Abstract: A memory device including a parity check circuit and a mask circuit may be provided. The parity check circuit may perform parity check on data sampled according to a data strobe signal, which does not include a post-amble. The mask circuit may generate a parity error signal based on results of the parity check, and output the parity error signal during a time period determined according to a burst length of the data.

Abstract: A delay locked loop circuit includes a duty detector configured to detect a duty cycle of a clock signal, and to determine whether to perform a coarse duty cycle correction based on the detected duty, and a delay locked loop core. The delay locked loop core is configured to selectively perform the coarse duty cycle correction for the clock signal according to the determination of the duty detector, perform a coarse lock for the clock signal during a first time period different from a second time period in which the coarse duty cycle correction is performed, and perform a fine duty cycle correction and a fine lock for the clock signal.

Abstract: A semiconductor device includes a decoder configured to receive an extended mode register set (EMRS) code including specific information, and decode the received EMRS code to acquire the specific information; a peripheral controller configured to generate a control signal based on the specific information; and a peripheral region including a plurality of buffers, the plurality of buffers being configured to be controlled by the control signal, wherein the specific information includes information indicating an expected bandwidth of input data that is to be input to one of the plurality of buffers.

Abstract: Disclosed are a method and a device for detecting a short circuit between adjacent micro-bumps. The method includes setting outputs of a pull-up driver and a pull-down driver of a data output circuit connected with a micro-bump to be suitable for a test type and determining whether a short circuit is generated.

Abstract: A delay locked loop circuit includes a duty detector configured to detect a duty cycle of a clock signal, and to determine whether to perform a coarse duty cycle correction based on the detected duty, and a delay locked loop core. The delay locked loop core is configured to selectively perform the coarse duty cycle correction for the clock signal according to the determination of the duty detector, perform a coarse lock for the clock signal during a first time period different from a second time period in which the coarse duty cycle correction is performed, and perform a fine duty cycle correction and a fine lock for the clock signal.

Abstract: A memory device including a parity check circuit and a mask circuit may be provided. The parity check circuit may perform parity check on data sampled according to a data strobe signal, which does not include a post-amble. The mask circuit may generate a parity error signal based on results of the parity check, and output the parity error signal during a time period determined according to a burst length of the data.

Abstract: A semiconductor device includes a decoder configured to receive an extended mode register set (EMRS) code including specific information, and decode the received EMRS code to acquire the specific information; a peripheral controller configured to generate a control signal based on the specific information; and a peripheral region including a plurality of buffers, the plurality of buffers being configured to be controlled by the control signal, wherein the specific information includes information indicating an expected bandwidth of input data that is to be input to one of the plurality of buffers.

Abstract: A memory device including a parity check circuit and a mask circuit may be provided. The parity check circuit may perform parity check on data sampled according to a data strobe signal, which does not include a post-amble. The mask circuit may generate a parity error signal based on results of the parity check, and output the parity error signal during a time period determined according to a burst length of the data.

Abstract: A semiconductor device includes a decoder configured to receive an extended mode register set (EMRS) code including specific information, and decode the received EMRS code to acquire the specific information; a peripheral controller configured to generate a control signal based on the specific information; and a peripheral region including a plurality of buffers, the plurality of buffers being configured to be controlled by the control signal, wherein the specific information includes information indicating an expected bandwidth of input data that is to be input to one of the plurality of buffers.

Abstract: Disclosed are a method and a device for detecting a short circuit between adjacent micro-bumps. The method includes setting outputs of a pull-up driver and a pull-down driver of a data output circuit connected with a micro-bump to be suitable for a test type and determining whether a short circuit is generated.

Abstract: Disclosed are a method and a device for detecting a short circuit between adjacent micro-bumps. The method includes setting outputs of a pull-up driver and a pull-down driver of a data output circuit connected with a micro-bump to be suitable for a test type and determining whether a short circuit is generated.

