated according to a window size, and integrate the frame image data of frames in the determined number into one image to generate integrated image data. The PDN controller may generate the control signal and a size adjusting signal based on the state information and the integrated image data, provide the generated control signal to the PDN, and may provide the generated size adjusting signal to the image controller. The size adjusting signal may adjust the window size.

Abstract: An apparatus for detecting an oil level and a method for controlling the same, an apparatus for detecting oil flow and a method for controlling the same, and a method for controlling oil return using the detected oil level and the detected oil flow are disclosed. The level of oil stored in a compressor is measured at two or more positions. The frequency comparison scheme using two electrodes can correctly detect the level of oil stored in the compressor, a refrigerant state, and the level of mixed oils, and can determine an internal state of the compressor and a normal or abnormal state of the oil return system, such that the oil return control can be actively controlled. The flow of oil in the oil return pipe is detected so as to determine whether the oil is normally supplied in real time, such that a malfunction of the compressor is prevented and a valve state can be checked.

Abstract: Disclosed herein are an air conditioner, a control device thereof, and a method of controlling the same. The air conditioner includes a control device including a plurality of indoor unit operation changers, and an indoor unit connected to any one of the plurality of indoor unit operation changers, wherein at least one of the indoor unit and the control device determines an operation mode of each of the plurality of indoor unit operation changers respectively connected to a plurality of indoor units, detects an indoor unit operation changer at an operation mode corresponding to an operation of any one of the plurality of indoor units among the plurality of indoor unit operation changers, and determines an indoor unit operation changer connected to the indoor unit among the plurality of indoor unit operation changers on based on a result of detecting at least one of the indoor unit operation changers.

Abstract: The present invention relates to a novel crystalline form of 5-chloro-N-({(5S)-2-oxo-3-[4-(5,6-dihydro-4H-[1,2,4]triazin-1-yl)phenyl]-1,3-oxazolidin-5-yl}methyl)thiophene-2-carboxamide methanesulfonate and a pharmaceutical composition containing the same. The novel crystalline form of a compound according to the present invention exhibits excellent stability even in high-temperature and humidity environments, and thus can be favorably used to prevent or treat diseases, such as thrombosis, myocardial infarction, atherosclerosis, inflammation, stroke, angina pectoris, restenosis after angioplasty, and thromboembolism.

Abstract: An air conditioner, having an outdoor unit and an indoor unit, to perform a heating operation and a defrosting operation, the air conditioner including a detection unit to detect a state of at least one selected between the outdoor unit and the indoor unit and to output the detected value, a controller to determine whether the air conditioner is in a stable state when the defrosting operation is completed and, upon determining that the air conditioner is in the stable state, to control the detected value output from the detection unit to determine entry time of the next defrosting operation, and a storage unit to store a value detected in the stable state. The entry time of the defrosting operation is accurately determined, thereby minimizing the number of times of the defrosting operation during the heating operation.

Abstract: A cooling and heating control method of a multi type air conditioner in which a target pressure of a compressor is adjusted based on conditions of respective indoor units so as to reduce power consumption is provided. The cooling control method includes determining the indoor unit desired to execute power saving control, judging whether or not a difference between a temperature of a space in which the indoor unit desired to execute power saving control is located and a set temperature of the indoor unit is less than a reference value, raising a target evaporation temperature of the indoor unit upon judging that the difference is less than the reference value, comparing an evaporation temperature of the indoor unit with the raised target evaporation temperature, and raising an evaporation pressure of a compressor, when the evaporation temperature of the indoor unit is lower than the raised target evaporation temperature.

Abstract: The present invention relates to a novel crystalline form of 5-chloro-N-({(5S)-2-oxo-3-[4-(5,6-dihydro-4H-[1,2,4]triazin-1-yl)phenyl]-1,3-oxazolidin-5-yl}methyl)thiophene-2-carboxamide methanesulfonate and a pharmaceutical composition containing the same. The novel crystalline form of a compound according to the present invention exhibits excellent stability even in high-temperature and humidity environments, and thus can be favorably used to prevent or treat diseases, such as thrombosis, myocardial infarction, atherosclerosis, inflammation, stroke, angina pectoris, restenosis after angioplasty, and thromboembolism.

Abstract: A method of manufacture comprises a mask process correction (MPC) and verifying MPC accuracy. MPC may be performed on mask tape-out (MTO) data describing a mask pattern to obtain mask process corrected data. MPC may be performed to address a deviation between the MTO data and a mask to be manufactured. Verification of the MPC may be performed by generating a two-dimensional (2D) contour of mask pattern elements based on the mask process corrected data. When MPC has been verified, the mask process corrected data may be used to manufacture a mask and a semiconductor device.