Abstract: A charging device may include a main body comprising a cable connected charger, an accommodation space located inside the main body, the accommodation space being configured to accommodate a cooler, a lower plate located at a lower portion of the accommodation space, and a support plate coupled to the lower plate, the support plate being configured to support a lower portion of the cooler.

Abstract: A charger according to the present embodiment comprises a body with a space formed inside; a door configured to open and close the space; a retractor module including a retractor having a wire connected to a charging cable and a box configured to cover the retractor; and a retractor cover disposed on an upper side surface of the body and configured to cover the retractor module when the retractor module is inserted.

Abstract: A cabinet includes a case having an accommodation space formed therein and having an open front, and a reinforcing member coupled to an inner surface of the case and configured to increase structural rigidity of the case, wherein the reinforcing member includes a pair of lateral reinforcing members arranged upright and spaced apart from each other in a first direction, a top reinforcing member disposed at an upper end of the pair of lateral reinforcing members, and a bottom reinforcing member disposed at a lower end of the pair of lateral reinforcing members and increases the structural rigidity of the case through a reinforcing member coupled to an inner surface of the case.

Abstract: Disclosed is a charging device including a main body where a charger connected to a cable is located, an optical cover including a lower portion located on top of the main body and a side portion extending upward from an edge of the lower portion, a printed circuit board located on a top surface of the lower portion of the optical cover to be spaced apart from an inner surface of the side portion of the optical cover, wherein an LED array is mounted on the printed circuit board, and a sealing cover covering the printed circuit board and coupled to a top surface of the side portion, wherein the optical cover includes a translucent light-transmissive material such that light output from the LED array is irradiated through the side portion. The charging device uses LED lighting to indicate a charged state, thereby securing visibility and improving a convenience of a user.

Abstract: Disclosed is a charging device including a main body having a cable connected charger located therein, a front door covering a front surface of the main body and some of both side surfaces of the main body, a pair of side covers covering the rest of the both side surfaces of the main body, a rear cover covering a rear surface of the main body, and a locking part located at a top surface of the main body, wherein the top surface of the main body may be formed to be lower than a top surface of each of the front door, a pair of the side covers, and the rear cover so as not to expose the locking part.

Abstract: Disclosed is a charging device including a main body where a charger connected to a cable is located, a printed circuit board located in the main body and including an LED array mounted on a front surface thereof, a front cover covering the front surface of the printed circuit board, coupled to the main body, and having a seating portion defined in a front surface thereof, and a display cover seated in the seating portion, wherein the seating portion includes a guide hole exposing the LED array such that light output from the LED array is irradiated to the display cover. The charging device uses LED lighting to indicate a charged state, thereby securing visibility and improving a convenience of a user.

Abstract: Disclosed is a charging device including a main body having a cable connected charger located therein, a front door covering a front surface of the main body and having a plurality of sound holes formed therein, and a sound unit located inside the front door to discharge sound through a plurality of the sound holes, the sound unit including a speaker generating the sound and a housing having a top surface and a front surface open to have an inner space connected to a plurality of the sound holes, wherein the speaker may be located on the top surface of the housing.

Abstract: A stack-type semiconductor package includes a first semiconductor package upon which a second semiconductor package is stacked. A layer of a hardened, insulative material, e.g., a no-flow underfill (NUF) material, is disposed between, and mechanically couples the stacked first and second semiconductor packages. The NUF layer covers portions of the first semiconductor package, e.g., the semiconductor die and the substrate of the first semiconductor package, and solder balls of the second semiconductor package that are fused to the substrate of the first semiconductor package. The NUF material is applied onto the semiconductor die and substrate of the first semiconductor package before the second semiconductor package is stacked on the first semiconductor package, and substantially cures after the solder balls of the second semiconductor package are fused to the substrate of the first semiconductor package.

Abstract: Metal leadframes, semiconductor packages made using the leadframes, and methods of making the leadframes and packages are disclosed. In one embodiment, the leadframe includes a rectangular frame. A chip pad and a plurality of leads are within the frame. The lower side of the chip pad and the leads includes one or more vertically recessed horizontal surfaces. The upper side of the chip pad may include a groove around a chip mounting region. In a package, the chip pad supports a semiconductor chip electrically connected to the leads. The lower side of the chip pad and leads are exposed at an exterior surface of the package body. Encapsulant material underfills the recessed lower surfaces of the chip pad and leads, thereby locking them to the encapsulant material. A wire may be reliably bonded to the chip pad within the groove formed in the upper side thereof.

Abstract: Metal leadframes, semiconductor packages made using the leadframes, and methods of making the leadframes and packages are disclosed. In one embodiment, the leadframe includes a rectangular frame. A chip pad and a plurality of leads are within the frame. The lower side of the chip pad and the leads includes one or more vertically recessed horizontal surfaces. The upper side of the chip pad may include a groove around a chip mounting region. In a package, the chip pad supports a semiconductor chip electrically connected to the leads. The lower side of the chip pad and leads are exposed at an exterior surface of the package body. Encapsulant material underfills the recessed lower surfaces of the chip pad and leads, thereby locking them to the encapsulant material. A wire may be reliably bonded to the chip pad within the groove formed in the upper side thereof.