Abstract: A sandwich panel for an automobile includes a core layer, a surface layer, and an adhesive layer. The core layer includes glass fibers and thermoplastic resins and defines an optimal weight and thickness to provide flexural performance and non-flammability. The sandwich panel provides a flame barrier layer, which is a non-combustible layer during ignition and prevents flame from leaking to the outside of the panel.

Abstract: There are provided a controller and a memory system having the controller.

Abstract: There are provided a controller and a memory system having the controller. The controller includes: a first storage area configured to store mapping information between logical addresses of logical regions of a storage device coupled to the controller and physical addresses of memory blocks of the storage device, the logical regions being divided into logical units including a first logical unit; and a second storage area configured to store allocation information on logical addresses of logical regions allocated to the first logical unit, each of the logical regions allocated to the first logical unit having a corresponding index, wherein the second storage area is further configured to store a location table including index information on a smallest index among indices corresponding to the logical regions allocated to the first logical unit and number information on a total number of the logical regions allocated to the first logical unit.

Abstract: A data storage device may include: a memory device; and a controller configured to control an operation of the memory device. The controller may include a first CPU and a second CPU including a plurality of cores, wherein the first CPU compares P/E (Program/Erase) average counts for the plurality of cores of the second CPU, and performs a remapping operation of changing a core which is mapped to logical block addresses received from a host.

Abstract: A data storage device may include: a memory device; and a controller configured to control an operation of the memory device. The controller may include a first CPU and a second CPU including a plurality of cores, wherein the first CPU compares P/E (Program/Erase) average counts for the plurality of cores of the second CPU, and performs a remapping operation of changing a core which is mapped to logical block addresses received from a host.

Abstract: Provided herein may be a memory system and a method for operating the memory system. The memory system includes: memory devices including memory blocks; a super block configured of the memory blocks; and a memory controller coupled to the memory devices. The memory controller includes: a host write control section configured to control the memory devices such that a program operation is performed in parallel on the memory blocks included in the super block; a valid page information management section configured to store valid page information of each of the memory blocks; and a garbage collection control section configured to select at least one of the memory blocks as a victim block based on the valid page information and perform a garbage collection operation on the victim block.

Abstract: A light source module in an illumination apparatus includes an integrally molded substrate and at least one light emitting diode (LED) chip mounted on the mounting region of the substrate portion. The integrally molded substrate includes a substrate portion including a mounting region and a holder portion integrally provided with the substrate portion. The holder portion covers at least a portion of a top surface of the substrate portion to expose the mounting region and includes a reflective surface that is positioned adjacent to the mounting region.

Abstract: A light emitting device includes: a mounting board; an adhesive member disposed on the mounting board and having a first surface adjacent to the mounting board and a second surface opposing the first surface; and a light emitting element disposed on the second surface of the adhesive member. The second surface of the adhesive member may have a first region on which the light emitting element is disposed and a second region on which a scattering pattern is provided to scatter light emitted by the light emitting element.

Abstract: Provided is a light emitting diode (LED) package. The LED package includes a package main body, first and second electrode structures, first and second LED chips, and first and second resin packing parts. The package main body includes a concave portion and a barrier wall dividing the concave portion into at least first and second accommodation recesses. The first and second electrode structures are formed at the package main body and are exposed at bottom surfaces of the first and second accommodation recesses respectively. The first and second LED chips are electrically connected to the first and second electrode structures are respectively mounted on the bottom surfaces of the first and second accommodation recesses. The first and second resin packing parts include at least one fluorescent material and are formed in the first and second accommodation recesses for packing the first and second LED chips.

Abstract: An LED package module according to an aspect of the invention may include: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion.

Abstract: An LED package module according to an aspect of the invention may include: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion.

Abstract: An LED package module according to an aspect of the invention may include: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion. Accordingly, a reduction in luminous efficiency of an LED caused by yellowing is prevented to thereby increase luminous efficiency and achieve a reduction in size.

Abstract: There is provided an LED package having high heat dissipation efficiency. An LED package according to an aspect of the invention may include: a package body including a first groove portion being recessed into the package body and provided as a mounting area on the top of the package body; first and second lead frames arranged on a lower surface of the first groove portion while parts of the first and second lead frames are exposed; an LED chip mounted onto the lower surface of the first groove portion and electrically connected to the first and second lead frames; and a plurality of heat dissipation patterns provided on the bottom of the package body and formed of carbon nanotubes.

Abstract: The present invention provides an LED package including: a heat discharge body provided with a plurality of radially protruding heat discharge fins at an outer circumferential surface and molding material filled spaces between the heat discharge fins; a package body which is received on a top surface of the heat discharge body and has a cavity; a pair of lead frames extended from upper parts of the heat discharge body to both sides thereof; and an LED chip mounted inside the cavity.

Abstract: There is provided an LED package having high heat dissipation efficiency. An LED package according to an aspect of the invention may include: a package body including a first groove portion being recessed into the package body and provided as a mounting area on the top of the package body; first and second lead frames arranged on a lower surface of the first groove portion while parts of the first and second lead frames are exposed; an LED chip mounted onto the lower surface of the first groove portion and electrically connected to the first and second lead frames; and a plurality of heat dissipation patterns provided on the bottom of the package body and formed of carbon nanotubes.

Abstract: Provided is a light emitting diode (LED) package. The LED package includes a package main body, first and second electrode structures, first and second LED chips, and first and second resin packing parts. The package main body includes a concave portion and a barrier wall dividing the concave portion into at least first and second accommodation recesses. The first and second electrode structures are formed at the package main body and are exposed at bottom surfaces of the first and second accommodation recesses respectively. The first and second LED chips are electrically connected to the first and second electrode structures are respectively mounted on the bottom surfaces of the first and second accommodation recesses. The first and second resin packing parts include at least one fluorescent material and are formed in the first and second accommodation recesses for packing the first and second LED chips.

Abstract: An LED package module according to an aspect of the invention may include: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion. Accordingly, a reduction in luminous efficiency of an LED caused by yellowing is prevented to thereby increase luminous efficiency and achieve a reduction in size.

Abstract: The present invention provides an LED package including: a heat discharge body provided with a plurality of radially protruding heat discharge fins at an outer circumferential surface and molding material filled spaces between the heat discharge fins; a package body which is received on a top surface of the heat discharge body and has a cavity; a pair of lead frames extended from upper parts of the heat discharge body to both sides thereof; and an LED chip mounted inside the cavity.