Patents by Inventor Sumiko Okubo

Sumiko Okubo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • POLYIMIDE-METAL LAMINATED BODY AND POLYIMIDE CIRCUIT BOARD
    Publication number: 20090242411
    Abstract: A process for producing a polyimide-metal laminated body includes forming a metal conductive layer on a polyimide film having a ceramic-modified or pseudoceramic-modified surface with a wet plating process which includes forming at least a ground treatment layer by electroless plating, conducting electroless metal plating and conducting electrolytic copper plating.
    Type: Application
    Filed: May 14, 2009
    Publication date: October 1, 2009
    Applicant: Ube Industries, Ltd,
    Inventors: Tadahiro Yokozawa, Hiroaki Yamaguchi, Keita Banba, Masao Okubo, Sumiko Okubo
  • Polyimide-Metal Laminated Body and Polyimide Circuit Board
    Publication number: 20080286538
    Abstract: A polyimide-metal laminated body obtained by forming a metal conductive layer on a polyimide film, which has been ceramic-modified or pseudoceramic-modified on at least the surface, by a wet plating process capable of accomplishing metal plating on ceramic. A polyimide-metal laminated body and polyimide circuit board having satisfactory cohesion in wet plating steps, maintain practical cohesion even after high temperature aging treatment, and exhibiting satisfactory electrical insulating reliability, can be obtained.
    Type: Application
    Filed: January 11, 2005
    Publication date: November 20, 2008
    Applicant: Ube Industries, Ltd
    Inventors: Tadahiro Yokozawa, Hiroaki Yamaguchi, Keita Banba, Masao Okubo, Sumiko Okubo