Abstract: A semiconductor tester device includes at least a probe having a plunger making contact with a semiconductor device at one end and being slanted at the other end, and an elastic member able to shrink when pressed with the plunger; and a print substrate with wiring formed to test the semiconductor device; wherein the print substrate has at least a hole to put the probe in, and the hole has an electrically conductive wall to make contact with a side end of the plunger when the elastic member is pressed at the slanted end of the plunger.

Abstract: What is disclosed is a semiconductor tester device comprising at least a probe having a plunger making contact with a semiconductor device at one end and being slanted at other end, and an elastic member able to shrink when pressed with said plunger; and a print substrate with wiring formed to test said semiconductor device; wherein said print substrate has at least a hole to put said probe in, and said hole has electrically conductive wall to make contact with a side end of said plunger when said elastic member is pressed at said slanted end of said plunger.

Abstract: A semiconductor socket is provided which includes a stage used for positioning of a semiconductor device. The semiconductor device has a plurality of external input/output terminals mounted at a bottom thereof. The semiconductor socket also has a plurality of probes used to come into contact with the plurality of external input/output terminals when the semiconductor device has been positioned, by moving the stage towards the probes. The semiconductor socket has a socket base in which a major portion of each of the probes is housed, and from which a minor portion of each of the probes projects from an upper face thereof. The upper face of the socket base faces the stage. The probes are disposed in a manner so as to be inserted in or pulled out from the upper face. The semiconductor socket has a probe retaining cap removably mounted to the upper face of the socket base, for preventing the probes from being removed. A method of replacing the probes is also proposed.

Abstract: A probe used for testing on a semiconductor package is provided which is capable of reducing scratching of a solder ball, sticking of solder to a contact terminal, and damage to the contact terminal. A diameter of an end portion of the contact terminal of a probe is set to be almost the same as that of a solder ball. The end portion is provided with a semispherical concave portion to be contacted with the solder ball and a plurality of guiding grooves formed from a center of the concave portion in a direction of a diameter and used to guide solder separated from the solder ball and stuck to the concave portion.

Abstract: A semiconductor socket is provided which is capable of saving time and efforts required for replacement of a probe and of reducing time required for replacement of the probe. The semiconductor socket of the present invention has a plurality of external input and output terminals at its bottom and is provided with a stage used for positioning, a probe used to come into contact with the external input and output terminals in the semiconductor device by approaching of the stage, a socket base housing the probe in a manner so as to be inserted and pulled out on a side of a face of the socket base being opposite to the stage, and a falling-off preventing portion being placed in a manner to be removable on the face of the socket base being opposite to the stage to prevent the probes from falling off.

Abstract: A probe used for testing on a semiconductor package is provided which is capable of reducing scratching of a solder ball, sticking of solder to a contact terminal, and damage to the contact terminal. A diameter of an end portion of the contact terminal of a probe is set to be almost the same as that of a solder ball. The end portion is provided with a semispherical concave portion to be contacted with the solder ball and a plurality of guiding grooves formed from a center of the concave portion in a direction of a diameter and used to guide solder separated from the solder ball and stuck to the concave portion.