Abstract: Spaced apart bonding surfaces are formed on a first substrate. A second substrate is bonded to the bonding surfaces of the first substrate and cleaved to leave respective semiconductor regions from the second substrate on respective ones of the spaced apart bonding surfaces of the first substrate. The bonding surfaces may include surfaces of at least one insulating region on the first substrate, and at least one active device may be formed in and/or on at least one of the semiconductor regions. A device isolation region may be formed adjacent the at least one of the semiconductor regions.

Abstract: A semiconductor memory device includes a first conductive line on a semiconductor substrate, an interlayer insulating layer on the first conductive line, a second conductive line on the interlayer insulating layer, and a memory cell in an hole through the interlayer insulating layer wherein the first and second conductive lines cross, the memory cell including a discrete resistive memory material region disposed in the hole and electrically connected between the first and second conductive lines. The resistive memory material region may be substantially contained within the hole. In some embodiments, contact between the resistive memory material region and the interlayer insulating layer is substantially limited to sidewalls of the interlayer insulating layer in the hole.

Abstract: In a method of forming a contact structure, a first insulation layer including a first contact hole is formed on a substrate. A metal layer including tungsten is formed to fill the first contact hole. A planarization process is performed on the metal layer until the first insulation layer is exposed to form a first contact. A second contact is grown from the first contact. The second contact is formed without performing a photolithography process and an etching process to prevent misalignments.

Abstract: In methods of manufacturing a variable resistance structure and a phase-change memory device, after forming a first insulation layer on a substrate having a contact region, a contact hole exposing the contact region is formed through the first insulation layer. After forming a first conductive layer on the first insulation layer to fill up the contact hole, a first protection layer pattern is formed on the first conductive layer. The first conductive layer is partially etched to form a contact and to form a pad on the contact. A second protection layer is formed on the first protection layer pattern, and then an opening exposing the pad is formed through the second protection layer and the first protection layer pattern. After formation of a first electrode, a phase-change material layer pattern and a second electrode are formed on the first electrode and the second protection layer.

Abstract: A semiconductor device includes an interlayer insulating layer disposed on a substrate, the interlayer insulating layer comprising an opening exposing the substrate, a barrier layer pattern disposed within the opening, and a conductive pattern disposed on the barrier layer pattern, the conductive pattern having an oxidized portion extending out of the opening and a non-oxidized portion within the opening, wherein a width of the conductive pattern is determined by a thickness of the barrier layer pattern.

Abstract: In methods of manufacturing a variable resistance structure and a phase-change memory device, after forming a first insulation layer on a substrate having a contact region, a contact hole exposing the contact region is formed through the first insulation layer. After forming a first conductive layer on the first insulation layer to fill up the contact hole, a first protection layer pattern is formed on the first conductive layer. The first conductive layer is partially etched to form a contact and to form a pad on the contact. A second protection layer is formed on the first protection layer pattern, and then an opening exposing the pad is formed through the second protection layer and the first protection layer pattern. After formation of a first electrode, a phase-change material layer pattern and a second electrode are formed on the first electrode and the second protection layer.

Abstract: In a method of manufacturing a semiconductor device, a recess is formed in an active region of a substrate. A gate insulation layer is formed in the first recess. A barrier layer is formed on the gate insulation layer. A preliminary nucleation layer having a first resistance is formed on the barrier layer. The preliminary nucleation layer is converted into a nucleation layer having a second resistance substantially smaller than the first resistance. A conductive layer is formed on the nucleation layer. The conductive layer, the nucleation layer, the barrier layer and the gate insulation layer are partially etched to form a buried gate structure including a gate insulation layer pattern, a barrier layer pattern, a nucleation layer pattern and a conductive layer pattern.

Abstract: An integrated circuit device includes a semiconductor substrate including an active region defined by an isolation region and having at least one trench therein, a gate insulating layer formed in the at least one trench, a gate electrode layer having a nano-crystalline structure disposed on the gate insulating layer and a word line on the gate electrode layer in the at least one trench. The device may further include a capping layer on the word line.

Abstract: A method of fabricating a semiconductor device includes depositing tungsten on an insulating layer in which a contact hole is formed by chemical vapor deposition (CVD), performing chemical mechanical planarization (CMP) on the tungsten to expose the insulating layer and form a tungsten contact plug, and performing rapid thermal oxidation (RTO) on the tungsten contact plug in an oxygen atmosphere such that the tungsten expands volumetrically into tungsten oxide (W?O?).

Abstract: In methods of manufacturing a variable resistance structure and a phase-change memory device, after forming a first insulation layer on a substrate having a contact region, a contact hole exposing the contact region is formed through the first insulation layer. After forming a first conductive layer on the first insulation layer to fill up the contact hole, a first protection layer pattern is formed on the first conductive layer. The first conductive layer is partially etched to form a contact and to form a pad on the contact. A second protection layer is formed on the first protection layer pattern, and then an opening exposing the pad is formed through the second protection layer and the first protection layer pattern. After formation of a first electrode, a phase-change material layer pattern and a second electrode are formed on the first electrode and the second protection layer.

