Patents by Inventor Sukbhir Bajwa

Sukbhir Bajwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mounted semiconductor device and a method for making the same
    Patent number: 8193634
    Abstract: A method for mounting a semiconductor device onto a composite substrate, including a submount and a heat sink, is described. According to one aspect of the invention, the materials for the submount and the heat sink are chosen so that the value of coefficient of thermal expansion of the semiconductor device is in between the values of coefficients of thermal expansion of the materials of the submount and the heat sink, the thickness of the submount being chosen so as to equalize thermal expansion of the semiconductor device to that of the surface of the submount the device is mounted on. According to another aspect of the invention, the semiconductor device, the submount, and the heat sink are soldered into a stack at a single step of heating, which facilitates reduction of residual post-soldering stresses.
    Type: Grant
    Filed: September 10, 2010
    Date of Patent: June 5, 2012
    Inventors: Andre Wong, Sukbhir Bajwa
  • MOUNTED SEMICONDUCTOR DEVICE AND A METHOD FOR MAKING THE SAME
    Publication number: 20110090927
    Abstract: A method for mounting a semiconductor device onto a composite substrate, including a submount and a heat sink, is described. According to one aspect of the invention, the materials for the submount and the heat sink are chosen so that the value of coefficient of thermal expansion of the semiconductor device is in between the values of coefficients of thermal expansion of the materials of the submount and the heat sink, the thickness of the submount being chosen so as to equalize thermal expansion of the semiconductor device to that of the surface of the submount the device is mounted on. According to another aspect of the invention, the semiconductor device, the submount, and the heat sink are soldered into a stack at a single step of heating, which facilitates reduction of residual post-soldering stresses.
    Type: Application
    Filed: September 10, 2010
    Publication date: April 21, 2011
    Applicants: Sukbhir BAJWA, JDS Uniphase Corporation
    Inventors: Andre WONG, Sukbhir Bajwa
  • Mounted semiconductor device and a method for making the same
    Patent number: 7816155
    Abstract: A method for mounting a semiconductor device onto a composite substrate, including a submount and a heat sink, is described. According to one aspect of the invention, the materials for the submount and the heat sink are chosen so that the value of coefficient of thermal expansion of the semiconductor device is in between the values of coefficients of thermal expansion of the materials of the submount and the heat sink, the thickness of the submount being chosen so as to equalize thermal expansion of the semiconductor device to that of the surface of the submount the device is mounted on. According to another aspect of the invention, the semiconductor device, the submount, and the heat sink are soldered into a stack at a single step of heating, which facilitates reduction of residual post-soldering stresses.
    Type: Grant
    Filed: July 2, 2008
    Date of Patent: October 19, 2010
    Assignee: JDS Uniphase Corporation
    Inventors: Andre Wong, Sukbhir Bajwa
  • Mounted Semiconductor Device And A Method For Making The Same
    Publication number: 20090008773
    Abstract: A method for mounting a semiconductor device onto a composite substrate, including a submount and a heat sink, is described. According to one aspect of the invention, the materials for the submount and the heat sink are chosen so that the value of coefficient of thermal expansion of the semiconductor device is in between the values of coefficients of thermal expansion of the materials of the submount and the heat sink, the thickness of the submount being chosen so as to equalize thermal expansion of the semiconductor device to that of the surface of the submount the device is mounted on. According to another aspect of the invention, the semiconductor device, the submount, and the heat sink are soldered into a stack at a single step of heating, which facilitates reduction of residual post-soldering stresses.
    Type: Application
    Filed: July 2, 2008
    Publication date: January 8, 2009
    Applicant: JDS Uniphase Corporation
    Inventors: Andre Wong, Sukbhir Bajwa