Abstract: A magnetic sensor includes a substrate, magnetoresistive effect elements arranged on a surface of the substrate, a first wiring line arranged on a surface of the substrate, an insulation layer configured to cover the magnetoresistive effect elements and the first wiring line, a soft magnetic body arranged on the insulation layer, and a second wiring line arranged on the insulation layer, wherein the magnetoresistive effect elements each extend in a first direction and are arranged while being separated from each other in a second direction orthogonal to the first direction in a case of viewing in plan the substrate, the soft magnetic body includes a first direction extension portion that extends in the first direction, and when viewed in plan, the first direction extension portion is arranged between the magnetoresistive effect elements, and the second wiring line is connected to the first wiring line.

Abstract: A magnetic sensor includes a substrate, magnetoresistive effect elements arranged on a surface of the substrate, a first wiring line arranged on a surface of the substrate, an insulation layer configured to cover the magnetoresistive effect elements and the first wiring line, a soft magnetic body arranged on the insulation layer, and a second wiring line arranged on the insulation layer, wherein the magnetoresistive effect elements each extend in a first direction and are arranged while being separated from each other in a second direction orthogonal to the first direction in a case of viewing in plan the substrate, the soft magnetic body includes a first direction extension portion that extends in the first direction, and when viewed in plan, the first direction extension portion is arranged between the magnetoresistive effect elements, and the second wiring line is connected to the first wiring line.

Abstract: A humidity detection sensor includes a lower electrode provided on a board, an upper electrode provided so as to face the lower electrode, a humidity sensing film which is formed at least between the lower electrode and the upper electrode and whose dielectric constant changes in response to humidity, and a protective film provided so as to cover the upper electrode. Each of the upper electrode and the protective film has an opening through which the humidity sensing film is partially exposed to the outside. In the opening, the humidity sensing film is provided so as to reach at least a position higher than the position of the lower surface of the protective film.

Abstract: A capacitive type humidity sensor is provided, where a sensor chip substrate, with a sensor section where electrostatic capacitance changes in accordance with humidity, a reference section where electrostatic capacitance does not change, and a plurality of pads which are output terminals of each section, and an IC substrate, which is electrically connected to the pads and which outputs the difference in capacitance between the sections as a voltage, are fixed to the same support substrate, where a protective member, which forms a sealed region surrounding the sensor section and which covers the reference section, is provided on the sensor chip substrate, the support substrate is covered by a sealing resin except for the region which is covered by the protective member, the sensor section is exposed to air at the region which is surrounded by the protective member, and the other constituent elements are covered by the sealing resin.

Abstract: A thin film magnetic head is provided, in which the amount of protrusion in the periphery of an element portion can be reduced or a local temperature increase of electrode leads of a heating element can be prevented. The thin film magnetic head includes a playback element disposed between lower and upper shield layers, a recording element laminated on the upper shield layer, a heating element which is disposed below a coil layer and which generates heat to allow the playback element to protrude toward the recording medium side through thermal expansion, and a pair of electrode leads including overlapping regions, which are in contact with rear ends of the heating element and which overlap with the upper shield layer, and heat dissipation regions. Furthermore, connection wiring portions of the pair of electrode leads are disposed in a region sandwiched between the upper shield layer and a magnetic layer.

Abstract: A capacitive type humidity sensor is provided, where a sensor chip substrate, with a sensor section where electrostatic capacitance changes in accordance with humidity, a reference section where electrostatic capacitance does not change, and a plurality of pads which are output terminals of each section, and an IC substrate, which is electrically connected to the pads and which outputs the difference in capacitance between the sections as a voltage, are fixed to the same support substrate, where a protective member, which forms a sealed region surrounding the sensor section and which covers the reference section, is provided on the sensor chip substrate, the support substrate is covered by a sealing resin except for the region which is covered by the protective member, the sensor section is exposed to air at the region which is surrounded by the protective member, and the other constituent elements are covered by the sealing resin.

