Patents by Inventor Suman Cherian
Suman Cherian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11231386Abstract: A compact microelectronic gas sensor module includes electrical contacts formed in such a way that they do not consume real estate on an integrated circuit chip. Using such a design, the package can be miniaturized further. The gas sensor is packaged together with a custom-designed Application Specific Integrated Circuit (ASIC) that provides circuitry for processing sensor signals to identify gas species within a sample under test. In one example, the output signal strength of the sensor is enhanced by providing an additional metal surface area in the form of pillars exposed to an electrolytic gas sensing compound, while reducing the overall package size. In some examples, bottom side contacts are formed on the underside of the substrate on which the gas sensor is formed. Sensor electrodes may be electrically coupled to the ASIC directly, or indirectly by vias.Type: GrantFiled: November 14, 2017Date of Patent: January 25, 2022Assignee: STMicroelectronics Pte LtdInventors: Jerome Teysseyre, Yonggang Jin, Suman Cherian
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Patent number: 11009477Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed.Type: GrantFiled: April 29, 2019Date of Patent: May 18, 2021Assignee: STMicroelectronics Pte Ltd.Inventors: Olivier Le Neel, Ravi Shankar, Suman Cherian, Calvin Leung, Tien-Choy Loh, Shian-Yeu Kam
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Patent number: 10905362Abstract: A universal electrochemical micro-sensor can be used either as a biosensor or an environmental sensor. Because of its small size and flexibility, the micro-sensor is suitable for continuous use to monitor fluids within a live subject, or as an environmental monitor. The micro-sensor can be formed on a reusable glass carrier substrate. A flexible polymer backing, together with a set of electrodes, forms a reservoir that contains an electrolytic fluid chemical reagent. During fabrication, the glass carrier substrate protects the fluid chemical reagent from degradation. A conductive micromesh further contains the reagent while allowing partial exposure to the ambient biological or atmospheric environment. The micromesh density can be altered to accommodate fluid reagents having different viscosities. Flexibility is achieved by attaching a thick polymer tape and peeling away the micro-sensor from the glass carrier substrate.Type: GrantFiled: May 8, 2019Date of Patent: February 2, 2021Assignee: STMICROELECTRONICS PTE. LTD.Inventors: Olivier Le Neel, Suman Cherian, Calvin Leung
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Publication number: 20190261899Abstract: A universal electrochemical micro-sensor can be used either as a biosensor or an environmental sensor. Because of its small size and flexibility, the micro-sensor is suitable for continuous use to monitor fluids within a live subject, or as an environmental monitor. The micro-sensor can be formed on a reusable glass carrier substrate. A flexible polymer backing, together with a set of electrodes, forms a reservoir that contains an electrolytic fluid chemical reagent. During fabrication, the glass carrier substrate protects the fluid chemical reagent from degradation. A conductive micromesh further contains the reagent while allowing partial exposure to the ambient biological or atmospheric environment. The micromesh density can be altered to accommodate fluid reagents having different viscosities. Flexibility is achieved by attaching a thick polymer tape and peeling away the micro-sensor from the glass carrier substrate.Type: ApplicationFiled: May 8, 2019Publication date: August 29, 2019Inventors: Olivier LE NEEL, Suman CHERIAN, Calvin LEUNG
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Publication number: 20190257780Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed.Type: ApplicationFiled: April 29, 2019Publication date: August 22, 2019Inventors: Olivier LE NEEL, Ravi Shankar, Suman Cherian, Calvin Leung, Tien-Choy Loh, Shian-Yeu Kam
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Patent number: 10317357Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed.Type: GrantFiled: September 11, 2018Date of Patent: June 11, 2019Assignee: STMicroelectronics Pte Ltd.Inventors: Olivier Le Neel, Ravi Shankar, Suman Cherian, Calvin Leung, Tien-Choy Loh, Shian-Yeu Kam
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Patent number: 10299711Abstract: A universal electrochemical micro-sensor can be used either as a biosensor or an environmental sensor. Because of its small size and flexibility, the micro-sensor is suitable for continuous use to monitor fluids within a live subject, or as an environmental monitor. The micro-sensor can be formed on a reusable glass carrier substrate. A flexible polymer backing, together with a set of electrodes, forms a reservoir that contains an electrolytic fluid chemical reagent. During fabrication, the glass carrier substrate protects the fluid chemical reagent from degradation. A conductive micromesh further contains the reagent while allowing partial exposure to the ambient biological or atmospheric environment. The micromesh density can be altered to accommodate fluid reagents having different viscosities. Flexibility is achieved by attaching a thick polymer tape and peeling away the micro-sensor from the glass carrier substrate.Type: GrantFiled: January 17, 2018Date of Patent: May 28, 2019Assignee: STMICROELECTRONICS PTE. LTD.Inventors: Olivier Le Neel, Suman Cherian, Calvin Leung