Abstract: A method of fabricating a semiconductor device including a channel layer includes forming a single crystalline semiconductor layer on a semiconductor substrate. The single crystalline semiconductor layer includes a protrusion extending from a surface thereof. A first polishing process is performed on the single crystalline semiconductor layer to remove a portion of the protrusion such that the single crystalline semiconductor layer includes a remaining portion of the protrusion. A second polishing process different from the first polishing process is performed to remove the remaining portion of the protrusion and define a substantially planar single crystalline semiconductor layer having a substantially uniform thickness. A sacrificial layer may be formed on the single crystalline semiconductor layer and used as a polish stop for the first polishing process to define a sacrificial layer pattern, which may be removed prior to the second polishing process.

Abstract: In methods of manufacturing a variable resistance structure and a phase-change memory device, after forming a first insulation layer on a substrate having a contact region, a contact hole exposing the contact region is formed through the first insulation layer. After forming a first conductive layer on the first insulation layer to fill up the contact hole, a first protection layer pattern is formed on the first conductive layer. The first conductive layer is partially etched to form a contact and to form a pad on the contact. A second protection layer is formed on the first protection layer pattern, and then an opening exposing the pad is formed through the second protection layer and the first protection layer pattern. After formation of a first electrode, a phase-change material layer pattern and a second electrode are formed on the first electrode and the second protection layer.

Abstract: A plug comprises a first insulating interlayer, a tungsten pattern and a tungsten oxide pattern. The first insulating interlayer has a contact hole formed therethrough on a substrate. The tungsten pattern is formed in the contact hole. The tungsten pattern has a top surface lower than an upper face of the first insulating interlayer. The tungsten oxide pattern is formed in the contact hole and on the tungsten pattern. The tungsten oxide pattern has a level face.

Abstract: In methods of forming a thin ferroelectric layer and methods of manufacturing a semiconductor device, a preliminary ferroelectric layer is formed on a substrate by depositing a metal oxide including lead, zirconium and titanium. The surface of the preliminary ferroelectric layer is polished using a slurry composition including an acrylic acid polymer, abrasive particles, and water to form a thin ferroelectric layer on the substrate. The slurry composition may reduce a polishing rate of the preliminary ferroelectric layer such that removal of a bulk portion of the preliminary ferroelectric layer may be suppressed and the surface roughness of the preliminary ferroelectric layer may be improved.

Abstract: In a method of forming a contact structure, a first insulation layer including a first contact hole is formed on a substrate. A metal layer including tungsten is formed to fill the first contact hole. A planarization process is performed on the metal layer until the first insulation layer is exposed to form a first contact. A second contact is grown from the first contact. The second contact is formed without performing a photolithography process and an etching process to prevent misalignments.

Abstract: Disclosed is a metal-metal oxide resistive memory device including a lower conductive layer pattern disposed in a substrate. An insulation layer is formed over the substrate, including a contact hole to partially expose the upper surface of the lower conductive layer pattern. The contact hole is filled with a carbon nanotube grown from the lower conductive layer pattern. An upper electrode and a transition-metal oxide layer made of a 2-components material are formed over the carbon nanotube and the insulation layer. The metal-metal oxide resistive memory device is adaptable to high integration and operable with relatively small power consumption by increasing the resistance therein.

Abstract: Methods of forming a metal contact structure include forming an interlayer insulating layer on a substrate, etching the interlayer insulating layer to form a hole, depositing a metal layer on the surface of the interlayer insulating layer including inside the hole, planarizing the metal layer to provide a buried portion of the metal layer in the hole and to remove portions of the metal layer outside of the hole, etching-back the buried portion of the metal layer in the hole such that some of the portion of the metal layer within the hole remains and depositing a conductive layer on the surface of the interlayer insulating layer and the portion of the metal layer that remains within the hole. Methods of forming a phase change memory device are also provided.

Abstract: A dielectric layer is formed on a region of a microelectronic substrate. A sacrificial layer is formed on the dielectric layer, and portions of the sacrificial layer and the dielectric layer are removed to form an opening that exposes a portion of the region. A conductive layer is formed on the sacrificial layer and in the opening. Portions of the sacrificial layer and the conductive layer on the dielectric layer are removed to leave a conductive plug in the dielectric layer and in contact with the region. Removal of the sacrificial layer and portions of the conductive layer on the dielectric layer may include polishing to expose the sacrificial layer and to leave a conductive plug in the sacrificial layer and the dielectric layer, etching the sacrificial layer to expose the dielectric layer and leave a portion of the conductive plug protruding from the dielectric layer, and polishing to remove the protruding portion of the conductive plug.

Abstract: A method of fabricating an integrated circuit device is provided. The method includes sequentially forming a lower interconnection layer, a catalyst layer, and a buffer layer on a semiconductor substrate, forming an interlayer dielectric layer to cover the buffer layer, forming a contact hole through the interlayer dielectric layer so that a top surface of the buffer layer may be partially exposed, removing a portion of the buffer layer exposed by the contact hole so that a top surface of the catalyst layer may be exposed, and growing carbon nanotubes from a portion of the catalyst layer exposed by the contact hole so that the contact hole may be filled with the carbon nanotubes.

Abstract: A ferroelectric memory device and a method of forming the same are provided. At least two lower electrode patterns are formed on an interlayer insulating layer covering a semiconductor substrate. A seed layer pattern filling a space between at least the two lower electrode patterns and having a planar surface is formed. A ferroelectric layer is formed on the lower electrode pattern and the seed layer pattern. An upper electrode overlapping the two lower electrode patterns is formed on the ferroelectric layer.