Abstract: A system for treating tissue including a clip assembly including a pair of clip arms, a proximal end of each of the clip arms slidably received within a channel of a capsule and moveable between a tissue receiving configuration and a tissue clipping configuration. The system also including an applicator releasably coupleable to the clip assembly, the applicator including a control member connectable to the proximal end of each of the clip arms and a locking sleeve coupleable to a proximal end of the capsule via a deflectable tab including an engaging structure configured to engage a corresponding engaging structure at the proximal end of the capsule and a releasing structure proximal of the engaging structure, the releasing structure engagable with a portion of the control member to deflect the deflectable member and disengage the engaging structure of the locking sleeve from the corresponding engaging structure of the capsule.

Abstract: The present disclosure describes methods and apparatus for detecting handover failures at an AP when the AP does not have an X2 interface with at least one of its neighbors. For example, methods are provided for detecting handover failures at an AP based on at least on a UE context release command message received from a mobile management entity (MME) and/or determining that a radio resource control (RRC) connection reconfiguration (RCR) message is not delivered to the UE.

Abstract: The present disclosure describes methods and apparatus for detecting handover failures at an AP when the AP does not have an X2 interface with at least one of its neighbors. For example, methods are provided for detecting handover failures at an AP based on at least on a UE context release command message received from a mobile management entity (MME) and/or determining that a radio resource control (RRC) connection reconfiguration (RCR) message is not delivered to the UE.

Abstract: A cloud-based migration system exposes a source-independent application programming interface for receiving data to be migrated. The data is uploaded and stored as a single entity in a cloud-based storage system.

Abstract: A method of forming a doped region in a semiconductor layer of a substrate by alloying with doping elements is disclosed. In one aspect, the method includes screen printing a paste layer of doping element paste to the substrate and firing the screen printed paste layer of doping element paste, wherein a highly pure doping element layer is applied to the semiconductor layer after which the paste layer is screen printed to the doping element layer.

Abstract: Migration of a virtual machine from a source host to a destination host is controlled by referring to a graph data structure wherein one or more hosts are associated with at least some of the nodes of the graph data structure, a source node being associated with the source host and a destination node being associated with the destination host, and in which each link of the graph data structure is ascribed at least a permission value associated with the virtual machine, to determine if traversal of a path from the source node to the destination node is permitted by the permission values of the links in the path. Migration of said virtual machine is allowed if traversal from said source node to said destination node along the path is permitted.

Abstract: A non-reopening clamp including two arms hingedly connected, each arm having a clamping portion such that relative rotation of the arms brings the clamping portions into clamping engagement, wherein the arms include a locking mechanism for locking the clamping portions together. Access to the locking mechanism may be prevented by a shield, to prevent a user from re-opening the clamp.

Abstract: In one aspect the invention provides a method of cleaning molten solder from the hot tip of a soldering iron that does not require a water-laden sponge. The hot tip of the iron is wiped against a block of dry open-celled melamine foam. The block is formed with an inclined through-hole that leads to the bottom of a receptacle holding the block. The hot tip is wiped against the foam surrounding an upper end of the through-hole, and the molten solder removed from the tip accumulates in the receptacle below.

Abstract: A method of forming a doped region in a semiconductor layer of a substrate by alloying with doping elements is disclosed. In one aspect, the method includes screen printing a paste layer of doping element paste to the substrate and firing the screen printed paste layer of doping element paste, wherein a highly pure doping element layer is applied to the semiconductor layer after which the paste layer is screen printed to the doping element layer.

Abstract: In one aspect the invention provides a method of cleaning molten solder from the hot tip of a soldering iron that does not require a water-laden sponge. The hot tip of the iron is wiped against a block of dry open-celled melamine foam. The block is formed with an inclined through-hole that leads to the bottom of a receptacle holding the block. The hot tip is wiped against the foam surrounding an upper end of the through-hole, and the molten solder removed from the tip accumulates in the receptacle below.

Abstract: A method and computing system for controlling access by a user to a computing resource located in respective source and destination domains in a hierarchy of domains. The method comprises establishing a path of domains in the hierarchy from the source domain to the destination domain, specifying for at least one domain in the path preceding the destination domain whether traversal to a successive domain in the path is permitted, and providing to the user access to the computing resource if traversal from the source domain to the destination domain along the path is permitted.

