Patents by Inventor Suk Min Jun

Suk Min Jun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180127545
    Abstract: A copolymerized polyamide resin includes a polymer of a monomer mixture comprising a dicarboxylic acid component comprising adipic acid and a dicarboxylic acid represented by Formula 1, wherein each R1 is independently a C1 to C5 alkyl group and a is an integer from 0 to 4, and a diamine component comprising m-xylene diamine and a diamine represented by Formula 2, wherein A is a single bond or a C1 to C10 hydrocarbon group, R2 and R3 are each independently a C1 to C5 alkyl group, and b and c are each independently an integer from 0 to 4, wherein the copolymerized polyamide resin has a difference between a melting temperature (Tm) and a crystallization temperature (Tc) of about 50° C. or more. The copolymerized polyamide resin may have excellent heat resistance and reduced or no gel generation and yellowing phenomenon in a molding process.
    Type: Application
    Filed: January 5, 2018
    Publication date: May 10, 2018
    Inventors: So Young KWON, Jin Kyu KIM, Young Sub JIN, Joon Sung KIM, Ki Yon LEE, Suk Min JUN
  • Patent number: 9902808
    Abstract: A copolymerized polyamide resin includes a polymer of a monomer mixture comprising a dicarboxylic acid component comprising adipic acid and a dicarboxylic acid represented by Formula 1, wherein each R1 is independently a C1 to C5 alkyl group and a is an integer from 0 to 4, and a diamine component comprising m-xylene diamine and a diamine represented by Formula 2, wherein A is a single bond or a C1 to C10 hydrocarbon group, R2 and R3 are each independently a C1 to C5 alkyl group, and b and c are each independently an integer from 0 to 4, wherein the copolymerized polyamide resin has a difference between a melting temperature (Tm) and a crystallization temperature (Tc) of about 50° C. or more. The copolymerized polyamide resin may have excellent heat resistance and reduced or no gel generation and yellowing phenomenon in a molding process.
    Type: Grant
    Filed: December 26, 2014
    Date of Patent: February 27, 2018
    Assignee: Lotte Advanced Materials Co., Ltd.
    Inventors: So Young Kwon, Jin Kyu Kim, Young Sub Jin, Joon Sung Kim, Ki Yon Lee, Suk Min Jun
  • Patent number: 9649616
    Abstract: The continuous solid-state polymerization device of the present invention comprises: a feeder for continuously introducing a prepolymer; a horizontal reactor which is connected via a first connecting part to the feeder and receives the prepolymer from the feeder so as to subject same to solid-state polymerization, wherein the reactor itself is rotated; a stirring device which comprises a stirring shaft rotating inside the horizontal reactor, in the direction opposite to that of the rotational axis of the horizontal reactor, and comprises stirring blades joined vertically to the stirring shaft; and a chamber which is connected via a second connecting part to the horizontal reactor and, once the solid-state polymerization has been completed, receives the resulting polymer discharged from the horizontal reactor, and, here, the feeder, the horizontal reactor and the chamber are in a vacuum state.
    Type: Grant
    Filed: October 22, 2013
    Date of Patent: May 16, 2017
    Assignee: Lotte Advanced Materials Co., Ltd.
    Inventors: Sang Kyun Im, Suk Min Jun, Shin Hyo Bae, So Young Kwon, Eun Ju Lee, Young Sub Jin, Kyoung Kyun Park
  • Patent number: 9371421
    Abstract: A crystalline polyamide ester resin is prepared by copolymerizing (A) a dicarboxylic acid component, (B) a diamine component, and (C) a cyclic aliphatic diol component, and has a structure in which a dicarboxylic acid moiety derived from the dicarboxylic acid component (A), a diamine moiety derived from the diamine component (B) and a cyclic aliphatic diol moiety derived from the cyclic aliphatic diol component (C) are repeated. A molar ratio ((B):(C)) of the diamine component (B) to the cyclic aliphatic diol component (C) is about 80 to about 99:about 1 to about 20. The crystalline polyamide ester resin has a melting point (Tm) ranging from about 280° C. to about 320° C. and a crystallization temperature (Tc) ranging from about 260° C. to about 290° C. The crystalline polyamide ester resin can have excellent heat resistance, discoloration resistance and moldability.
    Type: Grant
    Filed: July 23, 2013
    Date of Patent: June 21, 2016
    Assignee: Cheil Industries Inc.
    Inventors: So Young Kwon, Jin Kyu Kim, Seung Youb Bang, Sang Kyun Im, Jin A Je, Ki Yon Lee, Suk Min Jun, Sung Chul Choi
  • Patent number: 9359476
    Abstract: The polyamide resin of the present invention is a polyamide resin containing an amine group and a carboxyl group, wherein the amine group concentration is about 200 to 300 ?eq/g and two to six times as high as the carboxyl group concentration. The polyamide resin has excellent long-thermal stability.
