Abstract: A heat sink assembly includes a base plate having a top surface provided with cooling fins, and a bottom surface with an open channel, the channel having remote regions and a central region with a rectangular cross-section. A heat pipe arrangement including at least two sections is nested in the channel, each section having at least one evaporator section and a condenser section, wherein the evaporator sections are juxtaposed side by side in the central region, and the condenser sections are in respective remote regions. The arrangement is preferably a single S-shaped heat pipe with a pair of hooked ends and a center section which form the evaporator sections, the evaporator sections each having a rectangular profile and an exposed surface which is flush with the bottom surface of the base plate, the condenser sections connecting the evaporator sections and being recessed below the bottom surface.

Abstract: A fluid-containing cooling plate includes a bottom plate, a top plate, and metal wire or tubing formed into a circuit and sandwiched between the plates to form a chamber. The wire is plated or otherwise coated with a brazeable or solderable alloy which bonds it to the plates when the assembly is heated, thereby sealing the chamber. To make a two-phase cooling plate, slugs of plated metal are placed in the chamber and are bonded to the plates to provide support against collapse. The chamber is provided with a wicking structure, and is partially filled with an evaporable fluid via an inlet. A partial vacuum is then drawn, and the inlet is closed off. To make a single-phase cooling plate, wire partitions serving as baffles are provided in lieu of the slugs. These partitions can be arranged to provide a serpentine flow path between the inlet and an outlet, and are likewise plated with an alloy which melts to bond them to the plates.

Abstract: Disclosed is a temperature sensor for an integrated circuit having at least one field effect transistor (FET) having a polysilicon gate, in which a current and a voltage is supplied to the polysilicon gate, changes in the current and the voltage of the polysilicon gate are monitored, wherein the polysilicon gate of the at least one FET is electrically isolated from other components of the integrated circuit, and the changes in the current or voltage are used to calculate a change in resistance of the polysilicon gate, and the change in resistance of the polysilicon gate is used to calculate a temperature change within the integrated circuit.

Abstract: A circuit board mounted integrated circuit chip such as a processor is cooled by apparatus including a heat sink, a shroud and a fan. The heat sink includes a base placed on the top surface of the chip and fins extending up from the base. The shroud includes top and two opposed side walls closely enclosing the heat sink. The shroud is attached directly to the circuit board rather than to the heat sink or chip and can be used with chips and heat sinks that do not have special provision for attachment of the shroud. The fan moves cooling air through the shroud and between and around the heat sink fins. The fan is mounted to an end of the shroud and does not require clearance above the heat sink and shroud.

Abstract: A temperature time-of-flight (TOF) sensor is combined with a nozzle of known flow area to create a TOF flowmeter. The TOF measured by the flow sensor provides a measure of gas volumetric flow rate. A TOF sensor has of a pulse heated wire and a single temperature sensor downstream of the wire. This single temperature sensor arrangement allows the accurate measurement of gas velocities much lower than the previously demonstrated limit of 0.3 m/s. The TOF sensor combined with a nozzle creates a new device such that the TOF measured with this device provides a measure of the gas flow rate rather than just the gas velocity. More than one nozzle in series is combined to achieve high flow measuring ranges. Compensation for variations in the thermophysical properties of the gas being metered is provided by pulsing the heated wire and measuring sensor outputs when both are immersed in the gas at zero velocity.

Abstract: A passive superconductor bearing system and process for supporting a rotating member uses permanent magnets in the bore of the rotating member, stationary permanent magnets which encircle the shaft, superconducting materials at the shaft ends, and a duct and pinhole outlet which directs a flow of gas towards one shaft end. The stationary permanent magnets interact with the permanent magnets in the shaft to radially position the shaft in the center of the stationary permanent magnets due to radial repulsive forces between poles of the same polarity. In order to enhance stability, a gas jet is directed towards one end of the shaft to counteract the unbalancing axial force on the shaft caused by permanent magnet interaction. The superconductor-magnet interaction generates a restoring force as the shaft is transversely displaced in any direction away from its equilibrium position. The interaction does not assist shaft rotation, but adds to the stiffness and damping of the bearing system.

Abstract: The present invention provides a wide range fluid flowmeter, having a body with a central air flow passage and a target in the air flow passage to direct fluid flow to one of the first and second flow loops. The fluid alternates between the first and second flow loops to create an oscillatory system, whose frequency can be measured to determine fluid flow rate. A preferred frequency measuring device is a piezoelectric diaphragm provided within the body of the flowmeter. In a preferred embodiment, a low flow rate sensor is provided in a nozzle of the flowmeter proximal the inlet to the body of the oscillatory, high flow rate flowmeter. The low flow rate sensor can incorporate a convection system which measures flow rates beyond the lower scale of the oscillatory flowmeter, thereby providing an apparatus and a method for measuring flow rates in a compact flowmeter, and with greater efficiency than previous apparatuses and methods.