Abstract: A humidity sensor package includes: a humidity sensor that is mounted on a main surface of a package substrate and that have a humidity-sensing area; a control IC that is mounted on the main surface of the package substrate; a sealing resin that seals at least an external connection portion of the humidity sensor; and a partition member that partitions a sealing area of the sealing resin and the humidity-sensing area from each other so as to expose the humidity-sensing area to an external environment. Here, a first distance in the thickness direction from the package substrate to the top surface of the partition member is smaller than a second distance in the thickness direction from the package substrate to the top surface of the sealing resin.

Abstract: A thin film magnetic head includes a recording and playback element, a lead conductor layer for feeding a power to the recording and playback element, an electrically conductive bump for conductively connecting the lead conductor layer to an electrode pad for external connection, and an insulating protective layer filling between the recording and playback element and the electrically conductive bump. A thermal deformation-preventing layer composed of a material having a thermal expansion coefficient smaller than that of the insulating protective layer is disposed in the insulating protective layer in such a way as to locate between a medium-facing surface and the electrically conductive bump without being exposed at the medium-facing surface. In the resulting thin film magnetic head, protrusion of the recording and playback element toward the recording medium side can be prevented without changing the configuration of the recording and playback element nor the forming material.

Abstract: A perpendicular magnetic recording head according to the present invention is composed of a first magnetic layer having a main magnetic pole exposed at a facing surface opposite a recording medium, a second magnetic layer adjacent to the first magnetic layer with an intermediary non-magnetic layer disposed therebetween, and a coil layer for applying a recording magnetic field to the first magnetic layer. Since the second magnetic layer has a shape including a substantially arched portion in its cross section along a height direction, it becomes possible to keep an Edge Write magnetic field in a low level and improve external magnetic field resistance.

Abstract: A thin film magnetic head is provided, in which the amount of protrusion in the periphery of an element portion can be reduced or a local temperature increase of electrode leads of a heating element can be prevented. The thin film magnetic head includes a playback element disposed between lower and upper shield layers, a recording element laminated on the upper shield layer, a heating element which is disposed below a coil layer and which generates heat to allow the playback element to protrude toward the recording medium side through thermal expansion, and a pair of electrode leads including overlapping regions, which are in contact with rear ends of the heating element and which overlap with the upper shield layer, and heat dissipation regions. Furthermore, connection wiring portions of the pair of electrode leads are disposed in a region sandwiched between the upper shield layer and a magnetic layer.

Abstract: A perpendicular magnetic recording head includes a first magnetic layer having a main magnetic pole exposed at a medium-facing surface that faces a recording medium; a second magnetic layer that faces the first magnetic layer with a nonmagnetic layer interposed therebetween; and a coil layer for applying a recording magnetic field to the first magnetic layer. The second magnetic layer includes a relatively thick edge portion, whereby the edge-write magnetic field is reduced and the external magnetic field resistance is increased.

Abstract: A thin film magnetic head is provided, in which the amount of protrusion in the periphery of an element portion can be reduced or a local temperature increase of electrode leads of a heating element can be prevented. The thin film magnetic head includes a playback element disposed between lower and upper shield layers, a recording element laminated on the upper shield layer, a heating element which is disposed below a coil layer and which generates heat to allow the playback element to protrude toward the recording medium side through thermal expansion, and a pair of electrode leads including overlapping regions, which are in contact with rear ends of the heating element and which overlap with the upper shield layer, and heat dissipation regions. Furthermore, connection wiring portions of the pair of electrode leads are disposed in a region sandwiched between the upper shield layer and a magnetic layer.

Abstract: A thin-film magnetic head is capable of securing an insulating property and minimizing the projection of a recording element section due to heat expansion. The thin-film magnetic head includes a pair of magnetic layers disposed with a predetermined gap therebetween on a surface facing a recording medium. The layers are connected to each other along an inner part in a height direction from the medium-facing surface. A spiral recording coil is disposed between the pair of magnetic layers and wound around a connecting portion of the pair of magnetic layers. The recording coil includes a dense coil portion formed with a pitch smaller than that of the inner part in the height direction so as to be closer to the medium-facing surface than the connecting portion. An organic insulating layer is locally formed to fill coil gaps of the dense coil portion, and coil gaps other than those of the dense coil portion are filled with an inorganic insulating layer.