Abstract: Migration of a virtual machine from a source host to a destination host is controlled by referring to a graph data structure wherein one or more hosts are associated with at least some of the nodes of the graph data structure, a source node being associated with the source host and a destination node being associated with the destination host, and in which each link of the graph data structure is ascribed at least a permission value associated with the virtual machine, to determine if traversal of a path from the source node to the destination node is permitted by the permission values of the links in the path. Migration of said virtual machine is allowed if traversal from said source node to said destination node along the path is permitted.

Abstract: In one aspect the invention provides a method of cleaning molten solder from the hot tip of a soldering iron that does not require a water-laden sponge. The hot tip of the iron is wiped against a block of dry open-celled melamine foam. The block is formed with an inclined through-hole that leads to the bottom of a receptacle holding the block. The hot tip is wiped against the foam surrounding an upper end of the through-hole, and the molten solder removed from the tip accumulates in the receptacle below.

Abstract: A method and computing system for controlling access by a user to a computing resource located in respective source and destination domains in a hierarchy of domains. The method comprises establishing a path of domains in the hierarchy from the source domain to the destination domain, specifying for at least one domain in the path preceding the destination domain whether traversal to a successive domain in the path is permitted, and providing to the user access to the computing resource if traversal from the source domain to the destination domain along the path is permitted.

Abstract: A piston formed from an Al alloy, such as an Al—Si alloy, has wear resistant coating applied to a predetermined portion of the outer surface. The predetermined portion of the outer surface preferably includes the piston skirt. The coating includes an adhesion promoting primer layer of a silane and a polymer coating layer. The silane primer coating promotes adhesion between the Al-alloy and the polymer coating.

Abstract: A computer comprises a chassis having an inner surface and an outer surface and a processing device contained within the chassis. A portion of the chassis inner surface is positioned proximate to the processing device, and a sheet of thermally conductive interface material is positioned between and contacts the processing device and the inner surface portion to thermally couple the processing device to the chassis so that the heat generated by the processing device is delivered to the chassis. The outer surface of the chassis is configured, such as with fins, for dissipating heat from the chassis. A phase-change material is positioned on the inner surface of the chassis and absorbs heat to further assist the chassis in heat dissipation.

Abstract: A computer comprises a chassis having an inner surface and an outer surface and a processing device contained within the chassis. A portion of the chassis inner surface is positioned proximate to the processing device, and a sheet of thermally conductive interface material is positioned between and contacts the processing device and the inner surface portion to thermally couple the processing device to the chassis so that the heat generated by the processing device is delivered to the chassis. The outer surface of the chassis is configured, such as with fins, for dissipating heat from the chassis. A phase-change material is positioned on the inner surface of the chassis and absorbs heat to further assist the chassis in heat dissipation.

Abstract: Aluminum heatsinks are plated with a solderable layer and are overplated with a solder release layer. The release layer comprises a tin-lead-indium alloy. The heatsinks are mounted on individual IC modules or banks of IC modules that are interconnected to a printed circuit card. A mechanically compliant, thermally conductive adhesive is used to join the heatsinks to the modules. An oxide formed on the release layer readily bonds with the thermally conductive adhesive. In the event that heatsinks need to be removed to repair or rework the modules, local heat may be applied to melt the release layer to remove a heatsink without need for use of significant applied torque and normal forces. Because the release layer has a low melting point that affords easy separation from the adhesive layer, both component delaminations and the partial reflow or melting of solder joints on adjacent components are eliminated from the heatsink removal process.

Abstract: An array of electronic modules on the top of a circuit board is cooled by a heat sink secured to the bottom of the board. Vias transfer heat through the board to a compliant interface pad which permits heat to flow to the heat sink while maintaining electrical isolation between the vias. The heat sink is held on the board by push pin assemblies including springs that compress the interface pad between the circuit board and the heat sink. The body of each push pin assembly includes flexing legs supporting locking barbs, and flex of the legs is limited by a strut defining a closed end slot in the shank of the body.

Abstract: A cooling system for a host device affords enhanced reliability using multiple blower units mounted in parallel between a low pressure plenum and a high pressure plenum and a control system that senses when a blower unit is failing or has failed and responds by shutting down the failed unit and increasing the speed of the remaining blowers to maintain the air flow volume delivered to the cooling path. To maintain the integrity of the cooling air path while affording continuous operation of the host device, a spring biased closure door seals the access opening through which the blower is mounted when a blower unit is removed and displaced by the blower unit to an inoperative position against the biasing force of the spring when the blower unit is installed or replaced. To prevent recirculation through a vacated blower unit mounting space, a one way air flow device, in the form of a shutter assembly including plural pivoting louvers or vanes is mounted at the exhaust location of each blower.