Abstract: An integrated circuit device is provided. In some examples, an integrated circuit die of the device includes a first capacitor arranged such that when the integrated circuit die is coupled to a package, the package affects a capacitance of the first capacitor, a second capacitor disposed directly underneath the first capacitor, and a capacitance measurement circuit coupled to the first capacitor and the second capacitor to determine the capacitance of the first capacitor and a capacitance of the second capacitor. The integrated circuit device may detect tampering with the die and/or the package based on the capacitances of the first capacitor and the second capacitor.