Patents by Inventor Suk Kee Hong
Suk Kee Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7443024Abstract: A micro-electro-mechanical system (MEMS) package having a side double-sealing member and method of manufacturing the MEMS package is disclosed. The MEMS package is formed by forming a metal layer on a base substrate by patterning so that the metal layer surrounds an MEMS element provided on the base substrate, joining a lid glass to the metal layer, and providing a side double-sealing member on a surface of the base substrate and a side surface of the lid glass, thus hermetically sealing the MEMS element from the external environment.Type: GrantFiled: July 12, 2005Date of Patent: October 28, 2008Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Suk Kee Hong, Dong Hyun Park, Yeong Gyu Lee
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Patent number: 7394139Abstract: Disclosed herein is an optical modulator module package using a flip-chip mounting technology, in which an optical modulator device is hermetically mounted using the flip-chip mounting technology. The optical modulator device is protected from an external environment, it is easy to transmit an electrical signal to the exterior, and optical characteristics of the optical modulator device are desirably maintained.Type: GrantFiled: February 3, 2006Date of Patent: July 1, 2008Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Heung Woo Park, Yeong Gyu Lee, Suk Kee Hong, Chang Su Park, Ohk Kun Lim
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Patent number: 7388282Abstract: A micro-electro-mechanical system (MEMS) package having a hydrophobic layer is disclosed. The MEMS package includes: a base substrate, with an MEMS element provided on a surface of the base substrate; a lid, spaced apart from the MEMS element provided on the base substrate and covering the MEMS element; a side sealing member provided on a side surface of the base substrate and the surface of the lid, thus hermetically sealing the MEMS element from an external environment; and a hydrophobic layer which covers the part of the side sealing member that is exposed to the external environment, thus removing the hydrophilia from the side sealing member.Type: GrantFiled: July 12, 2005Date of Patent: June 17, 2008Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Yeong Gyu Lee, Suk Kee Hong
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Patent number: 7368816Abstract: A micro-electro-mechanical system (MEMS) package having a metal sealing member is disclosed. The MEMS package is formed by forming a metal layer on a substrate by patterning so that the metal layer surrounds an MEMS element provided on the substrate; joining a lid to the metal layer; providing a side sealing member on a side surface of the substrate; and covering the lid and the substrate with a metal sealing member, thus hermetically sealing the MEMS element from the external environment.Type: GrantFiled: July 12, 2005Date of Patent: May 6, 2008Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ohk Kun Lim, Suk Kee Hong
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Patent number: 7319553Abstract: Disclosed herein is an optical modulator module package structure. In the optical modulator module package structure, an optical modulator device and a drive integrated circuit device are flip-chip bonded to a substrate, and an opening of the substrate is blocked using a piece of glass.Type: GrantFiled: February 21, 2006Date of Patent: January 15, 2008Assignee: Samsung Electro-Mechanics Co., Ltd.Inventor: Suk Kee Hong
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Publication number: 20070075417Abstract: A MEMS module package using a sealing cap having heat releasing capability is disclosed, which comprises a lower substrate, a MEMS element mounted on the lower substrate, a driver integrated circuit mounted on the lower substrate adjacently to the MEMS element which operates the MEMS element, and a sealing cap positioned in contact with the lower substrate which has a MEMS-element protrusion portion in physical contact with the MEMS element and has one or more grooves for housing the MEMS element and the driver integrated circuit. The MEMS module package using a sealing cap having heat releasing capability and a manufacturing method thereof according to an aspect of the present invention utilize an effective heat releasing structure to release the heat generated in each element.Type: ApplicationFiled: October 4, 2006Publication date: April 5, 2007Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Young-Nam Hwang, Yeong-Gyu Lee, Suk-Kee Hong, Heung-Woo Park
