Abstract: A membrane for covering a peripheral surface of a stent is provided, the membrane including a plurality of line openings formed therein. Each line opening may be a straight line opening, for example in the form of a slit, a curved line opening, or any line opening of a suitable shape or curvature, e.g. U-shaped or V-shaped. Blood pressure opens the slits to allow blood to flow through the membrane, while curved line openings create a flap in the membrane that can open to allow blood to pass through. According to further embodiments of the present invention, a method of forming a membrane on a stent and a device for use in a blood vessel are provided.

Abstract: A method of culturing cells or tissues is provided. The method comprises a) providing a support, wherein the support is an optical medium with a patterned surface; b) contacting the support with cells and a culture medium; and c) culturing the cells under suitable cultivation conditions. A device for cell or tissue culture comprising an optical medium, wherein a patterned surface of the optical medium forms a support upon which cells are cultivated, is also provided.

Abstract: A membrane for covering a peripheral surface of a stent is provided, the membrane including a plurality of line openings formed therein. Each line opening may be a straight line opening, for example in the form of a slit, a curved line opening, or any line opening of a suitable shape or curvature, e.g. U-shaped or V-shaped. Blood pressure opens the slits to allow blood to flow through the membrane, while curved line openings create a flap in the membrane that can open to allow blood to pass through. According to further embodiments of the present invention, a method of forming a membrane on a stent and a device for use in a blood vessel are provided.

Abstract: A method of making a substrate includes providing an upper insulative layer and a lower insulative layer, wherein the upper insulative layer includes an inlet opening, the lower insulative layer includes a channel, and the inlet opening is in fluid communication with the channel, flowing a non-solidified material through the inlet opening into the channel, and then solidifying the non-solidified material by applying energy to the non-solidified material, thereby forming embedded metallization in the channel. The substrate can be a microfluidic device, an electrical interconnect or other electronic devices.