Patents by Inventor Sumiko NOGUCHI

Sumiko NOGUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10089513
    Abstract: A wiring board for a fingerprint sensor includes an insulating board including insulating layers; outer strip electrodes disposed on the insulating layer in an uppermost layer, and side by side in a first direction; inner strip electrodes disposed on the insulating layer in a next layer contacting the insulating layer in the uppermost layer, and side by side in a second direction orthogonal to the first direction; a pad electrode disposed on the insulating layer in the uppermost layer, and on the inner strip electrodes and between the outer strip electrodes; and a via conductor extending through the insulating layer in an outermost layer between the pad electrode and the inner strip electrodes and electrically connecting the pad electrode and the inner strip electrodes to each other. The via conductor has an elliptical shape that is long in the first direction in top view.
    Type: Grant
    Filed: May 25, 2017
    Date of Patent: October 2, 2018
    Assignee: KYOCERA CORPORATION
    Inventors: Yudai Banba, Sumiko Noguchi
  • Patent number: 9886614
    Abstract: A wiring board for a fingerprint sensor includes an insulating board including a plurality of laminated insulating layers, a plurality of fingerprint reading outer strip-shaped electrodes, a plurality of fingerprint reading inner strip-shaped electrodes, and a projection electrode formed on the inner strip-shaped electrode and projecting toward a space between the outer strip-shaped electrodes, in which a horizontal distance between the projection electrode and the outer strip-shaped electrode is 5 ?m to 20 ?m, and an upper surface of the projection electrode is covered with the uppermost insulating layer by a thickness of 1 ?m to 10 ?m.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: February 6, 2018
    Assignee: KYOCERA CORPORATION
    Inventor: Sumiko Noguchi
  • Publication number: 20170344790
    Abstract: A wiring board for a fingerprint sensor includes an insulating board including insulating layers; outer strip electrodes disposed on the insulating layer in an uppermost layer, and side by side in a first direction; inner strip electrodes disposed on the insulating layer in a next layer contacting the insulating layer in the uppermost layer, and side by side in a second direction orthogonal to the first direction; a pad electrode disposed on the insulating layer in the uppermost layer, and on the inner strip electrodes and between the outer strip electrodes; and a via conductor extending through the insulating layer in an outermost layer between the pad electrode and the inner strip electrodes and electrically connecting the pad electrode and the inner strip electrodes to each other. The via conductor has an elliptical shape that is long in the first direction in top view.
    Type: Application
    Filed: May 25, 2017
    Publication date: November 30, 2017
    Applicant: KYOCERA Corporation
    Inventors: Yudai BANBA, Sumiko NOGUCHI
  • Publication number: 20170091510
    Abstract: A wiring board for a fingerprint sensor includes an insulating board including a plurality of laminated insulating layers, a plurality of fingerprint reading outer strip-shaped electrodes, a plurality of fingerprint reading inner strip-shaped electrodes, and a projection electrode formed on the inner strip-shaped electrode and projecting toward a space between the outer strip-shaped electrodes, in which a horizontal distance between the projection electrode and the outer strip-shaped electrode is 5 ?m to 20 ?m, and an upper surface of the projection electrode is covered with the uppermost insulating layer by a thickness of 1 ?m to 10 ?m.
    Type: Application
    Filed: September 21, 2016
    Publication date: March 30, 2017
    Applicant: KYOCERA Corporation
    Inventor: Sumiko NOGUCHI
  • Publication number: 20150027977
    Abstract: A manufacturing method includes a step of forming a first plating mask on a base metal layer, a step of forming a main conductor layer on the base metal layer exposed from the first plating mask, a step of forming a second plating mask on them, a step of attaching a metal plating layer to an upper surface of the main conductor layer exposed from the second plating mask, a step of removing the first and second plating masks, a step of etching away a portion of the base metal layer to which the main conductor layer is not attached, and a step of forming a solder resist layer.
    Type: Application
    Filed: July 25, 2014
    Publication date: January 29, 2015
    Applicant: KYOCERA SLC Technologies Corporation
    Inventors: Kohichi OHSUMI, Sumiko NOGUCHI