    Type: Grant
    Filed: March 27, 2013
    Date of Patent: June 7, 2016
    Assignee: Cheil Industries Inc.
    Inventors: So Young Kwon, Jin Kyu Kim, Seung Youb Bang, Eun Ju Lee, Sang Kyun Im, Ki Yon Lee, Suk Min Jun, Sung Chul Choi
  • Publication number: 20160144337
    Abstract: The continuous solid-state polymerisation device of the present invention comprises: a feeder for continuously introducing a prepolymer; a horizontal reactor which is connected via a first connecting part to the feeder and receives the prepolymer from the feeder so as to subject same to solid-state polymerisation, wherein the reactor itself is rotated; a stirring device which comprises a stirring shaft rotating inside the horizontal reactor, in the direction opposite to that of the rotational axis of the horizontal reactor, and comprises stirring blades joined vertically to the stirring shaft; and a chamber which is connected via a second connecting part to the horizontal reactor and, once the solid-state polymerisation has been completed, receives the resulting polymer discharged from the horizontal reactor, and, here, the feeder, the horizontal reactor and the chamber are in a vacuum state.
    Type: Application
    Filed: October 22, 2013
    Publication date: May 26, 2016
    Inventors: Sang Kyun IM, Suk Min JUN, Shin Hyo BAE, So Young KWON, Eun Ju LEE, Young Sub JIN, Kyoung Kyun PARK
  • Patent number: 9315627
    Abstract: A polyamide ester resin is a polymer of: a dicarboxylic acid; a diamine; and a linear aliphatic diol, wherein, based on a total amount of the diamine and the linear aliphatic diol, the diamine is present in an amount of about 75 mol % to about 99 mol % and the linear aliphatic diol is present in an amount of about 1 mol % to about 25 mol %, and wherein the polyamide ester resin has a melting point (Tm) from about 280° C. to about 320° C. and a crystallization temperature (Tc) from about 260° C. to about 290° C. The polyamide ester resin can exhibit excellent heat resistance, discoloration resistance, and moldability.
    Type: Grant
    Filed: December 12, 2013
    Date of Patent: April 19, 2016
    Assignee: Cheil Industries Inc.
    Inventors: Eun Ju Lee, So Young Kwon, Joon Sung Kim, Sang Kyun Im, Sung Chul Choi, Ki Yon Lee, Suk Min Jun
  • Publication number: 20160096924
    Abstract: A polyamide resin is a polymer of an adipic acid-containing dicarboxylic acid component and an m-xylenediamine-containing diamine component, wherein the polymer includes about 100 ppm or less of phosphorus and about 100 ppm or less of sodium (Na), and has a gel content of about 0.5% or less as measured on a specimen prepared by melting about 10 g of the polymer at about 260° C., maintaining the molten polymer for about 30 minutes, and then cooling the molten polymer to room temperature. The polyamide resin can exhibit excellent heat resistance and can reduce or prevent gel generation upon polymerization or molding.
    Type: Application
    Filed: January 16, 2015
    Publication date: April 7, 2016
    Inventors: Jin Kyu KIM, So Young KWON, Young Sub JIN, Joon Sung KIM, Su Yeong SON, Ki Yon LEE, Sang Kyun IM, Suk Min JUN
  • Publication number: 20160090448
    Abstract: A copolymerized polyamide resin includes a polymer of a monomer mixture comprising a dicarboxylic acid component comprising adipic acid and a dicarboxylic acid represented by Formula 1, wherein each R1 is independently a C1 to C5 alkyl group and a is an integer from 0 to 4, and a diamine component comprising m-xylene diamine and a diamine represented by Formula 2, wherein A is a single bond or a C1 to C10 hydrocarbon group, R2 and R3 are each independently a C1 to C5 alkyl group, and b and c are each independently an integer from 0 to 4, wherein the copolymerized polyamide resin has a difference between a melting temperature (Tm) and a crystallization temperature (Tc) of about 50° C. or more. The copolymerized polyamide resin may have excellent heat resistance and reduced or no gel generation and yellowing phenomenon in a molding process.
    Type: Application
    Filed: December 26, 2014
    Publication date: March 31, 2016
    Inventors: So Young KWON, Jin Kyu KIM, Young Sub JIN, Joon Sung KIM, Ki Yon LEE, Suk Min JUN
  • Publication number: 20150353681
    Abstract: The polyamide resin of the present invention is a polyamide resin containing an amine group and a carboxyl group, wherein the amine group concentration is about 200 to 300 ?eq/g and two to six times as high as the carboxyl group concentration. The polyamide resin has excellent long-thermal stability.