Abstract: A memory device including a command window generator is provided. The command window generator is configured to generate a delay signal by converting a delay time between a clock signal input to a write path circuit and a clock signal output to a write path replica circuit into a number of cycles of an internal clock signal, by using the write path circuit and the write path replica circuit, and generate a command window to correspond to a data window using the delay signal. The delay window may correspond to a burst length of write data.

Abstract: A memory module includes a first memory device including a first one-die termination circuit for impedance matching of a signal path and a second memory device sharing the signal path with the first memory device and including a second on-die termination circuit for impedance matching of the signal path, wherein the signal path corresponds to a command or address signal path provided from a host, and the first and second on-die termination circuits are individually controlled according to control of the host.

Abstract: A delay circuit of a semiconductor memory device includes a delay chain, a first phase converter and a second phase converter. The delay chain is connected between an input terminal and an output terminal, includes 2N delay cells, and delays a first intermediate signal to generate a second intermediate signal. The first phase converter is connected to the input terminal, and provides the first intermediate signal to the delay chain, wherein the first intermediate signal is generated by inverting a phase of an input signal or by maintaining the phase of the input signal in response to a control signal. The second phase converter is connected to the output terminal, and generates an output signal by inverting a phase of the second intermediate signal or by maintaining the phase of the second intermediate signal in response to the control signal.

Abstract: An input-output circuit includes a reception circuit and a register circuit. The reception circuit operates in accordance with a normal write protocol commonly in a normal write mode and a test write mode. The reception circuit receives a plurality of input signals to generate a plurality of latch signals. The register circuit generates a plurality of test result signals based on the latch signals in the test write mode. The input-output circuit may perform the multiple-input shift register (MISR) function in accordance with the normal write path and the normal write protocol. The MISR function may be performed efficiently without consideration of additional timing adjustment for the test write operation because the MISR function is performed under the same timing condition as the normal write operation.

Abstract: A memory device including an interposer including a first plurality of paths and a second plurality of paths, a first memory die attached to a first surface of the interposer, the first memory die including a first physical layer connected to the first plurality of paths, the first physical layer being attached to a first surface of the interposer, and a second memory die attached to a second surface of the interposer, the second memory die including a second physical layer connected to the second plurality of paths, the second physical layer being attached to a second surface of the interposer, the second physical layer not interfering with the first physical layer in a plan view may be provided.

Abstract: A memory device including a command window generator is provided. The command window generator is configured to generate a delay signal by converting a delay time between a clock signal input to a write path circuit and a clock signal output to a write path replica circuit into a number of cycles of an internal clock signal, by using the write path circuit and the write path replica circuit, and generate a command window to correspond to a data window using the delay signal. The delay window may correspond to a burst length of write data.

Abstract: A delay circuit of a semiconductor memory device includes a delay chain, a first phase converter and a second phase converter. The delay chain is connected between an input terminal and an output terminal, includes 2N delay cells, and delays a first intermediate signal to generate a second intermediate signal. The first phase converter is connected to the input terminal, and provides the first intermediate signal to the delay chain, wherein the first intermediate signal is generated by inverting a phase of an input signal or by maintaining the phase of the input signal in response to a control signal. The second phase converter is connected to the output terminal, and generates an output signal by inverting a phase of the second intermediate signal or by maintaining the phase of the second intermediate signal in response to the control signal.

Abstract: A memory device including a parity check circuit and a mask circuit may be provided. The parity check circuit may perform parity check on data sampled according to a data strobe signal, which does not include a post-amble. The mask circuit may generate a parity error signal based on results of the parity check, and output the parity error signal during a time period determined according to a burst length of the data.

Abstract: An input-output circuit includes a reception circuit and a register circuit. The reception circuit operates in accordance with a normal write protocol commonly in a normal write mode and a test write mode. The reception circuit receives a plurality of input signals to generate a plurality of latch signals. The register circuit generates a plurality of test result signals based on the latch signals in the test write mode. The input-output circuit may perform the multiple-input shift register (MISR) function in accordance with the normal write path and the normal write protocol. The MISR function may be performed efficiently without consideration of additional timing adjustment for the test write operation because the MISR function is performed under the same timing condition as the normal write operation.