Abstract: A thin film magnetic head includes a recording and playback element, a lead conductor layer for feeding a power to the recording and playback element, an electrically conductive bump for conductively connecting the lead conductor layer to an electrode pad for external connection, and an insulating protective layer filling between the recording and playback element and the electrically conductive bump. A thermal deformation-preventing layer composed of a material having a thermal expansion coefficient smaller than that of the insulating protective layer is disposed in the insulating protective layer in such a way as to locate between a medium-facing surface and the electrically conductive bump without being exposed at the medium-facing surface. In the resulting thin film magnetic head, protrusion of the recording and playback element toward the recording medium side can be prevented without changing the configuration of the recording and playback element nor the forming material.

Abstract: A manufacturing method of a thin film magnetic head is provided. In the manufacturing method of a thin film magnetic head, an inorganic insulating layer is formed along at least a sidewall surface of each conductor part. A gap of each conductor part is filled by an organic insulating layer. An upper surface of the conductor part, a magnetic pole portion, and a connecting layer are grinded to be planar with an organic insulating layer and an inorganic insulating layer. During an upper surface of each conductor part is grinded, the inorganic insulating layer, which is hard, suppresses a shear drop of each conductor part by grinding.

Abstract: A perpendicular magnetic recording head includes a first magnetic layer having a main magnetic pole exposed at a medium-facing surface that faces a recording medium; a second magnetic layer that faces the first magnetic layer with a nonmagnetic layer interposed therebetween; and a coil layer for applying a recording magnetic field to the first magnetic layer. The second magnetic layer includes a relatively thick edge portion, whereby the edge-write magnetic field is reduced and the external magnetic field resistance is increased.

Abstract: A perpendicular magnetic recording head according to the present invention is composed of a first magnetic layer having a main magnetic pole exposed at a facing surface opposite a recording medium, a second magnetic layer adjacent to the first magnetic layer with an intermediary non-magnetic layer disposed therebetween, and a coil layer for applying a recording magnetic field to the first magnetic layer. Since the second magnetic layer has a shape including a substantially arched portion in its cross section along a height direction, it becomes possible to keep an Edge Write magnetic field in a low level and improve external magnetic field resistance.

Abstract: A thin film magnetic head is provided, in which the amount of protrusion in the periphery of an element portion can be reduced or a local temperature increase of electrode leads of a heating element can be prevented. The thin film magnetic head includes a playback element disposed between lower and upper shield layers, a recording element laminated on the upper shield layer, a heating element which is disposed below a coil layer and which generates heat to allow the playback element to protrude toward the recording medium side through thermal expansion, and a pair of electrode leads including overlapping regions, which are in contact with rear ends of the heating element and which overlap with the upper shield layer, and heat dissipation regions. Furthermore, connection wiring portions of the pair of electrode leads are disposed in a region sandwiched between the upper shield layer and a magnetic layer.

Abstract: A thin-film magnetic head is capable of securing an insulating property and minimizing the projection of a recording element section due to heat expansion. The thin-film magnetic head includes a pair of magnetic layers disposed with a predetermined gap therebetween on a surface facing a recording medium. The layers are connected to each other along an inner part in a height direction from the medium-facing surface. A spiral recording coil is disposed between the pair of magnetic layers and wound around a connecting portion of the pair of magnetic layers. The recording coil includes a dense coil portion formed with a pitch smaller than that of the inner part in the height direction so as to be closer to the medium-facing surface than the connecting portion. An organic insulating layer is locally formed to fill coil gaps of the dense coil portion, and coil gaps other than those of the dense coil portion are filled with an inorganic insulating layer.

Abstract: Disclosed are a thin film magnetic head that has a recoding coil and a method of forming a recording coil can sufficiently achieve a cross-sectional area of the coil and reduce coil resistance. A recording coil of a thin film magnetic head is formed as follows. First, frames, which divide a coil forming area, are formed on the plating base film for forming a coil. Further, the plating base film exposed between the frames is etched, and etching rebounds the plating base film are re-attached to a frame side wall. Then, a nonmagnetic metal layer is formed by plating on the area divided by the frames. Accordingly, the recording coil that has a thickness at both end portions in a coil width direction that is larger than that of a central portion thereof is obtained.