    Type: Application
    Filed: March 27, 2013
    Publication date: December 10, 2015
    Inventors: So Young KWON, Jin Kyu KIM, Seung Youb BANG, Eun Ju LEE, Sang Kyun IM, Ki Yon LEE, Suk Min JUN, Sung Chul CHOI
  • Publication number: 20150065681
    Abstract: Disclosed herein is a method of preparing prepolymer particles. The method includes injecting a prepolymer in a solution state by bottom-up type injection to form prepolymer particles by removing a solvent from the prepolymer in a solution state. The method can prepare prepolymer particles, which can be used in solid-state polymerization, using a bottom-up type flash process.
    Type: Application
    Filed: August 22, 2014
    Publication date: March 5, 2015
    Inventors: Jin Kyu KIM, So Young KWON, Sang Kyun IM, Ki Yon LEE, Suk Min JUN, Gook Geon BAE
  • Publication number: 20140357832
    Abstract: A polyamide ester resin is a polymer of: a dicarboxylic acid; a diamine; and a linear aliphatic diol, wherein, based on a total amount of the diamine and the linear aliphatic diol, the diamine is present in an amount of about 75 mol % to about 99 mol % and the linear aliphatic diol is present in an amount of about 1 mol % to about 25 mol %, and wherein the polyamide ester resin has a melting point (Tm) from about 280° C. to about 320° C. and a crystallization temperature (Tc) from about 260° C. to about 290° C. The polyamide ester resin can exhibit excellent heat resistance, discoloration resistance, and moldability.
    Type: Application
    Filed: December 12, 2013
    Publication date: December 4, 2014
    Applicant: Cheil Industries Inc.
    Inventors: Eun Ju LEE, So Young KWON, Joon Sung KIM, Sang Kyun IM, Sung Chul CHOI, Ki Yon LEE, Suk Min JUN
  • Publication number: 20140303341
    Abstract: The present invention relates to: a polyamide resin which is a copolymer of a mixture comprising (a1) one or more aliphatic diamine monomers selected from C4 to C10 aliphatic diamines, and (a2) one or more aliphatic diamine monomers selected from C11 to C18 aliphatic diamines, and a mixture comprising (b1) one or more aromatic dicarboxylic acid monomers selected from aromatic dicarboxylic acids, and (b2) one or more aliphatic dicarboxylic acid monomers selected from C4 to C14 aliphatic dicarboxylic acids, and has an amine and acid end group number greater than about 0 ?eq/g to about 150 ?eq/g; a preparation method thereof; and an article comprising the same.
    Type: Application
    Filed: December 11, 2012
    Publication date: October 9, 2014
    Applicant: Cheil Industries Inc.
    Inventors: Seung Hyun Jang, Ki Yon Lee, Young Sub Jin, Suk Min Jun, Tomoaki Shimoda, Sang Kyun Im
  • Publication number: 20140187739
    Abstract: A crystalline polyamide ester resin is prepared by copolymerizing (A) a dicarboxylic acid component, (B) a diamine component, and (C) a cyclic aliphatic diol component, and has a structure in which a dicarboxylic acid moiety derived from the dicarboxylic acid component (A), a diamine moiety derived from the diamine component (B) and a cyclic aliphatic diol moiety derived from the cyclic aliphatic diol component (C) are repeated. A molar ratio ((B):(C)) of the diamine component (B) to the cyclic aliphatic diol component (C) is about 80 to about 99:about 1 to about 20. The crystalline polyamide ester resin has a melting point (Tm) ranging from about 280° C. to about 320° C. and a crystallization temperature (Tc) ranging from about 260° C. to about 290° C. The crystalline polyamide ester resin can have excellent heat resistance, discoloration resistance and moldability.
    Type: Application
    Filed: July 23, 2013
    Publication date: July 3, 2014
    Inventors: So Young KWON, Jin Kyu KIM, Seung Youb BANG, Sang Kyun IM, Jin A. JE, Ki Yon LEE, Suk Min JUN, Sung Chul CHOI
  • Publication number: 20120172539
    Abstract: A polyamide resin produced by polymerization of an aliphatic diamine monomer mixture (A) and polyester resin (B) is disclosed. The aliphatic diamine monomer mixture (A) includes an aliphatic diamine monomer (a1) having 2 to 6 carbon atoms, and an aliphatic diamine monomer (a2) having 6 to 12 carbon atoms, with the proviso that (a1) and (a2) are different and have a different number of carbon atoms. A method to produce the polyamide resin is also disclosed. The polyamide resin can have excellent heat resistance, low hygroscopic property and good color.
    Type: Application
    Filed: December 29, 2011
    Publication date: July 5, 2012
    Applicant: CHEIL INDUSTRIES INC.
    Inventors: So Young Kwon, Young Sub Jin, Sang Kyun Lim, Bok Nam Jang, Seung Hyun Jang, Ki Yon Lee, Suk Min Jun