Abstract: A method for preparing a modified conjugated diene-based polymer having excellent compounding properties and improved processability is disclosed herein. According to the method, a first polymer including a functional group is prepared using a modifier represented by Formula 1, and the first polymer is mixed with a sulfur halide. A modified conjugated diene-based polymer having excellent affinity with a filler, excellent compounding properties such as tensile properties and viscoelasticity properties, and excellent compounding processability, may be prepared.

Abstract: A semiconductor package includes a substrate, a plurality of electronic components mounted on a first surface of the substrate, and an encapsulant disposed on the first surface of the substrate so that at least one of the plurality of electronic components is embedded in the encapsulant. The substrate includes a flow preventing portion including at least one flow preventing groove disposed in the first surface and adjacent to the encapsulant and/or at least one dam disposed on the first surface and adjacent to the encapsulant.

Abstract: The present invention relates to a modified conjugated diene-based polymer having a high modification ratio with improved compounding properties by being excellent affinity with a filler and a method for preparing the same. The modified conjugated diene-based polymer thus prepared includes a functional group derived from a compound represented by Formula 1 at one terminal, and has excellent affinity with a filler. If the modified conjugated diene-based polymer is applied to a rubber composition, excellent processability, tensile strength and viscoelasticity may be achieved.

Abstract: The present invention provides a catalyst composition including a functionalizing agent of the following Formula 1 together with a rare earth metal compound, an alkylating agent, and a halogen compound, having good catalytic activity and polymerization reactivity and useful for the preparation of a conjugated diene-based polymer having high linearity and excellent processability, and a conjugated diene-based polymer prepared using the catalyst composition (X1)a—Sn—(X2)4-a??[Formula 1] wherein, a, X1, and X2 are the same as defined in the disclosure.

Abstract: An electronic element module includes: a substrate including ground wirings; at least one electronic element mounted on a first surface of the substrate; a sealing portion embedding the at least one electronic element therein and disposed on the substrate; connection conductors partially disposed on side surfaces of the substrate and having lower ends connected to the ground wirings; and a shielding portion disposed along the sealing portion, and connected to the connection conductors.

Abstract: An electronic device module includes: a substrate; at least one electronic device mounted on a first surface of the substrate; a connection portion mounted on the first surface of the substrate; and a shielding portion disposed along an external surface of the connection portion and electrically connected to a ground of the substrate through at least one connection conductor.

Abstract: An electronic component module includes a substrate; an electronic element disposed on a first surface of the substrate; an encapsulant encapsulating the electronic element; a first shielding member disposed on a first surface of the encapsulant to surround the electronic element; a second shielding member disposed on a second surface of the encapsulant and spaced apart from the first shielding member; a shielding layer covering the first shielding member and the second shielding member; and a connection member connecting the electronic element to the second shielding member.

Abstract: A semiconductor package includes a substrate, a plurality of electronic components mounted on a first surface of the substrate, and an encapsulant disposed on the first surface of the substrate so that at least one of the plurality of electronic components is embedded in the encapsulant. The substrate includes a flow preventing portion including at least one flow preventing groove disposed in the first surface and adjacent to the encapsulant and/or at least one dam disposed on the first surface and adjacent to the encapsulant.

Abstract: A method for preparing a catalyst for use in polymerizing a conjugated diene-based monomer, the catalyst, and a method for preparing a conjugated diene-based polymer using the same are disclosed herein. In an embodiment, a method of preparing a catalyst comprises mixing a lanthanide rare earth element-containing compound, an alkylating agent compound and a halogen compound in the presence of a solvent to prepare a catalyst composition, adding a conjugated diene-based monomer to the catalyst composition to form a preformed catalyst composition, and aging the preformed catalyst composition at a temperature of ?1° C. to ?15° C. for 3 hours to 98 hours to prepare the catalyst. The catalyst has excellent catalyst activity and polymerization reactivity and is useful for preparing a conjugated diene-based polymer which has an excellent modification ratio and improved compounding properties.