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Patent number: 7113689Abstract: An MEMS variable optical attenuator includes a substrate having a planar surface, a micro-electric actuator arranged on the planar surface of the substrate, a pair of coaxially aligned optical waveguides having a receiving end and a transmitting end, respectively, and an optical shutter movable to a predetermined position between the receiving end and the transmitting end of the optical waveguides, and driven by the micro-electric actuator. A surface layer is formed on the optical shutter, has reflectivity less than 80% so as to allow incident light beams to partially transmit thereinto, and further has a sufficient light extinction ratio, thereby extinguishing the partially transmitted light beams therein.Type: GrantFiled: June 26, 2003Date of Patent: September 26, 2006Assignee: Samsung Electro-Mechanics Co., LTDInventors: Yoon Shik Hong, Young Gyu Lee, Sung Cheon Jung, Sang Kee Yoon, Hyun Kee Lee, Suk Kee Hong, Joon Seok Kang, Jung Hyun Lee
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Patent number: 7078804Abstract: A micro-electro-mechanical system (MEMS) package with a side sealing member and a method of manufacturing the package are disclosed. In the MEMS package and method of the present invention, a sealing member is formed on a side surface of a lid glass that is mounted on a spacer surrounding MEMS elements provided on a base substrate and covers the MEMS elements, so that the sealing member hermetically seals the MEMS elements from the external environment.Type: GrantFiled: September 28, 2004Date of Patent: July 18, 2006Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Suk-Kee Hong, Yeong-Gyu Lee, Heung-Woo Park
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Publication number: 20060078247Abstract: Disclosed herein is a package structure for an optical modulator, which is configured such that an optical modulating device and electronic control circuitry are incorporated into a module, thus allowing the manufacture of a compact module while maintaining the optical properties of the optical modulating device.Type: ApplicationFiled: October 6, 2005Publication date: April 13, 2006Inventors: Yeong Gyu Lee, Jong Hyeong Song, Heung Woo Park, Suk Kee Hong, Chang Su Park, Ohk Kun Lim
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Publication number: 20050275075Abstract: A micro-electro-mechanical system (MEMS) package with a spacer for sealing and a method of manufacturing the package are disclosed. The MEMS package and method of the present invention hermetically and reliably seals MEMS elements from an external environment, including temperature, humidity, impact and vibration, by a sealing unit which has a spacer integrated with a lid glass to secure an MEMS moving space where the MEMS elements are free to move vertically. The present invention simplifies the process of manufacturing the MEMS package and prevents solder from flowing into the package. The MEMS package and method according to the present invention also allow a reworking process, such as for adding solder, to be executed when the sealing is not complete due to inaccurate positioning of the solder and/or application of a deficient amount of solder to a junction between the base substrate and the lid glass.Type: ApplicationFiled: September 28, 2004Publication date: December 15, 2005Inventors: Suk-Kee Hong, Chang-Su Park, Ohk-Kun Lim
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Publication number: 20050258516Abstract: A micro-electro-mechanical system (MEMS) package with a side sealing member and a method of manufacturing the package are disclosed. In the MEMS package and method of the present invention, a sealing member is formed on a side surface of a lid glass that is mounted on a spacer surrounding MEMS elements provided on a base substrate and covers the MEMS elements, so that the sealing member hermetically seals the MEMS elements from the external environment.Type: ApplicationFiled: September 28, 2004Publication date: November 24, 2005Inventors: Suk-Kee Hong, Yeong-Gyu Lee, Heung-Woo Park
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Patent number: 6915033Abstract: Disclosed are a multi-channel optical switch and a method for manufacturing the same. The multi-channel optical switch includes a supporter; an input terminal optical fiber fixed to the supporter for inputting an optical signal to be switched therethrough; multiple output terminal optical fibers fixed to the supporter for outputting the optical signal inputted through the input terminal optical fiber therethrough; multiple micro mirrors for reflecting the optical signal inputted through the input terminal optical fiber and then for directing the optical signal to a designated output terminal optical fiber among the multiple output terminal optical fibers; and multiple actuators respectively connected to the micro mirrors for adjusting the positions of the micro mirrors so that the optical signal is reflected by the micro mirrors.Type: GrantFiled: October 22, 2003Date of Patent: July 5, 2005Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Suk Kee Hong, Yeong Gyu Lee