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Publication number: 20190025236Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed.Type: ApplicationFiled: September 11, 2018Publication date: January 24, 2019Inventors: Olivier Le Neel, Ravi Shankar, Suman Cherian, Calvin Leung, Tien-Choy Loh, Shian-Yeu Kam
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Patent number: 10094797Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed.Type: GrantFiled: May 25, 2017Date of Patent: October 9, 2018Assignee: STMICROELECTRONICS PTE LTD.Inventors: Olivier Le Neel, Ravi Shankar, Suman Cherian, Calvin Leung, Tien-Choy Loh, Shian-Yeu Kam
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Publication number: 20180140234Abstract: A universal electrochemical micro-sensor can be used either as a biosensor or an environmental sensor. Because of its small size and flexibility, the micro-sensor is suitable for continuous use to monitor fluids within a live subject, or as an environmental monitor. The micro-sensor can be formed on a reusable glass carrier substrate. A flexible polymer backing, together with a set of electrodes, forms a reservoir that contains an electrolytic fluid chemical reagent. During fabrication, the glass carrier substrate protects the fluid chemical reagent from degradation. A conductive micromesh further contains the reagent while allowing partial exposure to the ambient biological or atmospheric environment. The micromesh density can be altered to accommodate fluid reagents having different viscosities. Flexibility is achieved by attaching a thick polymer tape and peeling away the micro-sensor from the glass carrier substrate.Type: ApplicationFiled: January 17, 2018Publication date: May 24, 2018Inventors: Olivier LE NEEL, Suman CHERIAN, Calvin LEUNG
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Patent number: 9918667Abstract: A universal electrochemical micro-sensor can be used either as a biosensor or an environmental sensor. Because of its small size and flexibility, the micro-sensor is suitable for continuous use to monitor fluids within a live subject, or as an environmental monitor. The micro-sensor can be formed on a reusable glass carrier substrate. A flexible polymer backing, together with a set of electrodes, forms a reservoir that contains an electrolytic fluid chemical reagent. During fabrication, the glass carrier substrate protects the fluid chemical reagent from degradation. A conductive micromesh further contains the reagent while allowing partial exposure to the ambient biological or atmospheric environment. The micromesh density can be altered to accommodate fluid reagents having different viscosities. Flexibility is achieved by attaching a thick polymer tape and peeling away the micro-sensor from the glass carrier substrate.Type: GrantFiled: March 7, 2014Date of Patent: March 20, 2018Assignee: STMICROELECTRONICS PTE. LTD.Inventors: Olivier Le Neel, Suman Cherian, Calvin Leung
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Publication number: 20180067074Abstract: A compact microelectronic gas sensor module includes electrical contacts formed in such a way that they do not consume real estate on an integrated circuit chip. Using such a design, the package can be miniaturized further. The gas sensor is packaged together with a custom-designed Application Specific Integrated Circuit (ASIC) that provides circuitry for processing sensor signals to identify gas species within a sample under test. In one example, the output signal strength of the sensor is enhanced by providing an additional metal surface area in the form of pillars exposed to an electrolytic gas sensing compound, while reducing the overall package size. In some examples, bottom side contacts are formed on the underside of the substrate on which the gas sensor is formed. Sensor electrodes may be electrically coupled to the ASIC directly, or indirectly by vias.Type: ApplicationFiled: November 14, 2017Publication date: March 8, 2018Inventors: Jerome Teysseyre, Yonggang Jin, Suman Cherian
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Patent number: 9851328Abstract: A compact microelectronic gas sensor module includes electrical contacts formed in such a way that they do not consume real estate on an integrated circuit chip. Using such a design, the package can be miniaturized further. The gas sensor is packaged together with a custom-designed Application Specific Integrated Circuit (ASIC) that provides circuitry for processing sensor signals to identify gas species within a sample under test. In one example, the output signal strength of the sensor is enhanced by providing an additional metal surface area in the form of pillars exposed to an electrolytic gas sensing compound, while reducing the overall package size. In some examples, bottom side contacts are formed on the underside of the substrate on which the gas sensor is formed. Sensor electrodes may be electrically coupled to the ASIC directly, or indirectly by vias.Type: GrantFiled: August 18, 2014Date of Patent: December 26, 2017Assignee: STMICROELECTRONICS PTE LTDInventors: Jerome Teysseyre, Yonggang Jin, Suman Cherian