Abstract: A semiconductor device includes a substrate including a first cell region, a second cell region adjacent to the first cell region in a first direction, and a comparison region adjacent the first and second cell regions in a second direction, a bit line in a first metal level on the substrate and extending in the first direction, and a first ground rail in a second metal level different from the first metal level. The first ground rail comprises a first sub-ground rail extending in the second direction on the first cell region, a second sub-ground rail extending in the second direction on the second cell region, a third sub-ground rail connecting the first sub-ground rail to the second sub-ground rail on the first and second cell regions, and a fourth sub-ground rail that branches off from the third sub-ground rail and extends in the second direction.

Abstract: An electronic device module includes: a substrate; at least one electronic device mounted on a first surface of the substrate; a connection portion mounted on the first surface of the substrate; and a shielding portion disposed along an external surface of the connection portion and electrically connected to a ground of the substrate through at least one connection conductor.

Abstract: An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.

Abstract: The present invention relates to a method of preparing a conjugated diene-based polymer by continuous polymerization using two or more reactors, and relates to a method of preparing a conjugated diene-based polymer which is capable of providing a conjugated diene-based polymer having improved Mooney viscosity and excellent cis 1,4 bond content and linearity, by controlling the injection amount of a conjugated diene-based monomer to each reactor in a specific ratio and resolving the deterioration phenomenon of physical properties, which might be generated in continuous reaction.

Abstract: The present invention provides a modifier, a modified conjugated diene-based polymer which is modified using the same, and a rubber composition including the modified conjugated diene-based polymer, and more particularly, a modifier which includes a compound represented by Formula 1 and is capable of improving the mixing properties between a conjugated diene-based polymer and a filler, a modified conjugated diene-based polymer which is modified using the same, and a rubber composition including the modified conjugated diene-based polymer.

Abstract: An electronic component module includes a substrate; an electronic element disposed on a first surface of the substrate; an encapsulant encapsulating the electronic element; a first shielding member disposed on a first surface of the encapsulant to surround the electronic element; a second shielding member disposed on a second surface of the encapsulant and spaced apart from the first shielding member; a shielding layer covering the first shielding member and the second shielding member; and a connection member connecting the electronic element to the second shielding member.

Abstract: The present invention relates to a rubber composition having excellent tensile properties and viscoelasticity properties and including a modified conjugated diene-based polymer. The rubber composition may include a modified conjugated diene-based polymer which is selected considering target tensile properties and viscoelasticity properties, by predicting in advance the correlation of the modification ratio of the modified conjugated diene-based polymer and the dynamic viscoelasticity loss coefficient at 60° C. of the rubber composition through Mathematical Formula 1 and Mathematical Formula 2. Therefore, excellent compounding properties may be shown.

Abstract: The present invention provides a catalyst composition including a functionalizing agent of the following Formula 1 together with a rare earth metal compound, an alkylating agent, and a halogen compound, having good catalytic activity and polymerization reactivity and useful for the preparation of a conjugated diene-based polymer having high linearity and excellent processability, and a conjugated diene-based polymer prepared using the catalyst composition. (X1)a—N—(X2)3-a??[Formula 1] In Formula 1, a, X1, and X2 are the same as defined in the disclosure.

Abstract: An electronic element module includes: a substrate including ground wirings; at least one electronic element mounted on a first surface of the substrate; a sealing portion embedding the at least one electronic element therein and disposed on the substrate; connection conductors partially disposed on side surfaces of the substrate and having lower ends connected to the ground wirings; and a shielding portion disposed along the sealing portion, and connected to the connection conductors.

Abstract: The present invention provides a modifier, a modified and conjugated diene-based polymer which is modified using the same, and a rubber composition including the modified and conjugated diene-based polymer, and more particularly, a modifier which includes a compound represented by Formula 1 and is capable of improving the mixing properties between a conjugated diene-based polymer and a filler, a modified and conjugated diene-based polymer which is modified using the same, and a rubber composition including the modified and conjugated diene-based polymer.

Abstract: The present invention relates to a rubber composition having excellent tensile properties and viscoelasticity properties and including a conjugated diene-based polymer. The rubber composition may include a modified conjugated diene-based polymer which is selected considering target tensile properties and viscoelasticity properties, by predicting in advance the correlation between the modification ratio of the modified conjugated diene-based polymer and the dynamic viscoelasticity loss coefficient at 60° C. of the rubber composition through Mathematical Formula 1 and Mathematical Formula 2. Therefore, excellent compounding properties may be shown.