Patents by Inventor Suk Hwan AHN

Suk Hwan AHN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20140116753
    Abstract: There are provided a wiring board in which plating layers constituting wiring patterns are formed to have uniform thicknesses, and a method of manufacturing the wiring board. The wiring board includes an insulating layer; and wiring patterns formed on the insulating layer, wherein at least one of the wiring patterns is formed by stacking two or more plating layers.
    Type: Application
    Filed: January 18, 2013
    Publication date: May 1, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Han Ul LEE, Yong Sam LEE, Suk Hwan AHN