Abstract: A heat exchanger includes a cooling plate having a heat collection surface for fixing against an object to be cooled, an opposed heat transfer surface which may be provided with fins, and a cooling chamber over the heat transfer surface, the cooling chamber having an inlet port and an outlet port for circulating a fluid through the cooling chamber via a flow path between the ports. A flow distributor in the flow path forms a plurality of inlet channels communicating with the inlet port, a plurality of outlet channels alternating with the inlet channels and communicating with the outlet port, and a plurality of flow surfaces which are spaced from the heat transfer surface by gaps. The inlet channels communicate with the gaps so that a fluid entering the inlet channels via the inlet port will flow through the gaps, into the outlet channels, and out of the chamber via the outlet port. The gaps are dimensioned to increase fluid velocity and promote mixing of the fluid, thereby improving heat transfer.

Abstract: Disclosed is a temperature sensor for an integrated circuit having at least one field effect transistor (FET) having a polysilicon gate, in which a current and a voltage is supplied to the polysilicon gate, changes in the current and the voltage of the polysilicon gate are monitored, wherein the polysilicon gate of the at least one FET is electrically isolated from other components of the integrated circuit, and the changes in the current or voltage are used to calculate a change in resistance of the polysilicon gate, and the change in resistance of the polysilicon gate is used to calculate a temperature change within the integrated circuit.

Abstract: A fluid-containing cooling plate includes a bottom plate, a top plate, and metal wire or tubing formed into a circuit and sandwiched between the plates to form a chamber. The wire is plated or otherwise coated with a brazeable or solderable alloy which bonds it to the plates when the assembly is heated, thereby sealing the chamber. To make a two-phase cooling plate, slugs of plated metal are placed in the chamber and are bonded to the plates to provide support against collapse. The chamber is provided with a wicking structure, and is partially filled with an evaporable fluid via an inlet. A partial vacuum is then drawn, and the inlet is closed off. To make a single-phase cooling plate, wire partitions serving as baffles are provided in lieu of the slugs. These partitions can be arranged to provide a serpentine flow path between the inlet and an outlet, and are likewise plated with an alloy which melts to bond them to the plates.

Abstract: A heat sink assembly includes a heat sink with a base plate having a top surface with fins for dissipating heat and an opposed bottom surface for placing against an electronic device mounted on a printed circuit board, and at least one connecting device for loading the heat sink against the electronic device. The connector includes a mechanical fastener such as a push pin having an end which engages the circuit board, a compression spring received against a shoulder on the fastener, and a cup member which is installed in an aperture in the base plate so that a floor of the cup member provides a bearing surface for the spring which is below the bottom surface of the base plate. An alternative connector utilizes a conical spring received through the base plate and receiving the fastener therein to load the spring in tension against the electronic device.

Abstract: A cooling assembly for an integrated circuit chip module wherein an evaporator-cooled IC module is enclosed within an insulated housing and attached to a printed circuit board through an interconnect including a heating element embedded therein.

Abstract: A cooling assembly for an integrated circuit chip module wherein an evaporator-cooled IC module mounted on a printed circuit board is enclosed within an insulated housing, and the area of the printed circuit board adjacent the cooled IC module is encapsulated in an insulated jacket.

Abstract: A cooling assembly for an integrated circuit chip module wherein an evaporator-cooled IC module is enclosed within an insulated housing which is surrounded by an atmosphere of dehumidified air.

Abstract: A cooling assembly for an integrated circuit chip module wherein a spot cooling evaporator is mounted on the hat of the module in a position opposite the integrated chip within the module.

Abstract: A cooling assembly for an integrated circuit (IC) chip module wherein an evaporator-cooled IC module is enclosed within an insulated housing which features a low thermal conductivity barrier between its inner and outer walls of insulation.

Abstract: A cooling assembly for an integrated circuit chip module wherein an evaporator-cooled IC module is enclosed within an insulated housing which features a moisture barrier on its outer wall surface.