Abstract: A device including an interface with peripherals includes a first interface that receives a request from a host, a second interface that periodically receives at least one first sample input from the peripherals in response to the request from the host, a memory that stores an active time table including a processing time of a sample input provided by each of the peripherals in each of a plurality of operating conditions respectively corresponding to different power consumptions, and a processing circuit that identifies at least one of the plurality of operating conditions based on the active time table and a period of the at least one first sample input.

Abstract: A method of forming a molded interconnect device (MID) is provided. The method includes the steps of performing a molding stage, performing a circuit forming stage, and performing a plate stage. As a part of the molding stage, a palladium-catalyzed material is injection molded into a palladium-catalyzed substrate of a desired shape. As a part of the circuit forming stage, both a metallization step and a circuit patterning step are performed. As a part of the plating stage, both an electrolytic plating step and a circuit isolation step are performed.

Abstract: In some embodiments, a manufacturing process includes injection molding a palladium-catalyzed material into a substrate, forming a thin copper film over exterior and exposed surfaces of the substrate; ablating or removing copper film from the substrate to provide first, second and optional third portions of the copper film and ablated sections; electrolytically plating each portion to form metallic-plated portions; and ablating or removing the second portion in order to isolate the first portion. The metallic-plated first portion comprises a circuit portion of a molded interconnect device (MID), and where the metallic-plated third portion comprises a Faraday cage portion of a MID. A soft etching step may be included. A solder resist application step can be added, along with an associated solder resist removal step.

Abstract: A device including an interface with peripherals includes a first interface that receives a request from a host, a second interface that periodically receives at least one first sample input from the peripherals in response to the request from the host, a memory that stores an active time table including a processing time of a sample input provided by each of the peripherals in each of a plurality of operating conditions respectively corresponding to different power consumptions, and a processing circuit that identifies at least one of the plurality of operating conditions based on the active time table and a period of the at least one first sample input.

Abstract: In some embodiments, a manufacturing process includes injection molding a palladium-catalyzed material into a substrate, forming a thin copper film over exterior and exposed surfaces of the substrate; ablating or removing copper film from the substrate to provide first, second and optional third portions of the copper film and ablated sections; electrolytically plating each portion to form metallic-plated portions; and ablating or removing the second portion in order to isolate the first portion. The metallic-plated first portion comprises a circuit portion of a molded interconnect device (MID), and where the metallic-plated third portion comprises a Faraday cage portion of a MID. A soft etching step may be included. A solder resist application step can be added, along with an associated solder resist removal step.