Patents by Inventor Sumant Rangnathan

Sumant Rangnathan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8570707
    Abstract: The present invention provides several scalable integrated circuit high density capacitors and their layout techniques. The capacitors are scaled, for example, by varying the number of metal layers and/or the area of the metal layers used to from the capacitors. The capacitors use different metallization patterns to form the metal layers, and different via patterns to couple adjacent metal layers. In embodiments, optional shields are included as the top-most and/or bottom-most layers of the capacitors, and/or as side shields, to reduce unwanted parasitic capacitance.
    Type: Grant
    Filed: June 16, 2011
    Date of Patent: October 29, 2013
    Assignee: Broadcom Corporation
    Inventors: Victor Chiu-Kit Fong, Eric Bruce Blecker, Tom W. Kwan, Ning Li, Sumant Rangnathan, Chao Tang, Pieter Vorenkamp
  • Publication number: 20120018843
    Abstract: The present invention provides several scalable integrated circuit high density capacitors and their layout techniques. The capacitors are scaled, for example, by varying the number of metal layers and/or the area of the metal layers used to from the capacitors. The capacitors use different metallization patterns to form the metal layers, and different via patterns to couple adjacent metal layers. In embodiments, optional shields are included as the top-most and/or bottom-most layers of the capacitors, and/or as side shields, to reduce unwanted parasitic capacitance.
    Type: Application
    Filed: June 16, 2011
    Publication date: January 26, 2012
    Applicant: Broadcom Corporation
    Inventors: Victor Chiu-Kit Fong, Eric Bruce Blecker, Tom W. Kwan, Ning Li, Sumant Rangnathan, Chao Tang, Pieter Vorenkamp