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Patent number: 6901204Abstract: Disclosed is an MEMS variable optical attenuator comprising a substrate having a planar surface, optical fibers having an optical signal transmitting end and an optical signal receiving end, respectively, coaxially arranged on the substrate, a micro-electric actuator arranged on the substrate for providing a driving stroke along a direction perpendicular to an optical axis of the optical beam, at least one lever structure arranged on the substrate for receiving the driving stroke of the micro-electric actuator at a first end thereof and transferring an amplified displacement distance to an optical shutter through a second end thereof, an optical shutter arranged on the substrate and connected to the second end of the lever structure so as to be moved by the amplified displacement distance, thereby being displaced to an attenuation position of the optical beam.Type: GrantFiled: July 2, 2003Date of Patent: May 31, 2005Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Yoon Shik Hong, Sang Kee Yoon, Suk Kee Hong, Young Gyu Lee, Sung Cheon Jung, Jung Hyun Lee
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Publication number: 20040264849Abstract: Disclosed are a multi-channel optical switch and a method for manufacturing the same. The multi-channel optical switch includes a supporter; an input terminal optical fiber fixed to the supporter for inputting an optical signal to be switched therethrough; multiple output terminal optical fibers fixed to the supporter for outputting the optical signal inputted through the input terminal optical fiber therethrough; multiple micro mirrors for reflecting the optical signal inputted through the input terminal optical fiber and then for directing the optical signal to a designated output terminal optical fiber among the multiple output terminal optical fibers; and multiple actuators respectively connected to the micro mirrors for adjusting the positions of the micro mirrors so that the optical signal is reflected by the micro mirrors.Type: ApplicationFiled: October 22, 2003Publication date: December 30, 2004Inventors: Suk Kee Hong, Yeong Gyu Lee
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Publication number: 20040126081Abstract: Disclosed is an MEMS variable optical attenuator comprising a substrate having a planar surface, optical fibers having an optical signal transmitting end and an optical signal receiving end, respectively, coaxially arranged on the substrate, a micro-electric actuator arranged on the substrate for providing a driving stroke along a direction perpendicular to an optical axis of the optical beam, at least one lever structure arranged on the substrate for receiving the driving stroke of the micro-electric actuator at a first end thereof and transferring an amplified displacement distance to an optical shutter through a second end thereof, an optical shutter arranged on the substrate and connected to the second end of the lever structure so as to be moved by the amplified displacement distance, thereby being displaced to an attenuation position of the optical beam.Type: ApplicationFiled: July 2, 2003Publication date: July 1, 2004Inventors: Yoon Shik Hong, Sang Kee Yoon, Suk Kee Hong, Young Gyu Lee, Sung Cheon Jung, Jung Hyun Lee
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Publication number: 20040126080Abstract: Disclosed is an MEMS variable optical attenuator comprising a substrate having a planar surface, a micro-electric actuator arranged on the planar surface of the substrate, a pair of optical waveguides having a receiving end and a transmitting end, respectively, and coaxially aligned with the other while being arranged on the planar surface, an optical shutter movable to a predetermined position between the receiving end and the transmitting end of the optical waveguides, and driven to move by the micro-electric actuator, and a surface layer formed on the optical shutter, having reflectivity less than 80% so as for incident light beams to partially transmit thereinto, and having a characteristic of light extinction, thereby extinguishing the partially transmitted light beams therein.Type: ApplicationFiled: June 26, 2003Publication date: July 1, 2004Inventors: Yoon Shik Hong, Young Gyu Lee, Sung Cheon Jung, Sang Kee Yoon, Hyun Kee Lee, Suk Kee Hong, Joon Seok Kang, Jung Hyun Lee