Patents by Inventor Sullivan Do

Sullivan Do has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240089644
    Abstract: In at least one embodiment, a microphone assembly including a substrate, a printed circuit board (PCB), a micro-electro-mechanical systems (MEMS) transducer, a first lid, and a second lid is provided. The substrate defines a first port that extends completely therethrough. The PCB defines a sound opening that extends completely therethrough. The MEMS transducer is positioned on a first side of the substrate. The first lid defines a second port and covers the MEMS transducer and the first port. The first lid and the substrate define a front volume of air that surrounds the MEMS transducer. The second lid is positioned on the second side of the PCB. A cavity of the second lid, the sound opening of the PCB, the sound opening of the PCB, and the first port of the substrate define a back volume of air that is greater than the front volume of air.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 14, 2024
    Inventors: Sullivan DO, Yu DU
  • Patent number: 11863925
    Abstract: In at least one embodiment, a microphone assembly including a substrate, a printed circuit board (PCB), a micro-electro-mechanical systems (MEMS) transducer, a first lid, and a second lid is provided. The substrate defines a first port that extends completely therethrough. The PCB defines a sound opening that extends completely therethrough. The MEMS transducer is positioned on a first side of the substrate. The first lid defines a second port and covers the MEMS transducer and the first port. The first lid and the substrate define a front volume of air that surrounds the MEMS transducer. The second lid is positioned on the second side of the PCB. A cavity of the second lid, the sound opening of the PCB, the sound opening of the PCB, and the first port of the substrate define a back volume of air that is greater than the front volume of air.
    Type: Grant
    Filed: October 12, 2021
    Date of Patent: January 2, 2024
    Assignee: Harman International Industries, Incorporated
    Inventors: Sullivan Do, Yu Du
  • Patent number: 11827162
    Abstract: Methods and systems are provided for a vehicle headliner. In one example, a method for forming the headliner includes forming a recess and an opening for a support structure in a base substrate layer of the headliner during heat treatment of the base substrate layer. The method further includes inserting the support structure in the recess and the opening and covering the base substrate layer with a skin. A positioning of the support structure within the base substrate layer allows an outline of the support structure to be undetectable through the skin by sight or touch.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: November 28, 2023
    Assignee: HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
    Inventor: Sullivan Do
  • Patent number: 11787351
    Abstract: Methods and systems for a vehicle headliner is provided. In one example, the headliner is a layered assembly, including a base substrate layer and a skin and is configured with a bracket inserted into the base substrate layer. The bracket has a top plate co-planar with a first surface of the base substrate layer and a continuous wall coupled to the top plate. The bracket is positioned in the base substrate layer such that the base substrate layer does not protrude into the skin.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: October 17, 2023
    Assignee: HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
    Inventor: Sullivan Do
  • Publication number: 20230114156
    Abstract: In at least one embodiment, a microphone assembly including a substrate, a printed circuit board (PCB), a micro-electro-mechanical systems (MEMS) transducer, a first lid, and a second lid is provided. The substrate defines a first port that extends completely therethrough. The PCB defines a sound opening that extends completely therethrough. The MEMS transducer is positioned on a first side of the substrate. The first lid defines a second port and covers the MEMS transducer and the first port. The first lid and the substrate define a front volume of air that surrounds the MEMS transducer. The second lid is positioned on the second side of the PCB. A cavity of the second lid, the sound opening of the PCB, the sound opening of the PCB, and the first port of the substrate define a back volume of air that is greater than the front volume of air.
    Type: Application
    Filed: October 12, 2021
    Publication date: April 13, 2023
    Inventors: Sullivan Do, Yu Du
  • Publication number: 20220134966
    Abstract: Methods and systems are provided for a vehicle headliner. In one example, a method for forming the headliner includes forming a recess and an opening for a support structure in a base substrate layer of the headliner during heat treatment of the base substrate layer. The method further includes inserting the support structure in the recess and the opening and covering the base substrate layer with a skin. A positioning of the support structure within the base substrate layer allows an outline of the support structure to be undetectable through the skin by sight or touch.
    Type: Application
    Filed: October 30, 2020
    Publication date: May 5, 2022
    Inventor: Sullivan Do
  • Publication number: 20220134967
    Abstract: Methods and systems for a vehicle headliner is provided. In one example, the headliner is a layered assembly, including a base substrate layer and a skin and is configured with a bracket inserted into the base substrate layer. The bracket has a top plate co-planar with a first surface of the base substrate layer and a continuous wall coupled to the top plate. The bracket is positioned in the base substrate layer such that the base substrate layer does not protrude into the skin.
    Type: Application
    Filed: October 30, 2020
    Publication date: May 5, 2022
    Inventor: Sullivan Do