Patents by Inventor Sukhvinder Singh Dhanjal

Sukhvinder Singh Dhanjal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8109430
    Abstract: In one aspect the invention provides a method of cleaning molten solder from the hot tip of a soldering iron that does not require a water-laden sponge. The hot tip of the iron is wiped against a block of dry open-celled melamine foam. The block is formed with an inclined through-hole that leads to the bottom of a receptacle holding the block. The hot tip is wiped against the foam surrounding an upper end of the through-hole, and the molten solder removed from the tip accumulates in the receptacle below.
    Type: Grant
    Filed: December 10, 2010
    Date of Patent: February 7, 2012
    Inventor: Sukhvinder Singh Dhanjal
  • Publication number: 20110132399
    Abstract: In one aspect the invention provides a method of cleaning molten solder from the hot tip of a soldering iron that does not require a water-laden sponge. The hot tip of the iron is wiped against a block of dry open-celled melamine foam. The block is formed with an inclined through-hole that leads to the bottom of a receptacle holding the block. The hot tip is wiped against the foam surrounding an upper end of the through-hole, and the molten solder removed from the tip accumulates in the receptacle below.
    Type: Application
    Filed: December 10, 2010
    Publication date: June 9, 2011
    Inventor: Sukhvinder Singh DHANJAL
  • Patent number: 7870990
    Abstract: In one aspect the invention provides a method of cleaning molten solder from the hot tip of a soldering iron that does not require a water-laden sponge. The hot tip of the iron is wiped against a block of dry open-celled melamine foam. The block is formed with an inclined through-hole that leads to the bottom of a receptacle holding the block. The hot tip is wiped against the foam surrounding an upper end of the through-hole, and the molten solder removed from the tip accumulates in the receptacle below.
    Type: Grant
    Filed: April 29, 2005
    Date of Patent: January 18, 2011
    Inventor: Sukhvinder Singh Dhanjal