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Publication number: 20170261458Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed.Type: ApplicationFiled: May 25, 2017Publication date: September 14, 2017Inventors: Olivier Le Neel, Ravi Shankar, Suman Cherian, Calvin Leung, Tien-Choy Loh, Shian-Yeu Kam
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Patent number: 9689824Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed.Type: GrantFiled: October 19, 2015Date of Patent: June 27, 2017Assignee: STMICROELECTRONICS PTE LTD.Inventors: Olivier Le Neel, Ravi Shankar, Suman Cherian, Calvin Leung, Tien-Choy Loh, Shian-Yeu Kam
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Patent number: 9618653Abstract: Sensors for air flow, temperature, pressure, and humidity are integrated onto a single semiconductor die within a miniaturized Venturi chamber to provide a microelectronic semiconductor-based environmental multi-sensor module that includes an air flow meter. One or more such multi-sensor modules can be used as building blocks in dedicated application-specific integrated circuits (ASICs) for use in environmental control appliances that rely on measurements of air flow. Furthermore, the sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. By integrating the Venturi chamber with accompanying environmental sensors, correction factors can be obtained and applied to compensate for temporal humidity fluctuations and spatial temperature variation using the Venturi apparatus.Type: GrantFiled: March 29, 2013Date of Patent: April 11, 2017Assignee: STMicroelectronics Pte Ltd.Inventors: Olivier Le Neel, Ravi Shankar, Suman Cherian
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Patent number: 9448198Abstract: Microsensors that include an integrated thermal energy source and an integrated temperature sensor are capable of providing localized heating and temperature control of individual sensing regions within the microsensor. Localized temperature control allows analyte detection to be carried out at the same temperatures or substantially the same temperatures at which the sensor is calibrated. By carrying out the sensing near the calibration temperature, more accurate results can be obtained. In addition, the temperature of the sensing region can be controlled so that chemical reactions involving the analyte in the sensing region occur near their peak reaction rate. Carrying out the sensing near the peak reaction rate improves the sensitivity of the sensor which is important as sensor dimensions decrease and the magnitude of the generated signals decreases.Type: GrantFiled: July 5, 2011Date of Patent: September 20, 2016Assignee: STMICROELECTRONICS PTE LTD.Inventors: Olivier Le Neel, Suman Cherian, Ravi Shankar
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Patent number: 9435763Abstract: A bio-fluid test strip includes a fluid receiving area and a contact pad area for interfacing with a fluid sensing device. The test strip includes a fluid sensing electrodes and a first temperature sensing resistor in the fluid receiving area. The test strip further includes a second temperature sensing resistor in the contact pad area. The first and second temperature sensing resistors together provide an indication of the temperature difference between the fluid sensing area and ambience.Type: GrantFiled: June 27, 2013Date of Patent: September 6, 2016Assignee: STMICROELECTRONICS PTE LTD.Inventors: Olivier Le Neel, Suman Cherian
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Patent number: 9437798Abstract: A bio-fluid sensor is formed by depositing polyimide on a glass substrate. Gold and platinum are deposited on the polyimide and patterned to form fluid sensing electrodes, signal traces, and a temperature sensor. The fluid sensor is then fixed to a flexible tape and peeled off of the glass substrate.Type: GrantFiled: June 27, 2013Date of Patent: September 6, 2016Assignee: STMICROELECTRONICS PTE LTD.Inventors: Olivier Le Neel, Suman Cherian, Calvin Leung, Ravi Shankar, Tien Choy Loh, Shian Yeu Kam
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Publication number: 20160047774Abstract: A compact microelectronic gas sensor module includes electrical contacts formed in such a way that they do not consume real estate on an integrated circuit chip. Using such a design, the package can be miniaturized further. The gas sensor is packaged together with a custom-designed Application Specific Integrated Circuit (ASIC) that provides circuitry for processing sensor signals to identify gas species within a sample under test. In one example, the output signal strength of the sensor is enhanced by providing an additional metal surface area in the form of pillars exposed to an electrolytic gas sensing compound, while reducing the overall package size. In some examples, bottom side contacts are formed on the underside of the substrate on which the gas sensor is formed. Sensor electrodes may be electrically coupled to the ASIC directly, or indirectly by vias.Type: ApplicationFiled: August 18, 2014Publication date: February 18, 2016Inventors: Jerome Teysseyre, Yonggang Jin, Suman Cherian